Patents by Inventor Taichi Okano

Taichi Okano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220301591
    Abstract: According to one embodiment, a disk device includes a housing, recording medium, a magnetic head, an internal wireless communication device, and an internal component. The housing has an internal space. The internal wireless communication device generates at least either of: an electric signal representing information to be written to the recording medium, the electric signal corresponding to light, a magnetic field, or an electric field generated by an external wireless communication device; and light, a magnetic field, or an electric field toward the external wireless communication device, the light, the magnetic field, or the electric field corresponding to an electric signal representing information read from the recording medium.
    Type: Application
    Filed: September 8, 2021
    Publication date: September 22, 2022
    Inventors: Taichi OKANO, Masahide TAKAZAWA, Jai LIU, Nobuhiro YAMAMOTO, Kota TOKUDA
  • Publication number: 20220301595
    Abstract: A disk device according to one embodiment includes a first conversion device, a second conversion device, an optical waveguide, a first component, and a second component. The first conversion device emits light corresponding to an electric signal. The second conversion device generates an electric signal corresponding to incident light. The optical waveguide includes a first end joined to the first conversion device and a second end joined to the second conversion device, and transmits light emitted from the first conversion device to the second conversion device. The first component is electrically connected to the first conversion device. The second component is electrically connected to the second conversion device, and communicates with the first component through the first conversion device, the optical waveguide, and the second conversion device.
    Type: Application
    Filed: September 8, 2021
    Publication date: September 22, 2022
    Inventors: Taichi OKANO, Jia LIU, Masahide TAKAZAWA, Nobuhiro TAKAZAWA, Kota TOKUDA
  • Patent number: 11437076
    Abstract: According to one embodiment, a disk device includes a housing having a first transmission hole, a magnetic disk, a head, a first sealing material having an inner surface and an outer surface and closing the first transmission hole, and a first wireless power feeding device having a first power feeding antenna. The first power feeding antenna is located mere inward of the housing than the outer surface of the first sealing material, and receives power transmitted through the first sealing material by wireless power feeding.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: September 6, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Taichi Okano, Jia Liu, Nobuhiro Yamamoto, Kota Tokuda
  • Publication number: 20220247064
    Abstract: A disk device includes a housing having a sidewall, the side wall having a first through-hole; a magnetic disk rotatably disposed in the housing and surrounded by the sidewall in a radial direction; a flexible printed circuit electrically connected to the magnetic disk; an insulator closing the first through-hole; a wireless communication device having a first communication antenna inside the housing; and a control board electrically connected to the flexible printed circuit. The control board is supplied with power from outside of the housing via a first connector, and is configured to receive a write command or a read command via the first communication antenna.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Jia LIU, Taichi OKANO, Kota TOKUDA, Nobuhiro YAMAMOTO
  • Patent number: 11342650
    Abstract: According to one embodiment, a disk device includes a housing including a sidewall, a magnetic disk, a wireless communication device including a first communication antenna, and a first insulating member. The sidewall includes a first through portion. The first insulating member closes the first through portion. The first communication antenna is located in the first through portion, is disposed spaced from the housing, and wirelessly communicates with an outside of the housing.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: May 24, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Jia Liu, Taichi Okano, Kota Tokuda, Nobuhiro Yamamoto
  • Patent number: 11289129
    Abstract: An electronic device according to one embodiment includes a housing, a first substrate, a second substrate, a first wireless communication device and a second wireless communication device. The first substrate is located inside the housing. The second substrate is located outside the housing and attached to the housing. The first wireless communication device is included in the first substrate. The second wireless communication device is included in the second substrate and wirelessly communicates with the first wireless communication device.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: March 29, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Taichi Okano, Nobuhiro Yamamoto, Kota Tokuda, Jia Liu, Masahide Takazawa
  • Publication number: 20220037761
    Abstract: According to one embodiment, a disk device includes a housing including a sidewall, a magnetic disk, a wireless communication device including a first communication antenna, and a first insulating member. The sidewall includes a first through portion. The first insulating member closes the first through portion. The first communication antenna is located in the first through portion, is disposed spaced from the housing, and wirelessly communicates with an outside of the housing.
    Type: Application
    Filed: March 10, 2021
    Publication date: February 3, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Jia LIU, Taichi OKANO, Kota TOKUDA, Nobuhiro YAMAMOTO
  • Publication number: 20210407550
    Abstract: According to one embodiment, a disk device includes a housing including a hole, a magnetic disk, a control board closing the hole, and an electronic component. The electronic component is mounted on the control board, and assists a control operation for recording and reproducing information on and from the magnetic disk.
    Type: Application
    Filed: March 10, 2021
    Publication date: December 30, 2021
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Taichi OKANO, Jia LIU, Nobuhiro YAMAMOTO, Kota TOKUDA
  • Patent number: 11211229
    Abstract: A method of processing an object using a plasma processing apparatus is provided. The plasma processing apparatus includes a stage on which the object is placed in a chamber, an outer peripheral member disposed around the stage, a first power supply configured to apply voltage to the outer peripheral member, and a memory storing information about a relationship between the voltage applied to the outer peripheral member and an adjustment amount of a process parameter. The method includes: applying voltage from the first power supply to the outer peripheral member; adjusting the process parameter based on the voltage applied to the outer peripheral member, by referring to the information stored in the memory; and performing a plasma process under a process condition including the adjusted process parameter.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: December 28, 2021
    Assignee: Tokyo Electron Limited
    Inventors: Sho Oikawa, Seiji Yokoyama, Taichi Okano, Shunichi Kawasaki
  • Publication number: 20210295876
    Abstract: According to one embodiment, a disk device includes a housing having a first transmission hole, a magnetic disk, a head, a first sealing material having an inner surface and an outer surface and closing the first transmission hole, and a first wireless power feeding device having a first power feeding antenna. The first power feeding antenna is located mere inward of the housing than the outer surface of the first sealing material, and receives power transmitted through the first sealing material by wireless power feeding.
    Type: Application
    Filed: September 9, 2020
    Publication date: September 23, 2021
    Inventors: Taichi Okano, Jia Liu, Nobuhiro Yamamoto, Kota Tokuda
  • Publication number: 20210225412
    Abstract: An electronic device according to one embodiment includes a housing, a first substrate, a second substrate, a first wireless communication device and a second wireless communication device. The first substrate is located inside the housing. The second substrate is located outside the housing and attached to the housing. The first wireless communication device is included in the first substrate. The second wireless communication device is included in the second substrate and wirelessly communicates with the first wireless communication device.
    Type: Application
    Filed: August 31, 2020
    Publication date: July 22, 2021
    Inventors: Taichi Okano, Nobuhiro Yamamoto, Kota Tokuda, Jia Liu, Masahide Takazawa
  • Publication number: 20200227241
    Abstract: A method of processing an object using a plasma processing apparatus is provided. The plasma processing apparatus includes a stage on which the object is placed in a chamber, an outer peripheral member disposed around the stage, a first power supply configured to apply voltage to the outer peripheral member, and a memory storing information about a relationship between the voltage applied to the outer peripheral member and an adjustment amount of a process parameter. The method includes: applying voltage from the first power supply to the outer peripheral member; adjusting the process parameter based on the voltage applied to the outer peripheral member, by referring to the information stored in the memory; and performing a plasma process under a process condition including the adjusted process parameter.
    Type: Application
    Filed: January 7, 2020
    Publication date: July 16, 2020
    Inventors: Sho OIKAWA, Seiji YOKOYAMA, Taichi OKANO, Shunichi KAWASAKI
  • Publication number: 20200227326
    Abstract: A method of processing an object using a plasma processing apparatus is provided. The plasma processing apparatus includes a stage on which the object is placed in a chamber, an outer peripheral member disposed around the stage, and a first power supply configured to apply voltage to the outer peripheral member. The method includes a step of exposing the object to a plasma containing a precursor having a deposition property, while applying voltage from the first power supply to the outer peripheral member. In applying voltage to the outer peripheral member, a status of a deposition film containing carbon that is deposited on the outer peripheral member is monitored, and the voltage applied to the outer peripheral member is controlled based on the monitored status of the deposition film.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 16, 2020
    Inventors: Sho OIKAWA, Seiji YOKOYAMA, Taichi OKANO, Shunichi KAWASAKI
  • Publication number: 20200168468
    Abstract: An etching method is provided. In the method, a substrate including an etching target film, a hard mask containing silicon and a patterned resist is provided. A protective film is formed on a surface of the substrate by generating a first plasma from one of a first gas containing carbon, fluorine and a dilute gas, and a second gas containing carbon, hydrogen and the dilute gas. The hard mask is etched by generating a second plasma from a third gas after performing the step of forming the protective film.
    Type: Application
    Filed: November 25, 2019
    Publication date: May 28, 2020
    Inventors: Takayuki ISHII, Taichi OKANO, Sho OIKAWA
  • Publication number: 20200144034
    Abstract: A target object processing method is provided for processing a target object using a plasma processing apparatus including a processing chamber, a mounting table which is disposed in the processing chamber and on which the target object is mounted, an outer peripheral member disposed around the mounting table, and a first voltage application device configured to apply a voltage to the outer peripheral member. The method comprises preparing the target object having an etching target film and a patterned mask formed on the etching target film, and processing the mask. The step of processing the mask includes supplying a first processing gas containing a first rare gas to the processing chamber, and a first plasma processing for processing the mask positioned at an outer peripheral portion of the target object using plasma of the first processing gas while applying a DC voltage to the outer peripheral member.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 7, 2020
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Seiji Yokoyama, Taichi Okano, Sho Oikawa, Shunichi Kawasaki, Toshifumi Nagaiwa
  • Patent number: 9431307
    Abstract: Provided is a semiconductor wafer evaluation method of performing an evaluation of electrical characteristics of a semiconductor wafer by bringing mercury into contact with a surface of the semiconductor wafer, the method including using a probe constituted of a fixed electrode having a tip end portion and a transparent covering portion that covers a portion other than the tip end portion of the fixed electrode, the fixed electrode being made of a metal having stronger wettability with respect to the mercury than the semiconductor wafer and the covering portion, and measuring the electrical characteristics by attaching the mercury to the tip end portion of the fixed electrode and then bringing the mercury into contact with the surface of the semiconductor wafer.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: August 30, 2016
    Assignee: SHOWA DENKO K.K.
    Inventor: Taichi Okano
  • Patent number: 8679882
    Abstract: There is provided a method of manufacturing a semiconductor device, a semiconductor device, and a semiconductor apparatus, by which an electrode having an excellent ohmic property can be formed, and a semiconductor device having excellent device characteristics can be obtained with a high product yield.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: March 25, 2014
    Assignee: Show A Denko K.K.
    Inventor: Taichi Okano
  • Publication number: 20140017826
    Abstract: Provided is a semiconductor wafer evaluation method of performing an evaluation of electrical characteristics of a semiconductor wafer by bringing mercury into contact with a surface of the semiconductor wafer, the method including using a probe constituted of a fixed electrode having a tip end portion and a transparent covering portion that covers a portion other than the tip end portion of the fixed electrode, the fixed electrode being made of a metal having stronger wettability with respect to the mercury than the semiconductor wafer and the covering portion, and measuring the electrical characteristics by attaching the mercury to the tip end portion of the fixed electrode and then bringing the mercury into contact with the surface of the semiconductor wafer.
    Type: Application
    Filed: July 8, 2013
    Publication date: January 16, 2014
    Inventor: Taichi OKANO
  • Publication number: 20110272711
    Abstract: There is provided a method of manufacturing a semiconductor device, a semiconductor device, and a semiconductor apparatus, by which an electrode having an excellent ohmic property can be formed, and a semiconductor device having excellent device characteristics can be obtained with a high product yield.
    Type: Application
    Filed: January 13, 2010
    Publication date: November 10, 2011
    Applicant: SHOWA DENKO K.K.
    Inventor: Taichi Okano
  • Patent number: 6876013
    Abstract: A compound semiconductor multilayer structure comprising a carbon-containing p-type gallium arsenide (GaAs)-system crystal layer, wherein the carbon-containing p-type GaAs-system crystal layer exhibits a predominant photoluminescence peak measured at 20K within a range of 828 nm to 845 nm, and wherein the ratio of hydrogen atom concentration to carbon atom concentration in the carbon-containing p-type GaAs crystal layer is 1/5 or less. Furthermore, in a photoluminescence measurement at 10K, the carbon-containing GaAs-system p-type crystal layer exhibits a first predominant photoluminescence peak and a second predominant photoluminescence peak due to band gap transitions of GaAs and wherein the second predominant luminescence wavelength has a longer wavelength than the first predominant photoluminescence wavelength and the intensity ratio of the second luminescence peak to the first luminescence peak is within a range from 0.5 to 3.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: April 5, 2005
    Assignee: Showa Denko K.K.
    Inventors: Taichi Okano, Takashi Udagawa