Patents by Inventor Taiki ICHITSUBO
Taiki ICHITSUBO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230174821Abstract: Provided is a polishing composition that contains a cellulose derivative and can improve the polishing removability and enhance the wettability of a polished surface of a silicon wafer. The polishing composition contains an abrasive, a cellulose derivative, a basic compound, and water. Here, the polishing composition has a zeta potential of -24.0 mV or more.Type: ApplicationFiled: March 4, 2021Publication date: June 8, 2023Applicant: FUJIMI INCORPORATEDInventors: Kohsuke TSUCHIYA, Taiki ICHITSUBO
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Publication number: 20230073290Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.Type: ApplicationFiled: July 21, 2022Publication date: March 9, 2023Applicant: FUJIMI INCORPORATEDInventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Yusuke SUGA, Taiki ICHITSUBO, Takayuki TAKEMOTO, Naohiko SAITO, Michihiro KAAI
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Patent number: 11421131Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.Type: GrantFiled: October 19, 2018Date of Patent: August 23, 2022Assignees: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.Inventors: Kohsuke Tsuchiya, Hisanori Tansho, Yusuke Suga, Taiki Ichitsubo, Takayuki Takemoto, Naohiko Saito, Michihiro Kaai
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Publication number: 20220186078Abstract: Provided is a polishing composition having excellent capability of reducing haze on the surface of an object to be polished. The polishing composition provided by the present invention includes an abrasive, a basic compound, a water-soluble polymer, and water. The water-soluble polymer includes at least a water-soluble polymer P1 and a water-soluble polymer P2. Here, the water-soluble polymer P1 is an acetalized polyvinyl alcohol-based polymer, and the water-soluble polymer P2 is a water-soluble polymer other than the acetalized polyvinyl alcohol-based polymer.Type: ApplicationFiled: March 25, 2020Publication date: June 16, 2022Applicant: FUJIMI INCORPORATEDInventors: Kohsuke TSUCHIYA, Maki ASADA, Taiki ICHITSUBO
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Publication number: 20220162477Abstract: The polishing composition provided by the present invention contains an abrasive, a polyvinyl alcohol polymer as a water-soluble polymer, a basic compound, and water, and further contains a trivalent or higher polyvalent organic acid (salt).Type: ApplicationFiled: March 23, 2020Publication date: May 26, 2022Applicant: FUJIMI INCORPORATEDInventors: Yoshiko YAMAGUCHI, Osamu GOTO, Kohsuke TSUCHIYA, Taiki ICHITSUBO
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Patent number: 11332640Abstract: The present invention relates to a polishing composition containing an abrasive, a water-soluble polymer, an anionic surfactant, a basic compound, and water, in which the anionic surfactant has an oxyalkylene unit, and an average addition mole number of the oxyalkylene unit of the anionic surfactant is more than 3 and 25 or less. According to the present invention, it is possible to provide a polishing composition which can reduce the haze of a polished object and is also excellent in a polishing removal rate.Type: GrantFiled: February 8, 2017Date of Patent: May 17, 2022Assignee: FUJIMI INCORPORATEDInventors: Megumi Taniguchi, Kohsuke Tsuchiya, Maki Asada, Taiki Ichitsubo, Hisanori Tansho
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Publication number: 20210189177Abstract: Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.Type: ApplicationFiled: October 19, 2018Publication date: June 24, 2021Applicants: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.Inventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Yusuke SUGA, Taiki ICHITSUBO, Takayuki TAKEMOTO, Naohiko SAITO, Michihiro KAAI
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Patent number: 10745588Abstract: This invention provides a silicon wafer polishing composition used in the presence of an abrasive. The composition comprises a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-containing polymer has a building unit A in its main chain. The building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group. The carbonyl carbon atom constituting the secondary amide group or tertiary amide group is directly coupled to the main chain carbon atom.Type: GrantFiled: May 23, 2017Date of Patent: August 18, 2020Assignees: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.Inventors: Kohsuke Tsuchiya, Hisanori Tansho, Taiki Ichitsubo, Yoshio Mori
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Patent number: 10717899Abstract: Provided are polishing compositions comprising a water-soluble polymer and water. The water-soluble polymer of an embodiment has a repeat unit that does not have any hydroxyl groups, and the water-soluble polymer has a hydroxyl group content in a range of 4 mmol/g or higher and 21 mmol/g or lower. The water-soluble polymer of another embodiment has a repeat unit A that has a hydroxyl group and a repeat unit B, and the number of moles of the repeat unit B in the total number of moles of all the repeat units of the water-soluble polymer is 5% or greater.Type: GrantFiled: November 9, 2018Date of Patent: July 21, 2020Assignee: FUJIMI INCORPORATEDInventors: Kohsuke Tsuchiya, Hisanori Tansho, Taiki Ichitsubo
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Patent number: 10351732Abstract: Provided are a polishing composition comprising a water-soluble polymer that has a molecular structure comprising a plurality of repeat unit species having different SP values and a polishing composition exhibiting an etching rate and an abrasive adsorption in prescribed ranges when determined by prescribed methods. Also provided is a method for producing a polishing composition, using an abrasive, a basic compound, a water-soluble polymer having an alkaline-hydrolytic functional group, and water. The method comprises a step of obtaining an agent A comprising at least the basic compound and a step of obtaining an agent B comprising at least the water-soluble polymer H.Type: GrantFiled: March 14, 2014Date of Patent: July 16, 2019Assignee: FUJIMI INCORPORATEDInventors: Kohsuke Tsuchiya, Hisanori Tansho, Taiki Ichitsubo
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Publication number: 20190077992Abstract: Provided are polishing compositions comprising a water-soluble polymer and water. The water-soluble polymer of an embodiment has a repeat unit that does not have any hydroxyl groups, and the water-soluble polymer has a hydroxyl group content in a range of 4 mmol/g or higher and 21 mmol/g or lower. The water-soluble polymer of another embodiment has a repeat unit A that has a hydroxyl group and a repeat unit B, and the number of moles of the repeat unit B in the total number of moles of all the repeat units of the water-soluble polymer is 5% or greater.Type: ApplicationFiled: November 9, 2018Publication date: March 14, 2019Inventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Taiki ICHITSUBO
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Publication number: 20190062595Abstract: The present invention relates to a polishing composition containing an abrasive, a water-soluble polymer, an anionic surfactant, a basic compound, and water, in which the anionic surfactant has an oxyalkylene unit, and an average addition mole number of the oxyalkylene unit of the anionic surfactant is more than 3 and 25 or less. According to the present invention, it is possible to provide a polishing composition which can reduce the haze of a polished object and is also excellent in a polishing removal rate.Type: ApplicationFiled: February 8, 2017Publication date: February 28, 2019Applicant: FUJIMI INCORPORATEDInventors: Megumi TANIGUCHI, Kohsuke TSUCHIYA, Maki ASADA, Taiki ICHITSUBO, Hisanori TANSHO
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Publication number: 20190015947Abstract: To provide a polishing composition capable of realizing a polished surface having smoothness and few defects. A polishing composition contains a water-soluble polymer satisfying the following two conditions (A) and (B): Condition (A): in a first standard solution which contains silica having an average primary particle size of 35 nm, the water-soluble polymer, ammonia, and water and in which the concentration of the silica is 0.48% by mass, the concentration of the water-soluble polymer is 0.0125% by mass, and the pH is 10.0, the adsorption ratio which is a ratio of the amount of the water-soluble polymer adsorbed to the silica to the total amount of the water-soluble polymer contained in the first standard solution is 10% or more; and Condition (B): in a second standard solution which contains silica having an average primary particle size of 35 nm, the water-soluble polymer, ammonia, and water and in which the concentration of the silica is 0.48% by mass, the concentration of the water-soluble polymer is 0.Type: ApplicationFiled: December 16, 2016Publication date: January 17, 2019Applicant: FUJIMI INCORPORATEDInventors: Kohsuke TSUCHIYA, Taiki ICHITSUBO, Hisanori TANSHO, Yusuke SUGA
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Publication number: 20170253767Abstract: This invention provides a silicon wafer polishing composition used in the presence of an abrasive. The composition comprises a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-containing polymer has a building unit A in its main chain. The building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group. The carbonyl carbon atom constituting the secondary amide group or tertiary amide group is directly coupled to the main chain carbon atom.Type: ApplicationFiled: May 23, 2017Publication date: September 7, 2017Applicants: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.Inventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Taiki ICHITSUBO, Yoshio MORI
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Publication number: 20160272846Abstract: Provided are a polishing composition comprising a water-soluble polymer that has a molecular structure comprising a plurality of repeat unit species having different SP values and a polishing composition exhibiting an etching rate and an abrasive adsorption in prescribed ranges when determined by prescribed methods. Also provided is a method for producing a polishing composition, using an abrasive, a basic compound, a water-soluble polymer having an alkaline-hydrolytic functional group, and water. The method comprises a step of obtaining an agent A comprising at least the basic compound and a step of obtaining an agent B comprising at least the water-soluble polymer H.Type: ApplicationFiled: March 14, 2014Publication date: September 22, 2016Applicant: FUJIMI INCORPORATEDInventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Taiki ICHITSUBO
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Publication number: 20160122591Abstract: This invention provides a silicon wafer polishing composition used in the presence of an abrasive. The composition comprises a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-containing polymer has a building unit A in its main chain. The building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group. The carbonyl carbon atom constituting the secondary amide group or tertiary amide group is directly coupled to the main chain carbon atom.Type: ApplicationFiled: May 2, 2014Publication date: May 5, 2016Applicants: FUJIMI INCORPORATED, TOAGOSEI CO., LTD.Inventors: Kohsuke TSUCHIYA, Hisanori TANSHO, Taiki ICHITSUBO, Yoshio MORI