Patents by Inventor Taiichi Kusano

Taiichi Kusano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing system, polishing method, polishing pad, and method of forming polishing pad
    Patent number: 6722962
    Abstract: Disclosed is a polishing system used for polishing a surface to be polished of an object to be polished by a polishing pad, which is capable of improving uniformity of the surface to be polished of the object to be polished by positively, accurately adjusting a polishing pressure, and a polishing method using the polishing system. Concretely, the surface to be polished of a wafer as the object to be polished is polished by relatively moving, along a plane, a polishing surface of the rotating polishing pad and the surface to be polished of the wafer in slide-contact with each other, and adjusting a pressing force applied from the polishing pad to the wafer in accordance with a polishing pressure previously set depending on a relative-positional relationship between the polishing surface of the polishing pad and the surface to be polished of the wafer.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: April 20, 2004
    Assignee: Sony Corporation
    Inventors: Shuzo Sato, Hiizu Ohtorii, Yasuharu Ohkawa, Yutaka Ozawa, Taiichi Kusano
  • Polishing system, polishing method, polishing pad, and method of forming polishing pad
    Patent number: 6520835
    Abstract: Disclosed is a polishing system used for polishing a surface to be polished of an object to be polished by a polishing pad, which is capable of improving uniformity of the surface to be polished of the object to be polished by positively, accurately adjusting a polishing pressure, and a polishing method using the polishing system. Concretely, the surface to be polished of a wafer as the object to be polished is polished by relatively moving, along a plane, a polishing surface of the rotating polishing pad and the surface to be polished of the wafer in slide-contact with each other, and adjusting a pressing force applied from the polishing pad to the wafer in accordance with a polishing pressure previously set depending on a relative-positional relationship between the polishing surface of the polishing pad and the surface to be polished of the wafer.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: February 18, 2003
    Assignee: Sony Corporation
    Inventors: Shuzo Sato, Hiizu Ohtorii, Yasuharu Ohkawa, Yutaka Ozawa, Taiichi Kusano
  • Polishing system and method with polishing pad pressure adjustment
    Patent number: 6139400
    Abstract: Disclosed is a polishing system used for polishing a surface to be polished of an object to be polished by a polishing pad, which is capable of improving uniformity of the surface to be polished of the object to be polished by positively, accurately adjusting a polishing pressure, and a polishing method using the polishing system. Concretely, the surface to be polished of a wafer as the object to be polished is polished by relatively moving, along a plane, a polishing surface of the rotating polishing pad and the surface to be polished of the wafer in slide-contact with each other, and adjusting a pressing force applied from the polishing pad to the wafer in accordance with a polishing pressure previously set depending on a relative-positional relationship between the polishing surface of the polishing pad and the surface to be polished of the wafer.
    Type: Grant
    Filed: April 21, 1998
    Date of Patent: October 31, 2000
    Assignee: Sony Corporation
    Inventors: Shuzo Sato, Hiizu Ohtorii, Yasuharu Ohkawa, Yutaka Ozawa, Taiichi Kusano