Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A device for synchronously sharing files includes a processor and a database. The processor is used for utilizing a synchronous data folder to record a newest modified version of a file generated by a user operating the file, and synchronously transmitting the newest modified version of the file to other client devices. The database is used for storing historical modified versions of the file generated by the user operating the file and the newest modified version of the file.