Patents by Inventor Tai-Ying Lee

Tai-Ying Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure with a retarding structure and method of making same
    Patent number: 7064452
    Abstract: An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic device in the conventional arts. The present invention provides a package structure with a retarding structure to efficiently avoid the problem. The package structure comprises an electronic device, a substrate, a retarding structure, and an encapsulant. The substrate has conductive contacts disposed on an upper surface. The electronic device has an active region and conductive pads disposed on a first surface. The electronic device is electrically coupled to the substrate by conductive bumps between the conductive contacts and the corresponding conductive pads. The encapsulant is formed around a periphery of the electronic device. The retarding structure is disposed outside the active region on the first surface of the electronic device for avoiding the encapsulant contacting the active region of the electronic device.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: June 20, 2006
    Assignee: Tai-Saw Technology Co., Ltd.
    Inventors: Chen-Tung Huang, Jim-Tren Tu, Hsang-Hsing You, Huang-An Lu, Ming-Lan Chang, Tai-Ying Lee
  • Package structure with a retarding structure and method of making same
    Publication number: 20050093178
    Abstract: An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic device in the conventional arts. The present invention provides a package structure with a retarding structure to efficiently avoid the problem. The package structure comprises an electronic device, a substrate, a retarding structure, and an encapsulant. The substrate has conductive contacts disposed on an upper surface. The electronic device has an active region and conductive pads disposed on a first surface. The electronic device is electrically coupled to the substrate by conductive bumps between the conductive contacts and the corresponding conductive pads. The encapsulant is formed around a periphery of the electronic device. The retarding structure is disposed outside the active region on the first surface of the electronic device for avoiding the encapsulant contacting the active region of the electronic device.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 5, 2005
    Inventors: Chen-Tung Huang, Jim-Tren Tu, Hsang-Hsing You, Huang-An Lu, Ming-Lan Chang, Tai-Ying Lee