Patents by Inventor Tai-Shing Wei

Tai-Shing Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two-stage fast debinding of injection molding powder compacts
    Patent number: 5028367
    Abstract: A process for making molded objects utilizes powder injection molding techniques. Powder is mixed with a binder and then cast into a compact. The compact is then subjected to a first debinding step in the presence of a wicking agent under gentle heating. In this first stage, at least 40% of the binder is removed. Additional binder is then removed in a subsequent higher temperature stage to produce a compact which is free of binder and free of cracks.
    Type: Grant
    Filed: December 8, 1989
    Date of Patent: July 2, 1991
    Assignee: Rensselaer Polytechnic Institute
    Inventors: Tai-Shing Wei, Randall M. German