Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.

Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.

Abstract: A method for timing optimization is disclosed. The method includes obtaining information on timing of paths in a chip, the information including a mean of slacks and a sigma of slacks of each of the paths; determining a sigma margin (SM) value each of the paths, the SM value being obtained by dividing the mean by the sigma; dividing the paths into groups based on SM values, an SM value of a path in one of the groups being different from that of a path in another one of the groups; and determining a yield requirement that indicates the maximum number of paths allowable in each group in order to achieve a predetermined yield.

Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.

Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.

Abstract: A method for timing optimization is disclosed. The method includes obtaining information on timing of paths in a chip, the information including a mean of slacks and a sigma of slacks of each of the paths; determining a sigma margin (SM) value each of the paths, the SM value being obtained by dividing the mean by the sigma; dividing the paths into groups based on SM values, an SM value of a path in one of the groups being different from that of a path in another one of the groups; and determining a yield requirement that indicates the maximum number of paths allowable in each group in order to achieve a predetermined yield.

Abstract: A method for timing optimization is disclosed. The method includes obtaining information on timing of paths in a chip, wherein the information includes a mean of slacks and a sigma of slacks of each of the paths, determining a sigma margin (SM) value each of the paths, the SM value being obtained by dividing the mean by the sigma, and determining that a first path of the paths is more critical than a second path of the paths, an SM value of the first path being smaller than that of the second path.

Abstract: A method includes identifying the first path as a target path, wherein an operation speed of the target path is adjusted from the corner case; deriving and outputting first values from the lookup table by indexing the lookup table with a threshold voltage associated with the first path identified as the target path as the main threshold voltage and a threshold voltage associated with the second path as the slave threshold voltage; calculating a first extra time based on the first values and first cell delays associated with the first path.

Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.

Abstract: A method performed by a processor, the method including preparing a netlist describing a first circuit including an active component; obtaining an original electrical characteristic of the active component, wherein an electrical characteristic of the active component is the original electrical characteristic in a condition that the active component has not been operated; obtaining an aged data describing a variation in the original electrical characteristic, wherein the variation is caused by operating the first circuit under a first mode and a second mode different from the first mode during a time period; providing a simulation result by simulating, based on an aged electrical characteristic, the first circuit operating under the first mode and the second mode during the time period, wherein the aged electrical characteristic is a combination of the original electrical characteristic and the variation.

Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.

Abstract: A method for timing optimization is disclosed. The method includes obtaining information on timing of paths in a chip, wherein the information includes a mean of slacks and a sigma of slacks of each of the paths, determining a sigma margin (SM) value each of the paths, the SM value being obtained by dividing the mean by the sigma, and determining that a first path of the paths is more critical than a second path of the paths, an SM value of the first path being smaller than that of the second path.

Abstract: A method includes identifying the first path as a target path, wherein an operation speed of the target path is adjusted from the corner case; deriving and outputting first values from the lookup table by indexing the lookup table with a threshold voltage associated with the first path identified as the target path as the main threshold voltage and a threshold voltage associated with the second path as the slave threshold voltage; calculating a first extra time based on the first values and first cell delays associated with the first path.

Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.

Abstract: A method performed by a processor, the method including preparing a netlist describing a first circuit including an active component, obtaining an original electrical characteristic of the active component, wherein an electrical characteristic of the active component is the original electrical characteristic in a condition that the active component has not been operated; obtaining an aged data describing a variation in the original electrical characteristic, wherein the variation is caused by operating the first circuit under a first mode and a second mode different from the first mode during a time period; providing a simulation result by simulating, based on an aged electrical characteristic, the first circuit operating under the first mode and the second mode during the time period, wherein the aged electrical characteristic is a combination of the original electrical characteristic and the variation.