Abstract: A resonator device includes: a resonator; an integrated circuit device configured to oscillate the resonator and to generate an oscillation signal; a container accommodating the resonator and the integrated circuit device; and a metal bump bonded to the integrated circuit device and electrically coupling the integrated circuit device and the container. The integrated circuit device includes a pad bonded to the metal bump, and a circuit disposed at a position overlapping the metal bump in a plan view of the pad, and W1/W2?1.08, where W1 represents a width of the pad, and W2 represents a width of the metal bump.