Abstract: An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer.

Abstract: An object is to provide a novel bismaleimide compound. The solution is a bismaleimide compound represented by formula (1): wherein A1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3): wherein ring a represents a benzene ring or a cyclohexane ring; X represents a direct bond or a divalent linking group; Z represents a monovalent substituent bonded to ring a; p, q, and r are the number of substituents Z, p and q represent an integer of 0 to 3, and r represents an integer of 0 to 2; or a divalent linking group other than this; at least one of a plurality of A1s is a divalent linking group represented by formula (1-1), (1-2), or (1-3); A2 represents a divalent linking group obtained by removing two carboxy groups from an aromatic dicarboxylic acid compound; Y represents a divalent linking group; and n is an average value of the number of repeating units and is a real number in a range of 1 to 100.

Abstract: An object is to provide a novel bismaleimide compound.

Abstract: An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer.

Abstract: The present invention is a negative photosensitive resin composition which contains (A) an epoxy resin, (B) a compound that has a phenolic hydroxyl group and (C) a cationic photopolymerization initiator. This negative photosensitive resin composition is configured such that: 30% by mass or more of the epoxy resin (A) is an epoxy resin (A-1) that is represented by formula (1) (wherein each R moiety independently represents a glycidyl group or a hydrogen atom, and at least two R moieties among the plurality of R moieties are glycidyl groups; and a represents the average of the number of repeating units, which is a real number within the range of from 0 to 30); and the compound (B) that has a phenolic hydroxyl group and the cationic photopolymerization initiator (C) have specific structures.

Abstract: The present invention is a negative-acting photosensitive resin composition including (A) a compound having a triazine ring and represented by formula (1) (in formula (1), each R1 independently represents an organic group, wherein at least one R1 represents an organic group having a glycidyl group or an organic group having an oxetanyl group), (B) an epoxy resin having in each molecule a benzene backbone and at least two epoxy groups and having an epoxy equivalent weight of not more than 500 g/eq., and (C) a cationic photopolymerization initiator. The content of the (A) compound represented by formula (1) with reference to the (B) epoxy resin is 1 to 50 mass %. The (B) epoxy resin satisfies at least one of the following conditions (i) and (ii): condition (i) a weight-average molecular weight of at least 500, and condition (ii) a softening point of at least 40° C.

Abstract: The invention provides 3,3?-diamino-5,5?-diphenyl-4,4?-biphenyldiol which is useful as a monomer for a high-performance polymer, particularly a polymer satisfying performances highly required in the semiconductor field such as polybenzoxazole, polyimide or the like and 3,3?-dinitro-5,5?-diphenyl-4,4?-biphenyldiol as a raw material thereof. Also, the invention provides a polybenzoxazole having a repeating unit represented by the following formula (1): (wherein R is a bivalent dicarboxylic acid residue).