Patents by Inventor Taiga Matsushita

Taiga Matsushita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240364833
    Abstract: A reading apparatus includes a user interface, a scanner, and a controller configured to perform a push scan that causes the scanner to read a document according to an execution instruction corresponding to an operation on the user interface, and a pull scan that causes the scanner to read the document according to an execution instruction from an external device. The controller is configured to set a restriction setting value relating to a restriction on the push scan, and in a case where the controller receives an execution instruction of the push scan via the user interface, restrict the push scan according to the restriction setting value. In a case where the controller receives an execution instruction of the pull scan, the controller is configured to specify whether authentication is necessary with respect to the execution instruction of the push scan, based on the restriction setting value.
    Type: Application
    Filed: April 23, 2024
    Publication date: October 31, 2024
    Inventors: Toshikazu HORI, Satoshi MATSUSHITA, Hiroya NOJIRI, Satoru YANAGI, Tomomi SHIRAKI, Akihito UNO, Taiga MIZUMORI, Daisuke MATSUMOTO, Toshiki MOTOYAMA, Thanh NGUYENVAN
  • Publication number: 20240364831
    Abstract: A function executing device may be configured to receive a related instruction related to execution of a scan from an external device, and in a case where the related instruction is received from the external device via a first communication path for executing an encrypted communication, send an authentication information request to the external device. In a case where the related instruction is received from the external device via a second communication path for executing an unencrypted communication, the function executing device may be configured not to send the authentication information request to the external device.
    Type: Application
    Filed: April 9, 2024
    Publication date: October 31, 2024
    Inventors: Masahiro HAYASHI, Toshikazu HORI, Toshiki MOTOYAMA, Thanh NGUYENVAN, Satoru YANAGI, Akihito UNO, Tomomi SHIRAKI, Satoshi MATSUSHITA, Hiroya NOJIRI, Daisuke MATSUMOTO, Taiga MIZUMORI
  • Publication number: 20240364835
    Abstract: There is provided a reading apparatus including: a user interface; a communication interface; a scanner; and a controller configured to execute a first scan in response to an instruction to execute the first scan based on an operation to the user interface, and a second scan based on an instruction to execute the second scan from an external apparatus connected to the reading apparatus via the communication interface. The controller is configured to: execute the first scan without requiring authentication in a case where the controller receives, via the user interface, the instruction to execute the first scan; and perform the authentication in a case where the controller receives, via the communication interface, the instruction to execute the second scan, and then execute the second scan in a case where the authentication succeeds and not execute the second scan in a case where the authentication fails.
    Type: Application
    Filed: April 25, 2024
    Publication date: October 31, 2024
    Inventors: DAISUKE MATSUMOTO, TAIGA MIZUMORI, TOSHIKAZU HORI, THANH NGUYENVAN, TOSHIKI MOTOYAMA, SATOSHI MATSUSHITA, HIROYA NOJIRI, SATORU YANAGI, TOMOMI SHIRAKI, AKIHITO UNO
  • Patent number: 11723181
    Abstract: An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: August 8, 2023
    Assignee: LINTEC Corporation
    Inventor: Taiga Matsushita
  • Publication number: 20230139564
    Abstract: A pseudo sheet structure is usable for a sensor configured to emit an electromagnetic wave in a band ranging from 20 GHz to 100 GHz. The pseudo sheet structure includes a plurality of conductive linear bodies arranged at an interval L satisfying a formula (1) below, 0.034×?S?L?20 mm (1). In the formula (1), L is the interval between the plurality of conductive linear bodies, ?S is a wavelength of the electromagnetic wave emitted by the sensor, and a unit for each of L and ?S is mm.
    Type: Application
    Filed: March 3, 2021
    Publication date: May 4, 2023
    Inventors: Masaharu ITO, Takashi MORIOKA, Taiga MATSUSHITA, Yuma KATSUTA
  • Publication number: 20220142018
    Abstract: An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment.
    Type: Application
    Filed: February 6, 2020
    Publication date: May 5, 2022
    Inventor: Taiga MATSUSHITA
  • Publication number: 20180240758
    Abstract: A semiconductor apparatus 100 according to an embodiment of the present invention includes a semiconductor substrate 11 and a protective layer 20. The semiconductor substrate 11 has a first surface constituting a circuit surface, and a second surface opposite to the first surface. The protective layer 20 includes a single layer of a composite material containing soft magnetic particles, and has an adhesive surface 201 to be adhered to the second surface.
    Type: Application
    Filed: October 7, 2016
    Publication date: August 23, 2018
    Inventors: NAOYA OKAMOTO, TAIGA MATSUSHITA, KAORI MATSUSHITA
  • Patent number: 9048525
    Abstract: An antenna circuit which includes a substrate and a planar circuit with a circuit line of a conductive material formed on a surface of the substrate, and at least one conductive pad (notch-forming part) electrically connected with the circuit line of the planar circuit. Cutting lines, such as perforations, are provided in the substrate around an outer periphery of the notch-forming part and extend into the notch-forming part on either side of connection points where the circuit line connects with the notch-forming part, The cutting lines approach each other in the notch-forming part to form a section (notch port). The antenna circuit can be destroyed even if an IC tag provided with the antenna circuit is peeled off from various directions, and the destruction rate of the circuit can be increased stably.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: June 2, 2015
    Assignee: LINTEC CORPORATION
    Inventors: Taiga Matsushita, Katsumi Katakura, Takakazu Murakami, Masateru Yamakage
  • Publication number: 20140002325
    Abstract: An electrode member includes: a circuit substrate; and a first terminal and a second terminal being provided on at least one surface of the circuit substrate and being not electrically conductive with each other. The first terminal and the second terminal are brought into electrical conduction through a jumper. At least one of the first terminal and the second terminal is provided with a non-linear portion formed in a periphery thereof at a position overlapping with the jumper, the non-linear portion being in a non-linear shape in a plan view of the circuit substrate.
    Type: Application
    Filed: March 16, 2012
    Publication date: January 2, 2014
    Applicant: LINTEC CORPORATION
    Inventor: Taiga Matsushita
  • Patent number: 8292188
    Abstract: The present invention provides an electronic circuit which comprises a circuit line and a terminal portion connected to the circuit line, wherein the terminal portion has a folding endurance structure at a junction where the terminal portion is connected to the circuit line and the folding endurance structure of the terminal portion has a plane width gradually-increasing portion, in which the width of the terminal portion in plane view increases continuously or intermittently as the folding endurance structure of the terminal portion becomes away from the junction where the terminal portion is connected to the circuit line. The electronic circuit and an IC tag incorporating the electronic circuit of the present invention are excellent in folding endurance property, and can have an electronic circuit which is hard to break even if the electronic circuit is folded.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: October 23, 2012
    Assignee: Lintec Corporation
    Inventors: Taiga Matsushita, Katsumi Katakura
  • Patent number: 7952527
    Abstract: According to the present invention, there is disclosed an antenna circuit characterized by comprising: a substrate, a surface circuit consisting of a planar coil circuit portion and at least one pair of opposed electrodes connected to the planar coil circuit portion formed on the substrate, at least one terminal for formation of broken line, formed in a conductor constituting the surface circuit, and a broken line which penetrates through the substrate and the surface circuit and which has, in the terminal for formation of broken line, at least one uncut part passing through the terminal for formation of broken line.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: May 31, 2011
    Assignee: Lintec Corporation
    Inventors: Taiga Matsushita, Naoki Hasegawa, Takakazu Murakami
  • Publication number: 20110121085
    Abstract: The present invention provides an electronic circuit which comprises a circuit line and a terminal portion connected to the circuit line, wherein the terminal portion has a folding endurance structure at a junction where the terminal portion is connected to the circuit line and the folding endurance structure of the terminal portion has a plane width gradually-increasing portion, in which the width of the terminal portion in plane view increases continuously or intermittently as the folding endurance structure of the terminal portion becomes away from the junction where the terminal portion is connected to the circuit line. The electronic circuit and an IC tag incorporating the electronic circuit of the present invention are excellent in folding endurance property, and can have an electronic circuit which is hard to break even if the electronic circuit is folded.
    Type: Application
    Filed: June 29, 2009
    Publication date: May 26, 2011
    Applicant: LINTEC CORPORATION
    Inventors: Taiga Matsushita, Katsumi Katakura
  • Patent number: 7883021
    Abstract: When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.
    Type: Grant
    Filed: January 3, 2008
    Date of Patent: February 8, 2011
    Assignee: Lintec Corporation
    Inventors: Yuichi Iwakata, Taiga Matsushita
  • Publication number: 20100328162
    Abstract: The present invention provides an antenna circuit which comprises a substrate, a planar circuit consisting of a circuit line of a conductive material formed on a surface of the substrate, and at least one notch-forming part connected with the circuit line of the planar circuit, wherein cutting lines are provided in the substrate around an outer periphery of the notch-forming part, each of the cutting lines on both sides of the circuit line connected with the notch-forming part are extended in the direction of the inside of the notch-forming part from the outside of the notch-forming part, up to the substrate and the notch-forming part, and the cutting lines are approached each other in the notch-forming part to form a notch part. The antenna circuit can be destroyed even if an IC tag comprising the antenna circuit is peeled off from various direction, and the destruction rate of the circuit can be increased stably.
    Type: Application
    Filed: February 17, 2009
    Publication date: December 30, 2010
    Applicant: LINTEC CORPORATION
    Inventors: Taiga Matsushita, Katsumi Katakura, Takakazu Murakami, Masateru Yamakage
  • Patent number: 7626548
    Abstract: The present invention discloses: an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: December 1, 2009
    Assignee: Lintec Corporation
    Inventors: Taiga Matsushita, Yasukazu Nakata, Takakazu Murakami
  • Patent number: 7616171
    Abstract: The present invention discloses a connecting part of conductor pattern, which is connected to a conductor pattern formed on a surface of an insulating substrate and which has at least one dent on the surface, and a conductor patterns-connected structure obtained by electrically connecting the connecting parts of conductor patterns, mentioned above, to each other with a conductive material which fills the inside of the dent of each connecting part and further is adhered to each connecting part.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: November 10, 2009
    Assignee: Lintec Corporation
    Inventors: Taiga Matsushita, Katumi Katakura, Katsuyoshi Matsuura
  • Publication number: 20090096706
    Abstract: According to the present invention, there is disclosed an antenna circuit characterized by comprising: a substrate, a surface circuit consisting of a planar coil circuit portion and at least one pair of opposed electrodes connected to the planar coil circuit portion formed on the substrate, at least one terminal for formation of broken line, formed in a conductor constituting the surface circuit, and a broken line which penetrates through the substrate and the surface circuit and which has, in the terminal for formation of broken line, at least one uncut part passing through the terminal for formation of broken line.
    Type: Application
    Filed: May 2, 2006
    Publication date: April 16, 2009
    Applicant: Lintec Corporation
    Inventors: Taiga Matsushita, Naoki Hasegawa, Takakazu Murakami
  • Patent number: 7498947
    Abstract: An antenna circuit includes a plurality of antenna circuit units on a circuit substrate. The plurality of antenna circuit units includes: a large antenna circuit unit whose circuit size is large; and a small antenna circuit unit whose circuit size is smaller than the size of the large antenna circuit unit, the small antenna circuit unit provided inside the large antenna circuit unit and provided detachable from the large antenna circuit unit.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: March 3, 2009
    Assignee: Lintec Corporation
    Inventors: Katsuyoshi Matsuura, Katsumi Katakura, Taiga Matsushita
  • Patent number: 7434739
    Abstract: An IC tag and an IC card are provided to achieve reduction in size, improvement on workability and the yield rate when manufacturing, reduction of manufacturing cost, etc., The IC tag of this invention is formed for transmitting information in non-contact manner, and two pieces of antenna circuits 2 are folded and superposed on each other therebetween. One of the two pieces of antenna circuits 2 is a mounted circuit 2A on which an IC chip 6 is not mounted, and the other is an opened circuit 2B on which on IC chip 6 is mounted. On one surface of the antenna circuit 2 is provided a surface printing material 10 on which visible information is printed. On the other surface of the antenna circuit 2 is provided an adhesive member, so that the antenna circuit 2 can be stuck with each other by folding a circuit support portion 4.
    Type: Grant
    Filed: April 19, 2006
    Date of Patent: October 14, 2008
    Assignee: Lintec Corporation
    Inventors: Katsuyoshi Matsuura, Taiga Matsushita
  • Publication number: 20080164326
    Abstract: When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.
    Type: Application
    Filed: January 3, 2008
    Publication date: July 10, 2008
    Applicant: Lintec Corporation
    Inventors: Yuichi Iwakata, Taiga Matsushita