Abstract: An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment.

Abstract: A pseudo sheet structure is usable for a sensor configured to emit an electromagnetic wave in a band ranging from 20 GHz to 100 GHz. The pseudo sheet structure includes a plurality of conductive linear bodies arranged at an interval L satisfying a formula (1) below, 0.034×?S?L?20 mm (1). In the formula (1), L is the interval between the plurality of conductive linear bodies, ?S is a wavelength of the electromagnetic wave emitted by the sensor, and a unit for each of L and ?S is mm.

Abstract: An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment.

Abstract: A semiconductor apparatus 100 according to an embodiment of the present invention includes a semiconductor substrate 11 and a protective layer 20. The semiconductor substrate 11 has a first surface constituting a circuit surface, and a second surface opposite to the first surface. The protective layer 20 includes a single layer of a composite material containing soft magnetic particles, and has an adhesive surface 201 to be adhered to the second surface.

Abstract: An antenna circuit which includes a substrate and a planar circuit with a circuit line of a conductive material formed on a surface of the substrate, and at least one conductive pad (notch-forming part) electrically connected with the circuit line of the planar circuit. Cutting lines, such as perforations, are provided in the substrate around an outer periphery of the notch-forming part and extend into the notch-forming part on either side of connection points where the circuit line connects with the notch-forming part, The cutting lines approach each other in the notch-forming part to form a section (notch port). The antenna circuit can be destroyed even if an IC tag provided with the antenna circuit is peeled off from various directions, and the destruction rate of the circuit can be increased stably.

Abstract: An electrode member includes: a circuit substrate; and a first terminal and a second terminal being provided on at least one surface of the circuit substrate and being not electrically conductive with each other. The first terminal and the second terminal are brought into electrical conduction through a jumper. At least one of the first terminal and the second terminal is provided with a non-linear portion formed in a periphery thereof at a position overlapping with the jumper, the non-linear portion being in a non-linear shape in a plan view of the circuit substrate.

Abstract: The present invention provides an electronic circuit which comprises a circuit line and a terminal portion connected to the circuit line, wherein the terminal portion has a folding endurance structure at a junction where the terminal portion is connected to the circuit line and the folding endurance structure of the terminal portion has a plane width gradually-increasing portion, in which the width of the terminal portion in plane view increases continuously or intermittently as the folding endurance structure of the terminal portion becomes away from the junction where the terminal portion is connected to the circuit line. The electronic circuit and an IC tag incorporating the electronic circuit of the present invention are excellent in folding endurance property, and can have an electronic circuit which is hard to break even if the electronic circuit is folded.

Abstract: According to the present invention, there is disclosed an antenna circuit characterized by comprising: a substrate, a surface circuit consisting of a planar coil circuit portion and at least one pair of opposed electrodes connected to the planar coil circuit portion formed on the substrate, at least one terminal for formation of broken line, formed in a conductor constituting the surface circuit, and a broken line which penetrates through the substrate and the surface circuit and which has, in the terminal for formation of broken line, at least one uncut part passing through the terminal for formation of broken line.

Abstract: The present invention provides an electronic circuit which comprises a circuit line and a terminal portion connected to the circuit line, wherein the terminal portion has a folding endurance structure at a junction where the terminal portion is connected to the circuit line and the folding endurance structure of the terminal portion has a plane width gradually-increasing portion, in which the width of the terminal portion in plane view increases continuously or intermittently as the folding endurance structure of the terminal portion becomes away from the junction where the terminal portion is connected to the circuit line. The electronic circuit and an IC tag incorporating the electronic circuit of the present invention are excellent in folding endurance property, and can have an electronic circuit which is hard to break even if the electronic circuit is folded.

Abstract: When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.

Abstract: The present invention provides an antenna circuit which comprises a substrate, a planar circuit consisting of a circuit line of a conductive material formed on a surface of the substrate, and at least one notch-forming part connected with the circuit line of the planar circuit, wherein cutting lines are provided in the substrate around an outer periphery of the notch-forming part, each of the cutting lines on both sides of the circuit line connected with the notch-forming part are extended in the direction of the inside of the notch-forming part from the outside of the notch-forming part, up to the substrate and the notch-forming part, and the cutting lines are approached each other in the notch-forming part to form a notch part. The antenna circuit can be destroyed even if an IC tag comprising the antenna circuit is peeled off from various direction, and the destruction rate of the circuit can be increased stably.

Abstract: The present invention discloses: an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.

Abstract: The present invention discloses a connecting part of conductor pattern, which is connected to a conductor pattern formed on a surface of an insulating substrate and which has at least one dent on the surface, and a conductor patterns-connected structure obtained by electrically connecting the connecting parts of conductor patterns, mentioned above, to each other with a conductive material which fills the inside of the dent of each connecting part and further is adhered to each connecting part.

Abstract: According to the present invention, there is disclosed an antenna circuit characterized by comprising: a substrate, a surface circuit consisting of a planar coil circuit portion and at least one pair of opposed electrodes connected to the planar coil circuit portion formed on the substrate, at least one terminal for formation of broken line, formed in a conductor constituting the surface circuit, and a broken line which penetrates through the substrate and the surface circuit and which has, in the terminal for formation of broken line, at least one uncut part passing through the terminal for formation of broken line.

Abstract: An antenna circuit includes a plurality of antenna circuit units on a circuit substrate. The plurality of antenna circuit units includes: a large antenna circuit unit whose circuit size is large; and a small antenna circuit unit whose circuit size is smaller than the size of the large antenna circuit unit, the small antenna circuit unit provided inside the large antenna circuit unit and provided detachable from the large antenna circuit unit.

Abstract: An IC tag and an IC card are provided to achieve reduction in size, improvement on workability and the yield rate when manufacturing, reduction of manufacturing cost, etc., The IC tag of this invention is formed for transmitting information in non-contact manner, and two pieces of antenna circuits 2 are folded and superposed on each other therebetween. One of the two pieces of antenna circuits 2 is a mounted circuit 2A on which an IC chip 6 is not mounted, and the other is an opened circuit 2B on which on IC chip 6 is mounted. On one surface of the antenna circuit 2 is provided a surface printing material 10 on which visible information is printed. On the other surface of the antenna circuit 2 is provided an adhesive member, so that the antenna circuit 2 can be stuck with each other by folding a circuit support portion 4.

Abstract: When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.

Abstract: The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.

Abstract: The present invention discloses: a connecting part of conductor pattern, which is connected to a conductor pattern formed on a surface of an insulating substrate and which has at least one dent on the surface, and a conductor patterns-connected structure obtained by electrically connecting the connecting parts of conductor patterns, mentioned above, to each other with a conductive material which fills the inside of the dent of each connecting part and further is adhered to each connecting part.

Abstract: The present invention discloses: an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.