Patents by Inventor Taichi Ueda

Taichi Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11936500
    Abstract: An in-vehicle network system deployed in a vehicle includes a plurality of first nodes configured to perform an operation relevant to a first function in the vehicle, a second node configured to perform an operation relevant to a second function different from the first function in the vehicle; and a relay device configured to relay communication between the first nodes and the second node. The relay device is configured to start relay of communication between the first nodes earlier than the relay of communication between the first node and the second node at a time of startup.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: March 19, 2024
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shu Ishizuka, Hiroya Ando, Taichi Matsumura, Masashi Amesara, Yutaka Ueda, Toshio Kawamura, Tomomi Kawamura, Yoshifumi Ohmori, Toshio Shimada, Yoshiro Hirata
  • Publication number: 20240072203
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Publication number: 20100016547
    Abstract: The present invention related to providing a novel medicine for treating diabetes. It is possible to provide a GLP-1 derivative which is resistant to enzyme degradation by glycosylation of the peptide side chain.
    Type: Application
    Filed: November 29, 2006
    Publication date: January 21, 2010
    Inventors: Takaomi Ito, Akio Takimoto, Hirofumi Nagatome, Masataka Fumoto, Taichi Ueda, Shin-Ichiro Nishimura
  • Patent number: D278388
    Type: Grant
    Filed: December 29, 1982
    Date of Patent: April 16, 1985
    Assignee: Fuji Co., Ltd.
    Inventor: Taichi Ueda
  • Patent number: D279143
    Type: Grant
    Filed: January 28, 1983
    Date of Patent: June 11, 1985
    Assignee: Fuji Co., Ltd.
    Inventor: Taichi Ueda