Abstract: An immersion cooling system includes a work tank, a chip device, a microchannel device, a first communication pipeline, and a first heat exchange device. The work tank includes a fluid section. The chip device is in the fluid section and has an inlet and an outlet. The chip device includes a motherboard, a chip, and a cover. The motherboard has a main surface substantially parallel to a vertical line. The cover is on the motherboard. The chip is between the cover and the motherboard. The microchannel device is in the chip device. Two ends of the microchannel device are respectively in communication with the inlet and the outlet. The first communication pipeline and the first heat exchange device are in the fluid section. Two ends of the first communication pipeline are respectively in communication with the outlet and the first heat exchange device.

Abstract: A piece of immersion liquid cooling equipment, which is adapted for an electronic device, includes a tank, a condenser, a cold plate, and a first pipe. The tank accommodates a first fluid, and the electronic device is immersed in the first fluid in the form of a liquid. The condenser is disposed in the tank and located above the first fluid in the form of a liquid. The cold plate is disposed in the tank and is in thermal contact with at least one high power commodity of the electronic device. The first pipe is disposed and extends between an exterior and an interior of the tank. The first pipe communicates with the condenser and the cold plate. The first pipe is configured to receive a second fluid to flow through the condenser and the cold plate. A heat dissipation method for an electronic device.

Abstract: An immersion cooling system including a cooling tank, an immersion unit, and a baffle assembly is provided. The cooling tank has a receiving portion. The immersion unit is in the receiving portion and includes a boiler plate. The baffle assembly divides the receiving portion into an inner upper portion, an inner lower portion, and a peripheral portion. The boiler plate is in the inner lower portion, and a width of the inner upper portion is less than or equal to a width of the boiler plate.

Abstract: An immersion cooling system including a cooling tank, an immersion unit, a plurality of piezoelectric units, and a piezoelectric driver is provided. The cooling tank has a receiving portion. The immersion unit is in the receiving portion and the immersion unit includes a boiler plate. One or more channels are between the piezoelectric units, and the at least one channel is in communication with the boiler plate. The piezoelectric driver is for driving each of the piezoelectric units to generate a deformation.

Abstract: An immersion cooling system includes a cooling tank, an immersion unit, a first disturbing element, and a first maintaining element. The cooling tank has a receiving portion. The immersion unit is in the receiving portion, and the immersion unit includes a boiler plate. The first disturbing element has a first convex surface. The first maintaining element maintains the first disturbing element to allow a convex direction of the first convex surface towards the boiler plate, and a first predetermined distance is between the first convex surface and the boiler plate.

Abstract: A flow dividing device including a box body and a baffle set is provided. The box body includes a chamber, an inflow port, and an outflow port. The baffle set is located in the chamber and divides the chamber into a plurality of guide channels, and two ends of the guide channel communicate with the inflow port and the outflow port respectively. After flowing into the flow dividing device, the condensate fluid can guide different liquids in the condensate fluid to separate from each other. An immersion cooling system including the flow dividing device and a fluid separation method of the immersion cooling system are also provided.

Abstract: A fan includes an impeller, a drive device, and a frame structure. The driving device drives the impeller to rotate, and the frame structure accommodates the driving device. The frame structure includes a frame body, a first frame, a second frame, a base and a plurality of supports. The frame body has first engaging portions and second engaging portions, which are disposed annularly at the upper end and the lower end of the frame body, respectively. The first frame is mounted on the frame body and disposed corresponding to the first engaging portions. The second frame is mounted on the frame body and disposed corresponding to the second engaging portions. The base is disposed within the frame body and located adjacent to the second frame. The supports are disposed around the base. The material of the frame body is different from that of the first and second frames.

Abstract: A fan includes an impeller, a drive device, and a frame structure. The driving device drives the impeller to rotate, and the frame structure accommodates the driving device. The frame structure includes a frame body, a first frame, a second frame, a base and a plurality of supports. The frame body has first engaging portions and second engaging portions, which are disposed annularly at the upper end and the lower end of the frame body, respectively. The first frame is mounted on the frame body and disposed corresponding to the first engaging portions. The second frame is mounted on the frame body and disposed corresponding to the second engaging portions. The base is disposed within the frame body and located adjacent to the second frame. The supports are disposed around the base. The material of the frame body is different from that of the first and second frames.