Patents by Inventor Taichi Hamada

Taichi Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136239
    Abstract: Provided is a curable composition for inkjet and air cavity formation, the curable composition capable of forming a cured product layer having a high aspect ratio and capable of enhancing adhesiveness and sealability. A curable composition for inkjet and air cavity formation according to the present invention contains a photocurable compound having a (meth)acryloyl group or a vinyl group and having no cyclic ether group, and a thermosetting compound having no (meth)acryloyl group and having a cyclic ether group, in which a content of the thermosetting compound in 100 wt % of the curable composition for inkjet and air cavity formation is 5 wt % or more, and when a B-staged product is obtained by irradiating the curable composition for inkjet and air cavity formation with light having a wavelength of 365 nm at an illuminance of 2000 mW/cm2, a viscosity at 40° C. of the B-staged product is 2.5×102 Pa·s or more and 3.0×10? Pa·s or less.
    Type: Application
    Filed: April 13, 2022
    Publication date: April 25, 2024
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yusuke FUJITA, Takashi WATANABE, Mitsuru TANIKAWA, Yoshifumi SUGISAWA, Tomoya TANAKA, Takanori INOUE, Taichi HAMADA
  • Publication number: 20240124729
    Abstract: Provided is an ink-jet adhesive that can suppress adhesion of an adhesive component to an unintended region of a transparent member when the transparent member is used as a member to be bonded. The ink-jet adhesive according to the present invention contains a photocurable compound having a (meth) acryloyl group or a vinyl group and having no cyclic ether group, and a photopolymerization initiator, contains or does not contain a thermosetting compound having no (meth) acryloyl group and having a cyclic ether group, and a content of the thermosetting compound is 5 wt % or less when the ink-jet adhesive contains the thermosetting compound.
    Type: Application
    Filed: March 25, 2022
    Publication date: April 18, 2024
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yoshifumi SUGISAWA, Takashi WATANABE, Mitsuru TANIKAWA, Yusuke FUJITA, Taichi HAMADA, Tomoya TANAKA
  • Patent number: 10632491
    Abstract: A liquid ejection device (1) comprising: a first tank (2) for retaining a liquid composition; a head (3) for ejecting the liquid composition; a first heater (4) for heating the liquid composition; a first channel (5); a second heater (6) for heating the liquid composition passing through the first channel (5) at a heating temperature higher than that of the first heater (4); a second channel (7); a second pump (8); and a first pump (9), wherein the temperature difference between the heating temperature of the second heater (6) and the heating temperature of the first heater (4) is 65° C. or less.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: April 28, 2020
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Michihisa Ueda, Masumi Honda, Naoyuki Morimoto, Takanori Inoue, Takashi Watanabe, Taichi Hamada, Ryosuke Takahashi
  • Patent number: 10435533
    Abstract: Provided is a resin composite material having a small number of voids and excellent tenacity. The resin composite material may be one obtained by mixing a carbon material having a graphene structure and having a content of less than 1 weight % of a volatile component volatilizable at 200° C. and a thermoplastic resin. The resin composite material may be a resin composite material including a carbon material having a graphene structure and a thermoplastic resin, the resin composite material containing 5 parts by weight or more of the carbon material per 100 parts by weight of the thermoplastic resin and having a breaking strain of 50% or more as measured according to JIS K 7161.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: October 8, 2019
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kazuhiro Sawa, Taichi Hamada, Daisuke Mukohata, Nobuhiko Inui
  • Publication number: 20170009045
    Abstract: Provided is a resin composite material having a small number of voids and excellent tenacity. The resin composite material may be one obtained by mixing a carbon material having a graphene structure and having a content of less than 1 weight % of a volatile component volatilizable at 200° C. and a thermoplastic resin. The resin composite material may be a resin composite material including a carbon material having a graphene structure and a thermoplastic resin, the resin composite material containing 5 parts by weight or more of the carbon material per 100 parts by weight of the thermoplastic resin and having a breaking strain of 50% or more as measured according to JIS K 7161.
    Type: Application
    Filed: February 20, 2015
    Publication date: January 12, 2017
    Inventors: Kazuhiro SAWA, Taichi HAMADA, Daisuke MUKOHATA, Nobuhiko INUI
  • Publication number: 20160368015
    Abstract: There is provided a liquid ejection device capable of applying a high quality curable composition stably and efficiently by heating the curable composition to a temperature at which the curable composition can be ejected from a head, in a short time without heating the curable composition rapidly and excessively.
    Type: Application
    Filed: September 18, 2015
    Publication date: December 22, 2016
    Inventors: Michihisa Ueda, Masumi Honda, Naoyuki Morimoto, Takanori Inoue, Takashi Watanabe, Taichi Hamada, Ryosuke Takahashi