Patents by Inventor Taichi KITAGAWA
Taichi KITAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132648Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.Type: ApplicationFiled: December 29, 2023Publication date: April 25, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Nobuaki MATSUMOTO, Kohei OTAKE, Taichi KITAGAWA, Tsuyoshi MATSUDA, Toshiyuki OZAI
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Publication number: 20240076434Abstract: Provided is an oxygen-curable silicone composition that cures at room temperature, the reaction being triggered by oxygen in the atmosphere, without requiring heat or UV irradiation at the time of use, and exhibits good mechanical strength after curing. A composition including (A) an organopolysiloxane (1) (R1 represents an alkyl group or the like but has at least one acryloyloxy group or the like in the molecule, R2 represents an oxygen atom or the like, and m and n represent numbers that satisfy 1?m+n 1,000.), (B) a silicone resin including (a) a unit of formula (2), (b) an R13SiO1/2 unit, and (c) an SiO4/2 unit, the molar ratio of [(a)+(b)]/(c) being 0.4-1.2, and the silicone resin having 0.005 mol/100 g or more Si-OH groups (R1 and R2 are the same as above. R3 represents an acryloyloxyalkyl group or the like, p represents 0-10, and 1 represents a number that satisfies 1-3.), and (C) an organoborane complex (3) (R4-R6 represent hydrocarbon groups.).Type: ApplicationFiled: August 13, 2020Publication date: March 7, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Taichi KITAGAWA, Nobuaki MATSUMOTO, Toshiyuki OZAI, Masayuki IKENO
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Publication number: 20240074327Abstract: According to one embodiment, a magnetic memory device includes: a first interconnect; a second interconnect; a first switching element provided on the first interconnect; a second switching element provided on the second interconnect; a first insulating layer provided surrounding the first switching element; a second insulating layer surrounding the second switching element and not being in contact with the first insulating layer; a first conductor provided on the first switching element and the first insulating layer; a second conductor provided on the second switching element and the second insulating layer; a first magnetoresistive effect element provided on the first conductor; and a second magnetoresistive effect element provided on the second conductor.Type: ApplicationFiled: June 12, 2023Publication date: February 29, 2024Applicant: Kioxia CorporationInventors: Taichi IGARASHI, Yuichi ITO, Eiji KITAGAWA, Masayoshi IWAYAMA
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Publication number: 20240072203Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Publication number: 20240063339Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: October 26, 2023Publication date: February 22, 2024Applicants: SamiLEDs Corporation, SHIN-ETSU CHEMICAL. CO., LTD.Inventors: Chen-Fu Chu, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEI OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI oZAI, SHUHEI UEDA
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Patent number: 11862754Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: GrantFiled: May 10, 2022Date of Patent: January 2, 2024Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Patent number: 11862755Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: GrantFiled: July 20, 2022Date of Patent: January 2, 2024Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Patent number: 11827799Abstract: Provided is an ultraviolet curable silicone composition capable of being ejected via inkjet ejection. The composition of the invention is an ultraviolet curable silicone composition comprising: (A) an organopolysiloxane represented by the following general formula (1) wherein each R1 independently represents a group selected from a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, an acryloyl group, a methacryloyl group, an alkyl acrylate group and an alkyl methacrylate group, while the component (A) has per molecule at least two groups selected from an acryloyl group, a methacryloyl group, an alkyl acrylate group and an alkyl methacrylate group; n represents a number satisfying 10?n?1,000; (B) a monofunctional (meth)acrylate compound having no siloxane structure; and/or (C) a multifunctional (meth)acrylate compound having no siloxane structure; and (D) a photopolymerization initiator.Type: GrantFiled: December 30, 2021Date of Patent: November 28, 2023Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Nobuaki Matsumoto, Taichi Kitagawa, Atsushi Yaginuma, Masaaki Shirota
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ADDITION-CURING SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
Publication number: 20230348758Abstract: An addition-curing silicone pressure-sensitive adhesive composition which contains no noncrosslinking organopolysiloxane resin and comprises 100 parts by mass of (A) an organopolysiloxane having, in the molecule, at least two alkenyl groups which combine with silicon atoms and having a 25° C. viscosity of 0.01-1,000 Pa·s, 5-500 parts by mass of (B) an organopolysiloxane resin having an alkenyl group, (C) an organohydrogenpolysiloxane having, in the molecule, two or more silicon-atom-bonded hydrogen atoms, the amount of (C) being such that the amount of the silicon-atom-bonded hydrogen atoms contained in the (C) component is 0.1-5.0 times by mole the total amount of all the silicon-atom-bonded alkenyl groups contained in the composition, and (D) a catalyst based on a platinum-group metal. The addition-curing silicone pressure-sensitive adhesive composition has excellent tackiness as a temporary fixer and gives cured objects with very little component migration.Type: ApplicationFiled: December 10, 2020Publication date: November 2, 2023Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kohei OTAKE, Taichi KITAGAWA, Nobuaki MATSUMOTO, Toshiyuki OZAI -
Publication number: 20230018855Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate [30], and forming a plurality of die sized semiconductor structures [32] on the substrate [30]. The method also includes the steps of providing a receiving plate [42] having an elastomeric polymer layer [44], placing the substrate [30] and the receiving plate [42] in close proximity with a gap [101] therebetween, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate [30] to the semiconductor layer [50] at an interface with the substrate [30] to lift off the semiconductor structures [32] through the gap [101] onto the elastomeric polymer layer [44]. During the laser lift-off (LLO) process the elastomeric polymer layer [44] functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures [32] in place on the receiving plate [42].Type: ApplicationFiled: August 3, 2022Publication date: January 19, 2023Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.Inventors: CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEI OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAI, SHUHEI UEDA, JUNYA ISHIZAKI
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Patent number: 11502312Abstract: A resin frame member is produced by using a method of producing a resin frame member for a fuel cell. An inner peripheral end of the resin frame member includes an inclined surface formed over the entire periphery thereof. The inclined surface is inclined inward from one surface of the resin frame member toward the other surface of the resin frame member. The width of the inclined surface is gradually reduced from the center toward both ends of each side part of the inner peripheral end in a direction in which the side part of the inner peripheral end extends.Type: GrantFiled: March 17, 2021Date of Patent: November 15, 2022Assignee: HONDA MOTOR CO., LTD.Inventors: Yusuke Wada, Taichi Kitagawa, Ryo Takano, Kento Kusatsugu
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Publication number: 20220359785Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: July 20, 2022Publication date: November 10, 2022Applicants: SemiLEDS Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Publication number: 20220320366Abstract: A method for fabricating semiconductor light emitting devices (LEDs) includes forming a plurality of light emitting diode (LED) structures having sidewall P-N junctions on a growth substrate, and forming an isolation layer on the light emitting diode (LED) structures having corners at intersections of the epitaxial structures with the growth substrate. The method also includes forming an etchable covering channel layer on the isolation layer, forming a patterning protection layer on the covering channel layer, forming etching channels in the covering channel layer using a first etching process, and removing the corners of the isolation layer by etching the isolation layer using a second etching process. Following the second etching process the isolation layer covers the sidewall P-N junctions. The method can also include bonding the growth substrate to a carrier and separating the growth substrate from the light emitting diode (LED) structures using a laser lift off (LLO) process.Type: ApplicationFiled: February 16, 2022Publication date: October 6, 2022Applicants: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, TRUNG TRI DOAN, DAVID TRUNG DOAN, YOSHINORI OGAWA, KAZUNORI KONDO, TOSHIYUKI OZAI, NOBUAKI MATSUMOTO, TAICHI KITAGAWA
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Publication number: 20220315418Abstract: A method for transferring microstructures, comprising at least the steps of: (i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate; (ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the to plurality of microstructures temporality fixed thereon; (iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon; (iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and (v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step.Type: ApplicationFiled: July 6, 2020Publication date: October 6, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yoshinori OGAWA, Keiji OHORI, Shuhei UEDA, Kazunori KONDO, Toshiyuki OZAI, Nobuaki MATSUMOTO, Taichi KITAGAWA, Kohei OTAKE, Minoru KAWAHARA
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Publication number: 20220271198Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: ApplicationFiled: May 10, 2022Publication date: August 25, 2022Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.Inventors: Chen-Fu Chu, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEl OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAi, SHUHEI UEDA
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Publication number: 20220271313Abstract: A unit cell includes a membrane electrode assembly, a resin frame member, a first separator, and a second separator. The membrane electrode assembly includes an electrolyte membrane, a first electrode, and a second electrode. A window section is formed in the resin frame member. An inner marginal portion of the window section enters between an outer marginal portion of the first electrode and an outer marginal portion of the electrolyte membrane. A ridge is provided on the second separator. The second separator is disposed adjacent to the second electrode. The ridge and the resin frame member are joined together through hot melt.Type: ApplicationFiled: February 3, 2022Publication date: August 25, 2022Inventor: Taichi KITAGAWA
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Patent number: 11417799Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.Type: GrantFiled: August 7, 2020Date of Patent: August 16, 2022Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
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Patent number: 11370869Abstract: According to the present invention, an ultraviolet curable silicone composition for stereolithography, which contains (A) an organopolysiloxane that has two groups represented by formula (1) (wherein each R1 independently represents a monovalent hydrocarbon group having 1-20 carbon atoms; R2 represents an oxygen atom or the like; R3 represents an acryloyloxyalkyl group or the like; p represents a number satisfying 0?p?10; and a represents a number satisfying 1?a?3) in each molecule, (B) an organopolysiloxane resin that is composed of (a) a unit represented by formula (2) (wherein R1-R3, a and p are as defined above), (b) an R43SiO1/2 unit (wherein each R4 independently represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (c) an SiO4/2 unit, and wherein the molar ratio of the total of the unit (a) and the unit (b) to the unit (c) is within the range of 0.6-1.Type: GrantFiled: July 11, 2019Date of Patent: June 28, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Kohei Otake, Nobuaki Matsumoto, Taichi Kitagawa, Toshiyuki Ozai, Atsushi Yaginuma
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Publication number: 20220135744Abstract: Provided are an excellently convenient ultraviolet-curable organopolysiloxane causing no surface curing inhibition even when cured in the atmosphere; a composition containing such organopolysiloxane; and a cured product of such composition. The organopolysiloxane is represented by the following formula (1): wherein each R1 independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms or a group represented by the following formula (2), each molecule has at least one group represented by the following formula (2), m is a number satisfying 1?m?10,000, wherein R2 represents a group having at least one of an acryloyl group, methacryloyl group, acryloyloxyalkyl group or methacryloyloxyalkyl group, R3 represents a divalent hydrocarbon group having 1 to 20 carbon atoms.Type: ApplicationFiled: March 5, 2020Publication date: May 5, 2022Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Nobuaki MATSUMOTO, Toshiyuki OZAI, Taichi KITAGAWA, Kohei OTAKE, Mamoru HAGIWARA
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Publication number: 20220119663Abstract: Provided is an ultraviolet curable silicone composition capable of being ejected via inkjet ejection. The composition of the invention is an ultraviolet curable silicone composition comprising: (A) an organopolysiloxane represented by the following general formula (1) wherein each R1 independently represents a group selected from a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, an acryloyl group, a methacryloyl group, an alkyl acrylate group and an alkyl methacrylate group, while the component (A) has per molecule at least two groups selected from an acryloyl group, a methacryloyl group, an alkyl acrylate group and an alkyl methacrylate group; n represents a number satisfying 10?n?1,000; (B) a monofunctional (meth)acrylate compound having no siloxane structure; and/or (C) a multifunctional (meth)acrylate compound having no siloxane structure; and (D) a photopolymerization initiator.Type: ApplicationFiled: December 30, 2021Publication date: April 21, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Nobuaki MATSUMOTO, Taichi KITAGAWA, Atsushi YAGINUMA, Masaaki SHIROTA