Patents by Inventor Tai Yong LEE

Tai Yong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and methods of manufacturing semiconductor devices
    Patent number: 12261145
    Abstract: In one example, a semiconductor device comprises an electronic component comprising a component face side, a component base side, a component lateral side connecting the component face side to the component base side, and a component port adjacent to the component face side, wherein the component port comprises a component port face. A clip structure comprises a first clip pad, a second clip pad, a first clip leg connecting the first clip pad to the second clip pad, and a first clip face. An encapsulant covers portions of the electronic component and the clip structure. The encapsulant comprises an encapsulant face, the first clip pad is coupled to the electronic component, and the component port face and the first clip face are exposed from the encapsulant face. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: March 25, 2025
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Yeon Ryu, Jae Beom Shim, Tai Yong Lee, Byong Jin Kim
  • SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
    Publication number: 20220262762
    Abstract: In one example, a semiconductor device comprises an electronic component comprising a component face side, a component base side, a component lateral side connecting the component face side to the component base side, and a component port adjacent to the component face side, wherein the component port comprises a component port face. A clip structure comprises a first clip pad, a second clip pad, a first clip leg connecting the first clip pad to the second clip pad, and a first clip face. An encapsulant covers portions of the electronic component and the clip structure. The encapsulant comprises an encapsulant face, the first clip pad is coupled to the electronic component, and the component port face and the first clip face are exposed from the encapsulant face. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: May 6, 2022
    Publication date: August 18, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Yeon RYU, Jae Beom SHIM, Tai Yong LEE, Byong Jin KIM