Abstract: A semiconductor device includes a semiconductor substrate having a first surface being an element formation surface, and a second surface opposite to the first surface; a through-hole formed to penetrate the semiconductor substrate from the first surface to the second surface; an insulating film formed on an inner wall of the through-hole; a barrier film formed on the inner wall of the through-hole with the insulating film interposed therebetween; and a conductive portion formed to fill the through-hole provided with the insulating film and the barrier film. A gettering site is formed in a portion of the semiconductor substrate around the through-hole at least near a side of the first surface.

Abstract: A semiconductor device includes a plurality of through vias extending through a substrate. The plurality of through vias are arranged dividedly in three or more via groups. Each of the via groups includes three or more of the through vias that are arranged in two dimensions.

Abstract: A semiconductor device includes: a semiconductor substrate having a first surface as a surface on which an element is formed, and a second surface opposite to the first surface; a through hole formed so as to extend through the semiconductor substrate from the first surface to the second surface; an insulating film formed on an inner wall of the through hole; and a conductive portion formed in a space surrounded by the insulating film in the through hole. The insulating film continuously extends on the inner wall of the through hole and on the second surface.

Abstract: A semiconductor device includes a semiconductor substrate having a first surface being an element formation surface, and a second surface opposite to the first surface; a through-hole formed to penetrate the semiconductor substrate from the first surface to the second surface; an insulating film formed on an inner wall of the through-hole; a barrier film formed on the inner wall of the through-hole with the insulating film interposed therebetween; and a conductive portion formed to fill the through-hole provided with the insulating film and the barrier film. A gettering site is formed in a portion of the semiconductor substrate around the through-hole at least near a side of the first surface.

Abstract: A semiconductor device includes: a semiconductor substrate having a first surface as a surface on which an element is formed, and a second surface opposite to the first surface; a through hole formed so as to extend through the semiconductor substrate from the first surface to the second surface; an insulating film formed on an inner wall of the through hole; and a conductive portion formed in a space surrounded by the insulating film in the through hole. The insulating film continuously extends on the inner wall of the through hole and on the second surface.

Abstract: A semiconductor device includes a plurality of through vias extending through a substrate. The plurality of through vias are arranged dividedly in three or more via groups. Each of the via groups includes three or more of the through vias that are arranged in two dimensions.

Abstract: An inner rotor type motor has a plurality of stator magnetic poles projecting inwardly from a stator yoke surrounding the outer periphery of a shaft, of which a plurality of stator magnetic poles, some, at least the same number as the number of the phases of the driving voltage, are each provided with a driving coil and a decelerating coil wound around the same and form long stator magnetic poles (26), while the remaining stator magnetic poles are each made shorter than the long stator magnetic poles, not provided with a winding, and form short stator magnetic poles. Further, the motor has a rotor rotating centering around the shaft and having rotor magnets made up of permanent magnets disposed in a confronting relationship with salient poles of the stator magnetic poles.

Abstract: The object of the present invention is to provide a rotary electric machine that provides bobbins with good assembling efficiency and allows no dislocation of the stator. A motor 2 comprises a case 4, a stator 6 secured inside the case 4, a rotor 10 formed into one piece with a rotating shaft 8. The stator 6 comprises stator yokes 32 and the stator yokes are secured in a radial manner in the case 4. Furthermore, resin 58 is filled in between the stator 6 and the case 4 with a space for the rotor being left. The stator yokes 32 comprise a salient pole 34, a bobbin 36 for holding the salient pole 34, and a magnetic wire 38 wound around the bobbin 36. A collar 39b of the bobbin 36 is formed so as to contact each other with notches 3 formed on two, upper and lower edge portions. Accordingly, combining two bobbins 36, 36 allows through-holes 5 penetrating the collar 39b thereof.

Abstract: The object of the present invention is to provide a rotary electric machine which has high assembly accuracy, high heat dissipating efficiency, and excellent durability at the bearing portion. A motor comprises a case, a stator secured within the case, and a rotor formed into one piece with a rotary shaft. The case is provided, on both end faces, with flanges, and one of the flanges is provided with a ball bearing. A stator is radially secured within the case, resin is filled in between the stator and the case with a space of the rotor being left, and a bearing housing and a boss are formed on one side. An open portion is formed in between ribs of the bearing housing, and inserting the bearing into the bearing housing causes a part of the bearing to be exposed through the open portion to fixedly contact with the flange. This allows supporting the bearing securely, and allows frictional heat generated, and the like, to dissipate to the outside via the flange.

Abstract: A brushless DC motor, having a rotor with a cylindrical rotor magnet supported rotationally by a shaft held by bearings mounted on a substantially planar base plate, and a stator supported by the base plate, and including a plurality of radially spaced salient poles holding stator coils formed by windings of magnet wire. Opposing surfaces of the rotor and each salient pole are defined by a first surface of a magnetic core of the salient pole, which is received in a bobbin, and a second surface of the magnetic core orthogonal to the first surface, and the rotor magnet has permanent magnet poles forming a first surface opposing the first surface of the magnetic core, and a second surface opposing the second surface of the magnetic core. A tip of each magnetic core is received through a hole formed in the base plate.

Abstract: A thermoplastic resin composition superior in impact resistance, heat resistance, flexural rigidity, processability and solvent resistance which comprises: (A) 100 parts by weight of a resin composition comprising 5-95% by weight of a polyphenylene ether, or a polyphenylene ether and polystyrene, and 95-5% by weight of a polyamide resin; (B) 5-50 parts by weight of a modified saturated rubber obtained by grafting 5-100 parts by weight of an aromatic vinyl compound on 100 parts by weight of a saturated type rubber and allowing 0.05-10 parts by weight of a compatibilizing agent to react with said rubber; and (c) 0.05-20 parts by weight of a compatibilizing agent.

Abstract: A mica-reinforced propylene resin composition having a volatile matter at 105.degree. C of 0.12% or less is obtained by heating and melting a mixture containing (A) a crystalline polypropylene, (B) mica treated with an organosilane compound, (C) a bismaleimide compound, and (D) an organic peroxide. It has excellent stiffness, heat resistance and dimensional stability, does not corrode a mold, and does not exhale an irritating odor during molding.

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B) , an average particle diameter in said dispersing phase having of 0.01-10 .mu..

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..

Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..

Abstract: A thermoplastic resin composition suitable for shaped articles comprises (A) 100 parts by weight of a composition consisting of (a) from 5-95% by weight of a polyphenylene ether and (b) from 95-5% by weight of a polyamide, (B) from 5-100 parts by weight of a reactive group-modified copolymer rubber, and (C) from 0.01-30 parts by weight of a copolymer of unsaturated epoxy compound/ethylene/(/ethylenically unsaturated compound).

Abstract: A novel thermoplastic resin composition excellent in heat resistance, impact resistance, hardness is provided which comprises 100 parts by weight of a composition comprising (A) 5-95% by weight of a polyphenylene ether prepared by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 which may be identical or different and represent a hydrogen atom, a halogen atom, a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom and (B) 95-5% by weight of a polyamide and 5-100 parts by weight of (C) a copolymer of an ethylene-.alpha.-olefin copolymer rubber with an alkenyl aromatic compound and an unsaturated carboxylic acid or its anhydride. This composition may further contain 0.01-30 parts by weight of an epoxy compound (D) for 100 parts by weight of the composition of (A) and (B).

Abstract: The present invention provides a thermoplastic resin composition which comprises:(i) at least one compatibilizing agent in an amount effective for compatibilization,(ii) (A) a polyphenylene ether in an amount of about 40-100% by weight based on the total amount of (A) and (B) and(B) a homopolymer of alkenyl aromatic compound or a random copolymer of alkenyl aromatic compound and unsaturated compound in an amount of 0-about 60% by weight based on the total amount of (A) and (B), the total amount of (A) and (B) being about 10% by weight or more based on total amount of all polymer components,(iii) at least one polyamide in an amount more than the amount required for forming a continuous phase, and(iv) a compound having a molecular weight of 2,000 or less, containing nitrogen element, and having ring opening or condensation polymerizability or reactivity with acid or amine.

Abstract: A thermoplastic resin composition comprises a polyphenylene ether having a reduced viscosity within the range of 0.30 dl/g or more and less than 0.45 dl/g, an aliphatic polyamide, a specified compatibilizing agent, and a rubber material. The composition has a high in heat distortion temperature and is superior in processability.