Patents by Inventor Taija Ema

Taija Ema has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 8169017
    Abstract: A method of manufacturing a semiconductor device that comprises the steps of: removing a second insulating film on a contact region of a first conductor; forming a second conductive film on the second insulating film; removing the second conductive film on the contact region of the first conductor to make the second conductive film into a second conductor; forming an interlayer insulating film (a third insulating film) covering the second conductor; forming a first hole in the interlayer insulating film on the contact region; and forming a conductive plug, which is electrically connected with the contact region, in the first hole.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: May 1, 2012
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Taija Ema, Toru Anezaki