Patents by Inventor Taiga HANDA

Taiga HANDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded structure
    Patent number: 12221565
    Abstract: A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: February 11, 2025
    Assignee: DENSO CORPORATION
    Inventors: Hirotaka Miyano, Masami Saito, Kazuhiro Morita, Taiga Handa, Katsuhito Mori, Kunio Mori
  • BONDED STRUCTURE
    Publication number: 20230098430
    Abstract: A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 30, 2023
    Inventors: Hirotaka MIYANO, Masami SAITO, Kazuhiro MORITA, Taiga HANDA, Katsuhito MORI, Kunio MORI
  • BONDED STRUCTURE AND METHOD FOR PRODUCING SAME, AND HEAT EXCHANGER
    Publication number: 20210138763
    Abstract: A bonded structure has a first bonded member with a first bonding surface, a second bonded member with a second bonding surface, and a bonding resin layer containing a polymer, disposed between the first bonding surface and the second bonding surface. The polymer in the bonding resin layer has polymer main chains oriented in an intersecting direction that intersects with the first bonding surface and the second bonding surface. The intersecting direction preferably extends along the thickness direction of the bonding resin layer. A heat exchanger has the bonded structure, and the first bonded member serves as a tubular member, and the second bonded member serves as a heat dissipation fin.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 13, 2021
    Inventors: Masami SAITO, Koji KONDO, Masashi TOTOKAWA, Hirotaka MIYANO, Yoshitake SUGANUMA, Kenichi YAGI, Yuichi KATO, Kunio MORI, Katsuhito MORI, Taiga HANDA