Abstract: An integrated circuit structure includes a first conductive plate, a second conductive plate, a plurality of conductive lines, and a plurality of conductive vias. The first conductive plate is disposed in a first layer on a semiconductor substrate. The second conductive plate is disposed in a second layer on the semiconductor substrate. The plurality of conductive lines are disposed in the first layer for surrounding the first conductive plate. The plurality of conductive vias are arranged to couple the plurality of conductive lines to the second conductive plate. The second layer is different from the first layer, and the first conductive plate is physically separated from the second conductive plate, the plurality of conductive lines, and the plurality of conductive vias.

Abstract: An electronic design flow generates an electronic architectural design layout for analog circuitry from a schematic diagram. The electronic design flow assigns analog circuits of the schematic diagram to various categories of analog circuits. The electronic design flow places various analog standard cells corresponding to these categories of analog circuits into analog placement sites assigned to the analog circuits. These analog standard cells have a uniform cell height which allows these analog standard cells to be readily connected or merged to digital standard cells which decreases the area of the electronic architectural design layout. This uniformity in height between these analog standard cells additionally provides a more reliable yield when compared to non-uniform analog standard cells.

Abstract: An integrated circuit structure includes: a first conductive plate disposed in a first layer on a semiconductor substrate; a second conductive plate disposed in a second layer on the semiconductor substrate; a plurality of conductive lines disposed in the first layer, for surrounding the first conductive plate; and a plurality of conductive vias arranged to couple the plurality of conductive lines to the second conductive plate; wherein the second layer is different from the first layer, and the first conductive plate is physically separated from the second conductive plate, the plurality of conductive lines, and the plurality of conductive vias.

Abstract: An integrated circuit structure includes: a first conductive plate disposed in a first layer on a semiconductor substrate; a second conductive plate disposed in a second layer on the semiconductor substrate; a plurality of conductive lines disposed in the first layer, for surrounding the first conductive plate; and a plurality of conductive vias arranged to couple the plurality of conductive lines to the second conductive plate; wherein the second layer is different from the first layer, and the first conductive plate is physically separated from the second conductive plate, the plurality of conductive lines, and the plurality of conductive vias.

Abstract: Capacitor structures with low capacitances are disclosed. In one example, a capacitor structure is disclosed. The capacitor structure includes a first electrode and a second electrode. The first electrode comprises a first metal finger. The second electrode comprises a second metal finger and a third metal finger that are parallel to each other and to the first metal finger. The first metal finger is formed between the second metal finger and the third metal finger. The capacitor structure further includes: a fourth metal finger formed as a dummy metal finger between the first metal finger and the second metal finger, and a fifth metal finger formed as a dummy metal finger between the first metal finger and the third metal finger. The fourth metal finger and the fifth metal finger are parallel to the first metal finger.

Abstract: A needle-free connector including a guiding base, a connecting base, a valve member, and a seal member is provided. The guiding base has a conduit, and the conduit extends downward along an axial direction. The connecting base is disposed on the guiding base and has a screw portion and a passage running through the screw portion. A chamber is formed between the guiding base and the connecting base, and the conduit and the passage respectively communicate with the chamber along the axial direction. The valve member is disposed between the guiding base and the connecting base, and is movably located in the chamber. The seal member is disposed at an end of the valve member far away from the conduit, and the seal member and the valve member are adapted to be connected into a whole in a manufacturing process.

Abstract: Capacitor structures with low capacitances are disclosed. In one example, a capacitor structure is disclosed. The capacitor structure includes a first electrode and a second electrode. The first electrode comprises a first metal finger. The second electrode comprises a second metal finger and a third metal finger that are parallel to each other and to the first metal finger. The first metal finger is formed between the second metal finger and the third metal finger. The capacitor structure further includes: a fourth metal finger formed as a dummy metal finger between the first metal finger and the second metal finger, and a fifth metal finger formed as a dummy metal finger between the first metal finger and the third metal finger. The fourth metal finger and the fifth metal finger are parallel to the first metal finger.

Abstract: Capacitor structures with low capacitances are disclosed. In one example, a capacitor structure is disclosed. The capacitor structure includes a first electrode and a second electrode. The first electrode comprises a first metal finger. The second electrode comprises a second metal finger and a third metal finger that are parallel to each other and to the first metal finger. The first metal finger is formed between the second metal finger and the third metal finger. The capacitor structure further includes: a fourth metal finger formed as a dummy metal finger between the first metal finger and the second metal finger, and a fifth metal finger formed as a dummy metal finger between the first metal finger and the third metal finger. The fourth metal finger and the fifth metal finger are parallel to the first metal finger.