Abstract: A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of a catalyst in a reactor at a temperature of 90° C. to 220° C., characterized in that, in the course of the reaction, PPE needs not to be cleaved into small molecules and in stead, can mix and react directly with the epoxy resin to thereby produce a high speed transmitting dielectric material. The process of the invention can reduce greatly the synthetic reaction time, and is applicable in the production of the material useful in printed circuit board for wireless communication, base station and the like.

Abstract: A resin matrix composite with aluminum for lubrication in drilling comprises a resin matrix composite and an aluminum foil. The resin matrix composite is consisting of at least three of the following materials: PEG (polyethylene glycol), polyvinyl alcohol (PVA), polyoxyethylene sorbitan laurate, coconut alcohol polyethylene glycol ether, polyethylene glycol nonyl ether, castor oil polyethylene glycol ether, polyoxypropylene polyoxyethylene ether, amylum, glycerol, inorganic filler, and solvents. By one of roller coating, spin coating, film coating, static spray coating, or halftone printing, the resin matrix composite can bind the aluminum foil to form a resin matrix composite with aluminum foil for applying on PCB (printed circuit board) to function as lubricating in drilling.

Abstract: A high thermal conductive halogen-free phosphorus-free retardant resin composition for printed circuit board materials is composed of (1) an epoxy resin having bifunctional or polyfunctional groups, in an amount of 10 to 50% by weight based on the total composition; (2) a retardant, having amide, imide and hydroxy functional groups, in an amount of 10 to 30% by weight based on the total composition; (3) an inorganic salts, in an amount of 10 to 50% by weight based on the total composition; and (4) a high thermal conductive metal powder, in an amount of 10 to 30% by weight based on the total composition. The present invention is free from phosphorus-containing retardant, and hence does not pollute the environment due to hydrolysis and further exhibits a characteristic of high thermal conductive that makes the operation of the electronic devices more stable.

Abstract: A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of a catalyst in a reactor at a temperature of 90° C. to 220° C., characterized in that, in the course of the reaction, PPE needs not to be cleaved into small molecules and in stead, can mix and react directly with the epoxy resin to thereby produce a high speed transmitting dielectric material. The process of the invention can reduce greatly the synthetic reaction time, and is applicable in the production of the material useful in printed circuit board for wireless communication, base station and the like.