Patents by Inventor Taihei Nishikawa

Taihei Nishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230294100
    Abstract: There is provided a temperature chamber including: a heat transfer member in which a bottom wall and side walls are integrated; a recessed portion surrounded by the bottom wall and the side walls; and a heat source member that is configured to heat and/or cool the heat transfer member.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 21, 2023
    Applicant: ESPEC CORP.
    Inventors: Taihei NISHIKAWA, Kaori Fikuchi, Hirokazu Tanaka
  • Publication number: 20080285616
    Abstract: A system for testing objects such as electronic devices and mechanical components to see how they can withstand thermally hard circumstances created by a thermal agent supplied from a supplying system communicating with a testing section by and through an inlet flow path and an outlet flow path, wherein heat exchange is effected between the incoming agent and the outgoing agent, so that the remaining heat content, worm or cold, is taken and utilized for later uses.
    Type: Application
    Filed: December 20, 2007
    Publication date: November 20, 2008
    Inventors: Masataka Nakanishi, Hironobu Kurara, Taihei Nishikawa
  • Publication number: 20080216998
    Abstract: A thermostat includes a plate body, a heat insulator, and an electric heater. The plate body defines a cavity therewithin. The plate body has on its bottom two openings, which communicate with the cavity and function as a cooling medium inlet and a cooling medium outlet, respectively. The outer periphery of the plate body is covered with the heat insulator. That prevents heat intrusion and/or dissipation from the outer periphery of the plate body in transferring heat between the mounting face and a heat transfer medium within the cavity. That reduces the thermal influence on the mounting face, thereby ensuring more uniform temperature distribution on the mounting face.
    Type: Application
    Filed: March 4, 2008
    Publication date: September 11, 2008
    Inventors: Masataka Nakanishi, Hironobu Kurara, Taihei Nishikawa
  • Publication number: 20080149208
    Abstract: In one example, a piping system 20 is built around a wire (elongated flexible member) 25. An inlet pipe 21 and an outlet pipe 22 are fixed to both sides of the wire 25 parallel to each other via a plurality of pipe holders 26. Further, insulator holders 27 are attached to the wire 25 and heat insulating sections 28 are attached to the insulator holders 27. A cylindrical gap 51 is formed between the inlet pipe 21 and the inner surface of each of the heat insulating section 28.
    Type: Application
    Filed: December 26, 2007
    Publication date: June 26, 2008
    Inventors: Hironobu Kurara, Taihei Nishikawa, Masataka Nakanishi