Abstract: A liquid-cooling heat dissipation assembly includes a liquid cooling array module with an upper cover and a lower cover on top and bottom sides of the liquid cooling array module, respectively, a liquid driving module assembled to the upper cover of the liquid cooling array module, a cooling plate module assembled with the lower cover of the liquid cooling array module, a liquid passageway defined through the liquid cooling array module and the cooling plate module. The liquid cooling array module, the liquid driving module and the cooling plate module are integrated into assembly and a through runner keeps the cooling liquid to flow continuously. The heat exchange cycle can be speeded up and the heat dissipation efficiency can be enhanced.