Patents by Inventor Tai Wai (David) Pun

Tai Wai (David) Pun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera module with molded tape flip chip imager mount and method of manufacture
    Patent number: 8430579
    Abstract: A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: April 30, 2013
    Assignee: Flextronics AP, LLC
    Inventors: Samuel Waising Tam, Tai Wai (David) Pun, Tak Shing (Dick) Pang
  • SOLAR CELL MODULE ON MOLDED LEAD-FRAME AND METHODS OF MANUFACTURE
    Publication number: 20130032203
    Abstract: A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.
    Type: Application
    Filed: July 3, 2012
    Publication date: February 7, 2013
    Applicant: FLEXTRONICS INTERNATIONAL USA, INC.
    Inventors: Samuel Waising Tam, Tai Wai (David) Pun, Tak Shing (Dick) Pang
  • Camera module with molded tape flip chip imager mount and method of manufacture
    Publication number: 20110194023
    Abstract: A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted.
    Type: Application
    Filed: January 11, 2011
    Publication date: August 11, 2011
    Inventors: Samuel Waising Tam, Tai Wai (David) Pun, Tak Shing (Dick) Pang