Patents by Inventor Taiki Minari

Taiki Minari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10829404
    Abstract: A full body of a glass sheet (G) is cut by forming an initial crack (6a) on a preset cutting line (5) of the glass sheet (G) that is supported by a support member (2 (8)) from a back surface side of the glass sheet (G), followed by propagating the initial crack (6a) while passing through the glass sheet from a front surface to the back surface thereof due to a stress generated through localized heating along the preset cutting line (5) and cooling of a heated region that is formed through the localized heating, the glass sheet (G) being supported by the support member (2 (8)) from the back surface side through an intermediation of an elastic sheet (E) having low thermal conductivity.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: November 10, 2020
    Assignee: Nippon Electric Glass Co., Ltd.
    Inventors: Yasuo Teranishi, Yasuhiro Matsumoto, Taiki Minari, Takaya Furuta
  • Patent number: 9458047
    Abstract: Provided is a method of cutting a glass sheet (G) by performing at least localized heating along a preset cutting line (5) of the glass sheet (G), the method comprising cutting a full body of the glass sheet (G) by performing at least the localized heating along the preset cutting line (5) of the glass sheet (G) under a state in which support members (2 (8)) for supporting, from a back surface side of the glass sheet (G), portions of the glass sheet (G) that are situated apart from the preset cutting line (5) toward both sides thereof are arranged apart from each other so as to form a space (S) on the back surface side of the preset cutting line (8).
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: October 4, 2016
    Assignee: NIPPON ELECTRIC GLASS CO., LTD.
    Inventors: Yasuo Teranishi, Yasuhiro Matsumoto, Taiki Minari, Takaya Furuta
  • Publication number: 20160122228
    Abstract: A full body of a glass sheet (G) is cut by forming an initial crack (6a) on a preset cutting line (5) of the glass sheet (G) that is supported by a support member (2 (8)) from a back surface side of the glass sheet (G), followed by propagating the initial crack (6a) while passing through the glass sheet from a front surface to the back surface thereof due to a stress generated through localized heating along the preset cutting line (5) and cooling of a heated region that is formed through the localized heating, the glass sheet (G) being supported by the support member (2 (8)) from the back surface side through an intermediation of an elastic sheet (E) having low thermal conductivity.
    Type: Application
    Filed: January 5, 2016
    Publication date: May 5, 2016
    Inventors: Yasuo TERANISHI, Yasuhiro MATSUMOTO, Taiki MINARI, Takaya FURUTA
  • Publication number: 20150014124
    Abstract: Provided is a glass substrate conveyance device (1), including a plurality of gripping means (10, 11) for gripping an upper edge portion (U) of a glass substrate (G) in a vertical posture so as to support the glass substrate (G) in a suspended manner, the glass substrate conveyance device (1) being configured to convey, in a conveyance direction (T) along the upper edge portion (U), the glass substrate (G) that is supported in the suspended manner by the plurality of gripping means (10, 11), in which the plurality of gripping means (10, 11) include at least one movable gripping means (10) that is changeable in position and/or posture in a horizontal plane.
    Type: Application
    Filed: January 11, 2013
    Publication date: January 15, 2015
    Applicant: Nippon Electric Glass Co., Ltd.
    Inventors: Hiroyuki Tagawa, Masao Tsukada, Akihisa Saeki, Taiki Minari
  • Publication number: 20140054348
    Abstract: A full body of a glass sheet (G) is cut by forming an initial crack (6a) on a preset cutting line (5) of the glass sheet (G) that is supported by a support member (2 (8)) from a back surface side of the glass sheet (G), followed by propagating the initial crack (6a) while passing through the glass sheet from a front surface to the back surface thereof due to a stress generated through localized heating along the preset cutting line (5) and cooling of a heated region that is formed through the localized heating, the glass sheet (G) being supported by the support member (2 (8)) from the back surface side through an intermediation of an elastic sheet (E) having low thermal conductivity.
    Type: Application
    Filed: June 8, 2011
    Publication date: February 27, 2014
    Inventors: Yasuo Teranishi, Yasuhiro Matsumoto, Taiki Minari, Takaya Furuta
  • Publication number: 20140017475
    Abstract: Provided is a method of cutting a glass sheet (G) by performing at least localized heating along a preset cutting line (5) of the glass sheet (G), the method comprising cutting a full body of the glass sheet (G) by performing at least the localized heating along the preset cutting line (5) of the glass sheet (G) under a state in which support members (2 (8)) for supporting, from a back surface side of the glass sheet (G), portions of the glass sheet (G) that are situated apart from the preset cutting line (5) toward both sides thereof are arranged apart from each other so as to form a space (S) on the back surface side of the preset cutting line (8).
    Type: Application
    Filed: June 7, 2011
    Publication date: January 16, 2014
    Inventors: Yasuo Teranishi, Yasuhiro Matsumoto, Taiki Minari, Takaya Furuta
  • Patent number: 8312741
    Abstract: In a cleaving apparatus for a glass film, an initial crack, which is formed at a leading end portion of a preset cleaving line of a glass film, is propagated along the preset cleaving line by a thermal stress generated in the glass film through localized heating performed along the preset cleaving line and cooling of a heated region resulting from the localized heating. At this time, a resin sheet having higher flexibility than the glass film is arranged in a cleaving region, and the resin sheet is floated by blowing a gas on a lower surface of the resin sheet by a floating unit. Then, a preset cleaving portion of the glass film including the preset cleaving line is lifted and supported while being covered with the floated resin sheet from below, and in this state, the glass film is cleaved.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: November 20, 2012
    Assignee: Nippon Electric Glass Co., Ltd.
    Inventors: Yasuo Teranishi, Yasuhiro Matsumoto, Taiki Minari, Takaya Furuta
  • Publication number: 20120017642
    Abstract: In a cleaving apparatus (1) for a glass film, an initial crack (10), which is formed at a leading end portion of a preset cleaving line (7) of a glass film (G), is propagated along the preset cleaving line (7) by a thermal stress generated in the glass film (G) through localized heating performed along the preset cleaving line (7) and cooling of a heated region resulting from the localized heating. At this time, a resin sheet (R) having higher flexibility than the glass film (G) is arranged in a cleaving region, and the resin sheet (R) is floated by blowing a gas on a lower surface of the resin sheet (R) by a floating unit (3). Then, a preset cleaving portion of the glass film (G) including the preset cleaving line (7) is lifted and supported while being covered with the floated resin sheet (R) from below, and in this state, the glass film (G) is cleaved.
    Type: Application
    Filed: July 19, 2011
    Publication date: January 26, 2012
    Inventors: Yasuo TERANISHI, Yasuhiro Matsumoto, Taiki Minari, Takaya Furuta