Patents by Inventor Tai Uruji

Tai Uruji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6803414
    Abstract: A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2=CR2CO−(R1O)n−OCOCR2=CH2  (1) wh
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: October 12, 2004
    Assignee: Mitsubishi Fuso Truck and Bus Corporation
    Inventors: Takeshi Honjo, Harushige Yamamura, Tai Uruji, Masayoshi Yamaguchi, Yusuke Koizumi, Hiroshi Hayashi
  • Publication number: 20020161138
    Abstract: A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by:
    Type: Application
    Filed: April 26, 2002
    Publication date: October 31, 2002
    Applicant: MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA
    Inventors: Takeshi Honjo, Harushige Yamamura, Tai Uruji, Masayoshi Yamaguchi, Yusuke Koizumi, Hiroshi Hayashi