Abstract: An object is to provide a technique that improves the moisture uptake resistance of a semiconductor device. A semiconductor device includes a resin insulating sheet, a heat spreader provided on the resin insulating sheet, a semiconductor element mounted on the heat spreader, a lead frame having one end portion thereof connected to the semiconductor element, a first resin body that seals the resin insulating sheet, the heat spreader, the semiconductor element, and the one end portion of the lead frame with a rear surface of the resin insulating sheet being exposed, and a second resin body that seals the first resin body with the rear surface of the resin insulating sheet being exposed.

Abstract: A semiconductor device including a first semiconductor switching element having a first gate pad, a plurality of first emitter pads, and a first collector pad, a first wire for connecting adjacent pads out of the plurality of first emitter pads, a first output wire for connecting one of the plurality of first emitter pads to an output, a first controller for applying a gate voltage to the first gate pad, a first emitter wire that is directly connected to a first extraction pad which is any one pad of the plurality of first emitter pads, and is connected to the first controller to give a ground potential of the first controller, and a second semiconductor switching element having a second gate pad, a second emitter pad and a second collector pad connected to the output.

Abstract: A semiconductor device including a first semiconductor switching element having a first gate pad, a plurality of first emitter pads, and a first collector pad, a first wire for connecting adjacent pads out of the plurality of first emitter pads, a first output wire for connecting one of the plurality of first emitter pads to an output, a first controller for applying a gate voltage to the first gate pad, a first emitter wire that is directly connected to a first extraction pad which is any one pad of the plurality of first emitter pads, and is connected to the first controller to give a ground potential of the first controller, and a second semiconductor switching element having a second gate pad, a second emitter pad and a second collector pad connected to the output.

Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

Abstract: A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip.

Abstract: In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.

Abstract: A semiconductor device according to the present invention includes: an insulating substrate; a circuit pattern having a first surface that is bonded to a first main surface of the insulating substrate and a second surface opposite to the first surface on which a semiconductor element is bonded; a back surface pattern having a first surface that is bonded to a second main surface of the insulating substrate; and a heat dissipation plate bonded to a second surface of the back surface pattern opposite to the first surface of the back surface pattern. A curvature of a corner portion of the circuit pattern is greater than a curvature of a corner portion of the back surface pattern, and the corner portion of the circuit pattern is located inside the corner portion of the back surface pattern in a plan view.

Abstract: A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal.

Abstract: A semiconductor device according to the present invention includes: an insulating substrate; a circuit pattern having a first surface that is bonded to a first main surface of the insulating substrate and a second surface opposite to the first surface on which a semiconductor element is bonded; a back surface pattern having a first surface that is bonded to a second main surface of the insulating substrate; and a heat dissipation plate bonded to a second surface of the back surface pattern opposite to the first surface of the back surface pattern. A curvature of a corner portion of the circuit pattern is greater than a curvature of a corner portion of the back surface pattern, and the corner portion of the circuit pattern is located inside the corner portion of the back surface pattern in a plan view.

Abstract: In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.

Abstract: A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.

Abstract: A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal.

Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

Abstract: A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip.

Abstract: A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.

Abstract: A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal.

Abstract: A portion of a frame body is fixed on a surface of a heat-radiating plate, and on frame body, a semiconductor chip is die-bonded. Next, a prescribed electrode of semiconductor chip and corresponding lead terminal and the like are electrically connected by a prescribed wire. Next, the lead frame is set in a metal mold such that the semiconductor chip is covered with resin from above the semiconductor chip. Thermoplastic resin is introduced into the metal mold, and semiconductor chip and the like are sealed. By taking out the resulting body from the metal mold, a semiconductor is formed. Thus, a semiconductor device can be provided with reduced manufacturing cost.

Abstract: A portion of a frame body is fixed on a surface of a heat-radiating plate, and on frame body, a semiconductor chip is die-bonded. Next, a prescribed electrode of semiconductor chip and corresponding lead terminal and the like are electrically connected by a prescribed wire. Next, the lead frame is set in a metal mold such that the semiconductor chip is covered with resin from above the semiconductor chip. Thermoplastic resin is introduced into the metal mold, and semiconductor chip and the like are sealed. By taking out the resulting body from the metal mold, a semiconductor is formed. Thus, a semiconductor device can be provided with reduced manufacturing cost.

Abstract: A portion of a frame body is fixed on a surface of a heat-radiating plate, and on frame body, a semiconductor chip is die-bonded. Next, a prescribed electrode of semiconductor chip and corresponding lead terminal and the like are electrically connected by a prescribed wire. Next, the lead frame is set in a metal mold such that the semiconductor chip is covered with resin from above the semiconductor chip. Thermoplastic resin is introduced into the metal mold, and semiconductor chip and the like are sealed. By taking out the resulting body from the metal mold, a semiconductor is formed. Thus, a semiconductor device can be provided with reduced manufacturing cost.

Abstract: A portion of a frame body is fixed on a surface of a heat-radiating plate, and on frame body, a semiconductor chip is die-bonded. Next, a prescribed electrode of semiconductor chip and corresponding lead terminal and the like are electrically connected by a prescribed wire. Next, the lead frame is set in a metal mold such that the semiconductor chip is covered with resin from above the semiconductor chip. Thermoplastic resin is introduced into the metal mold, and semiconductor chip and the like are sealed. By taking out the resulting body from the metal mold, a semiconductor is formed. Thus, a semiconductor device can be provided with reduced manufacturing cost.