Patents by Inventor Tai-Yuan Tsai

Tai-Yuan Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178102
    Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.
    Type: Application
    Filed: April 21, 2023
    Publication date: May 30, 2024
    Inventors: Chun-Ti LU, Hao-Yi TSAI, Chiahung LIU, Ken-Yu CHANG, Tzuan-Horng LIU, Chih-Hao CHANG, Bo-Jiun LIN, Shih-Wei CHEN, Pei-Rong NI, Hsin-Wei HUANG, Zheng GangTsai, Tai-You LIU, Steve SHIH, Yu-Ting HUANG, Steven SONG, Yu-Ching WANG, Tsung-Yuan YU, Hung-Yi KUO, CHung-Shi LIU, Tsung-Hsien CHIANG, Ming Hung TSENG, Yen-Liang LIN, Tzu-Sung HUANG, Chun-Chih CHUANG
  • Patent number: 11967570
    Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: April 23, 2024
    Assignee: MediaTek Inc.
    Inventors: Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen, Chung-Fa Lee
  • Patent number: 6511083
    Abstract: A steering device for a skateboard has a front seat mounted with a pair of front rollers. The front seat has an upwardly extending cylinder. A receiving hole is defined in a top surface of the cylinder. The receiving hole receives a sphere inside. The sphere is connected to a shaft. The steering device enables the skateboard to be turned agilely, and is able to be adjusted to suit riders of different sizes.
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: January 28, 2003
    Inventor: Tai-Yuan Tsai
  • Publication number: 20030011159
    Abstract: A steering device for a skateboard has a front seat mounted with a pair of front rollers. The front seat has an upwardly extending cylinder. A receiving hole is defined in a top surface of the cylinder. The receiving hole receives a sphere inside. The sphere is connected to a shaft. The steering device enables the skateboard to be turned agilely, and is able to be adjusted to suit riders of different sizes.
    Type: Application
    Filed: July 10, 2001
    Publication date: January 16, 2003
    Inventor: Tai-Yuan Tsai
  • Publication number: 20030012929
    Abstract: A shock absorbing and slip resistant pad made of a foam material that has a resilient texture and a sufficient depth to absorb shock. The pad has a slip resistant surface and an engaging surface. The slip-resistant surface has sand evenly distributed therealong to form a rough surface for slip resistance. The engaging surface has an adhesive substance applied thereon to adhere the pad to the skateboard. A pattern is stenciled and color printed on the slip resistant surface for a decorative or a commercial effect.
    Type: Application
    Filed: July 16, 2001
    Publication date: January 16, 2003
    Inventor: Tai-Yuan Tsai