Abstract: A process for producing a substrate for a liquid ejection head in which a depressed portion is formed on a second surface that is a surface opposite to a first surface of a silicon substrate having an element formation region on the first surface with a peripheral side region left, the process including the steps of (1) forming an etching mask layer covering the second surface of the silicon substrate; (2) subjecting the etching mask layer and the silicon substrate to laser abrasion processing to form a pattern opening that does not pass through the silicon substrate; and (3) performing a wet etching process to the silicon substrate where the pattern opening is formed from a side of the second surface to form the depressed portion. The depressed portion is formed over a center side region including a position corresponding to the element formation region.

Abstract: A substrate for a liquid ejection head, including: forming a sacrifice layer on a first surface of a silicon substrate in a region in which a liquid supply port is to open, the sacrifice layer containing aluminum which is selectively etched with respect to the silicon substrate; forming an etching mask on a second surface which is a rear surface of the first surface of the silicon substrate, the etching mask having an opening corresponding to the sacrifice layer; a first etching step of etching the silicon substrate by using the etching mask as a mask and by using a first etchant containing 8 mass % or more and less than 15 mass % of tetramethylammonium hydroxide; and after the first etching step, a second etching step of removing the sacrifice layer by using a second etchant containing 15 mass % or more and 25 mass % or less of tetramethylammonium hydroxide.

Abstract: Provided is a method of producing a liquid ejection head substrate, the method including, in sequence; grinding a second surface of a silicon substrate, which is an opposite surface of a first surface on which a function element is formed, polishing the ground second surface, etching the polished second surface by reactive ion etching using ion incident energy, forming an etching mask on the second surface after the reactive ion etching, and forming a liquid supply port by subjecting the silicon substrate to wet etching using the etching mask.

Abstract: A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes.

Abstract: A method of processing an inkjet head substrate includes, in series, a step of forming a barrier layer on a substrate and forming a seed layer on the barrier layer, a step of forming a resist film on the seed layer and patterning the resist film such that the resist film has an opening corresponding to a wiring section configured to drive ink discharge energy-generating elements, a step of forming the wiring section in the opening of the patterned resist film, a step of removing the resist film, a step of laser-processing a surface of the substrate, a step of forming an ink supply port by anisotropically etching the substrate, and a step of removing the barrier layer and the seed layer.

Abstract: A liquid composition used to carry out crystal anisotropic etching of a silicon substrate provided with an etching mask formed of a silicon oxide film with the silicon oxide film used as a mask includes cesium hydroxide, an alkaline organic compound, and water.

Abstract: Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask.

Abstract: The present invention provides a method for producing a liquid discharge head including a silicon substrate having, on a first surface, energy generating elements, and a supply port penetrating the substrate from the first surface to a second surface, which is a rear surface of the first surface of the substrate. The method includes the steps of: preparing the silicon substrate having a sacrifice layer at a portion on the first surface where the ink supply port is to be formed and an etching mask layer having a plurality of openings on the second surface, the volume of a portion of the sacrifice layer at a position corresponding to a portion between two adjacent said openings being smaller than the volume of a portion of the sacrifice layer at a position corresponding to the opening; etching the silicon substrate from the plurality of openings and etching the sacrifice layer.

Abstract: A method for manufacturing a liquid discharge head including a flow path forming member to form a flow path communicating with a discharge port for discharging liquids includes forming an organic material layer on a substrate, applying a soluble resin on the organic material layer to form a resin layer, patterning the resin layer to form a pattern with a shape of the flow path, forming a cover layer as the flow path forming member on the pattern, forming the discharge port to expose a part of the pattern from the cover layer, eluting the pattern from the discharge port to form the flow path, irradiating a substance sticking to a surface of the flow path forming member on which the discharge port is formed with ultraviolet light, wherein the substance contains at least the organic material, and removing the sticking substance.

Abstract: A liquid composition used to carry out crystal anisotropic etching of a silicon substrate provided with an etching mask formed of a silicon oxide film with the silicon oxide film used as a mask includes cesium hydroxide, an alkaline organic compound, and water.

Abstract: A substrate for a liquid ejection head, including: forming a sacrifice layer on a first surface of a silicon substrate in a region in which a liquid supply port is to open, the sacrifice layer containing aluminum which is selectively etched with respect to the silicon substrate; forming an etching mask on a second surface which is a rear surface of the first surface of the silicon substrate, the etching mask having an opening corresponding to the sacrifice layer; a first etching step of etching the silicon substrate by using the etching mask as a mask and by using a first etchant containing 8 mass % or more and less than 15 mass % of tetramethylammonium hydroxide; and after the first etching step, a second etching step of removing the sacrifice layer by using a second etchant containing 15 mass % or more and 25 mass % or less of tetramethylammonium hydroxide.

Abstract: A method of processing a substrate includes the steps of providing a silicon substrate that has an etching mask layer with an opening portion at a first surface thereof and has plane orientation of {100} with the surface of the silicon being exposed from the opening portion; preparing a recessed portion that faces from the first surface to a second surface, opposite to the first surface, in the opening portion of the silicon substrate; and forming a penetration port that passes through the first surface and the second surface of the silicon substrate by executing crystalline anisotropic etching in the silicon substrate using an etching liquid in which an etching rate for etching a (100) surface of silicon is higher than an etching rate for etching a (110) surface of silicon, from the recessed portion of the silicon substrate toward the second surface.

Abstract: Provided is a method of producing a liquid ejection head substrate, the method including, in sequence; grinding a second surface of a silicon substrate, which is an opposite surface of a first surface on which a function element is formed, polishing the ground second surface, etching the polished second surface by reactive ion etching using ion incident energy, forming an etching mask on the second surface after the reactive ion etching, and forming a liquid supply port by subjecting the silicon substrate to wet etching using the etching mask.

Abstract: A processing method of a silicon substrate, including forming on a back surface of a silicon substrate an etching mask layer having an opening portion, measuring a thickness of the silicon substrate, irradiating the opening portion in the etching mask layer with laser from the back surface of the silicon substrate to form in the silicon substrate a modified layer with a thickness that is varied according to the measured thickness of the silicon substrate, carrying out anisotropic etching with regard to the silicon substrate having the modified layer formed therein to form in the back surface a depressed portion which does not pass through the silicon substrate and which has a bottom surface in the silicon substrate, and carrying out dry etching in the depressed portion to form a through-hole passing from the bottom surface of the depressed portion to a front surface of the silicon substrate.

Abstract: A liquid discharge recording head includes a flow passage forming member having discharge ports and a flow passage, the discharge ports configured to discharge droplets, the flow passage communicating with the discharge ports. The flow passage forming member also has a first opening and a second opening, the first opening provided at a surface of the flow passage forming member with the discharge ports, the second opening causing the inside of the first opening to communicate with the outside of the flow passage forming member through a communication passage.

Abstract: A manufacturing method of an ink jet recording head includes steps of forming a liquid flow path mold material of a soluble resin on a substrate on which an energy generating element is formed, the energy generating element being configured to generate energy for use in discharging ink; forming a coating resin layer of a negative photosensitive resin on the substrate on which the mold material is formed; exposing and developing the coating resin layer to form an ink discharge port in the coating resin layer; and dissolving and removing the mold material to form a liquid flow path. During the exposing of the coating resin layer, a total amount of exposure energy per unit area applied to an exposure region other than a region of the coating resin layer positioned above the mold material is greater than that of exposure energy per unit area applied to the region of the coating resin layer positioned above the mold material.

Abstract: Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask.

Abstract: A liquid ejection head and a method of forming the same. The liquid ejection head includes a substrate, an ejection port, a liquid channel, and a supply port. The substrate has, above one side thereof, an energy generating element configured to generate energy used to eject liquid. The ejection port, from which a liquid is ejected, is located at a position corresponding to the energy generating element. The liquid channel communicates with the ejection port and penetrates the substrate from the one side to another side of the substrate. The supply port communicates with the liquid channel. The substrate has a projecting layer extending inward of an inner peripheral portion of an opening in the supply port in the one side, and the projecting layer and the energy generating element are formed of the same material.

Abstract: A method of manufacturing a liquid discharge head including a plurality of passages on a substrate, the passages communicating with a plurality of discharge ports configured to discharge liquid. The method includes the step of forming first, second, third, and fourth members, the first member having a shape of one passage, the second member having a shape of another member, the third member being formed near the first member, the fourth member being formed near the second member, the first to fourth members being formed on a surface of the substrate. The method also includes coating the substrate with a cover layer covering the first to fourth members, removing the first member to form the one passage, and removing the second member to form the another passage.

Abstract: An ink jet recording head includes an ejection outlet for ejecting ink; an energy generating element, provided on a silicon substrate, for generating energy for ejecting the ink from the ejection outlet; an ink flow passage, provided correspondingly to the energy generating element, communicating with the ejection outlet; a through hole passing through the silicon substrate; and an ink supply port for supplying the ink supplied into the through hole to the ink flow passage. The ink supply port is formed with an extended member which contacts a bottom of a flow passage wall constituting the ink flow passage and extends into an opening of the through hole.