Patents by Inventor Taiji Kuroiwa

Taiji Kuroiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic substrate composite and method for manufacturing ceramic substrate composite
    Patent number: 9320155
    Abstract: A ceramic substrate composite includes a conductor pattern composite and an insulating layer on a ceramic substrate. The ceramic substrate composite is formed such that the conductor pattern composite and the insulating layer are provided on the ceramic substrate with each other so that the insulating layer overlaps a part of the conductor pattern composite. The conductor pattern composite is composed of a conductor portion and an insulating portion that exists locally in the conductor portion, and the insulating portion is an insulating material that constitutes the insulating layer.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: April 19, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Taiji Kuroiwa, Seiichi Nakatani, Yoshihisa Yamashita, Susumu Sawada
  • CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE COMPOSITE
    Publication number: 20140131076
    Abstract: In the present invention, a ceramic substrate composite comprising, on a ceramic substrate, a conductor pattern composite and an insulating layer is provided. The ceramic substrate composite of the present invention is characterized in that the conductor pattern composite and the insulating layer are provided on the ceramic substrate with each other so that the insulating layer overlaps a part of the conductor pattern composite; and wherein the conductor pattern composite is composed of a conductor portion and an insulating portion that exists locally in the conductor portion, the insulating portion being an insulating material that constitutes the insulating layer.
    Type: Application
    Filed: December 21, 2012
    Publication date: May 15, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Taiji Kuroiwa, Seiichi Nakatani, Yoshihisa Yamashita, Susumu Sawada