Patents by Inventor Taiki Nishi
Taiki Nishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11133445Abstract: Provided are a metal-base circuit board having excellent solder crack resistance, thermal conductivity, adhesive property, and insulation property and a resin composition for a circuit board used for the metal-base circuit board. A resin composition for a circuit board comprises a vinylsilyl group-containing polysiloxane (having a vinylsilyl group equivalent of 0.005 to 0.045 mol/kg) comprising (A) a dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 30,000 to 80,000 and (B) a side-chain dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 100,000 or more, a hydrosilyl group-containing polysiloxane (having a hydrosilyl group equivalent of 6 mol/kg or more), and an inorganic filler at 60 to 80% by volume. The mass ratio of (A) to (B), (A)/(B), is 80/20 to 30/70, and the molar ratio of (C) a hydrosilyl group to (D) a vinylsilyl group, (C)/(D), is 2.5 to 5.0.Type: GrantFiled: March 16, 2018Date of Patent: September 28, 2021Assignee: DENKA COMPANY LIMITEDInventors: Taiki Nishi, Katsunori Yashima, Yuki Kimoto, Ikuo Suyama, Katsumichi Kogure
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Patent number: 10487013Abstract: Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 ?m and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180° C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.Type: GrantFiled: March 10, 2017Date of Patent: November 26, 2019Assignee: Denka Company LimitedInventors: Taiki Nishi, Hideki Hirotsuru, Toshikatsu Mitsunaga, Saori Inoue
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Publication number: 20190355885Abstract: Provided are a metal-base circuit board having excellent solder crack resistance, thermal conductivity, adhesive property, and insulation property and a resin composition for a circuit board used for the metal-base circuit board. A resin composition for a circuit board comprises a vinylsilyl group-containing polysiloxane (having a vinylsilyl group equivalent of 0.005 to 0.045 mol/kg) comprising (A) a dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 30,000 to 80,000 and (B) a side-chain dual-end type vinylsilyl group-containing polysiloxane having a weight average molecular weight of 100,000 or more, a hydrosilyl group-containing polysiloxane (having a hydrosilyl group equivalent of 6 mol/kg or more), and an inorganic filler at 60 to 80% by volume. The mass ratio of (A) to (B), (A)/(B), is 80/20 to 30/70, and the molar ratio of (C) a hydrosilyl group to (D) a vinylsilyl group, (C)/(D), is 2.5 to 5.0.Type: ApplicationFiled: March 16, 2018Publication date: November 21, 2019Applicant: DENKA COMPANY LIMITEDInventors: Taiki NISHI, Katsunori YASHIMA, Yuki KIMOTO, Ikuo SUYAMA, Katsumichi KOGURE
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Publication number: 20190092695Abstract: Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 ?m and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180° C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.Type: ApplicationFiled: March 10, 2017Publication date: March 28, 2019Inventors: Taiki Nishi, Hideki Hirotsuru, Toshikatsu Mitsunaga, Saori Inoue
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Patent number: 9656868Abstract: Provided is a boron-nitride powder that is suitable for use in a resin composition for transmitting heat from a heat-producing electronic component such as a power device to a heat-dissipating member. The boron-nitride powder reduces thermal-conductivity anisotropy and thermal contact resistance, resulting in high thermal conductivity, and contains boron-nitride particles each consisting of hexagonal boron-nitride primary particles joined together. The boron-nitride powder, which is an aggregate of said boron-nitride particles, exhibits a mean sphericity of at least 0.70, a mean particle diameter of 20-100 ?m, a porosity of 50-80%, a mean pore diameter of 0.10-2.0 ?m, a maximum pore diameter of at most 10 ?m, and a calcium content of 500-5,000 ppm. Under X-ray powder diffraction, the graphitization index of the boron-nitride powder is preferably between 1.6 and 4.0, inclusive, and the peak intensity ratio (I(002)/I(100)) between the (002) plane and the (100) plane is preferably at most 9.0.Type: GrantFiled: March 7, 2014Date of Patent: May 23, 2017Assignee: DENKA COMPANY LIMITEDInventors: Taiki Nishi, Koki Ikarashi, Toshikatsu Mitsunaga
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Patent number: 9516741Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high reliability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 ?m, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.Type: GrantFiled: August 12, 2014Date of Patent: December 6, 2016Assignee: Denka Company LimitedInventors: Hideki Hirotsuru, Shuhei Nonaka, Toshikatsu Mitsunaga, Koki Ikarashi, Kouji Miyata, Taiki Nishi, Saori Inoue, Fumiya Kobayashi
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Publication number: 20160227644Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high relyability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 ?m, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.Type: ApplicationFiled: August 12, 2014Publication date: August 4, 2016Applicant: Denka Company LimitedInventors: Hideki HIROTSURU, Shuhei NONAKA, Toshikatsu MITSUNAGA, Koki IKARASHI, Kouji MIYATA, Taiki NISHI, Saori INOUE, Fumiya KOBAYASHI
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Publication number: 20160060112Abstract: Provided is a boron-nitride powder that is suitable for use in a resin composition for transmitting heat from a heat-producing electronic component such as a power device to a heat-dissipating member. The boron-nitride powder reduces thermal-conductivity anisotropy and thermal contact resistance, resulting in high thermal conductivity, and contains boron-nitride particles each consisting of hexagonal boron-nitride primary particles joined together. The boron-nitride powder, which is an aggregate of said boron-nitride particles, exhibits a mean sphericity of at least 0.70, a mean particle diameter of 20-100 ?m, a porosity of 50-80%, a mean pore diameter of 0.10-2.0 ?m, a maximum pore diameter of at most 10 ?m, and a calcium content of 500-5,000 ppm. Under X-ray powder diffraction, the graphitization index of the boron-nitride powder is preferably between 1.6 and 4.0, inclusive, and the peak intensity ratio (I(002)/I(100)) between the (002) plane and the (100) plane is preferably at most 9.0.Type: ApplicationFiled: March 7, 2014Publication date: March 3, 2016Inventors: Taiki NISHI, Koki IKARASHI, Toshikatsu MITSUNAGA
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Patent number: 8796145Abstract: A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.Type: GrantFiled: April 6, 2011Date of Patent: August 5, 2014Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Taiki Nishi, Takeshi Miyakawa, Katsunori Yashima, Kensuke Okoshi, Hidenori Ishikura
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Patent number: 8449143Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.Type: GrantFiled: May 14, 2008Date of Patent: May 28, 2013Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Takeshi Miyakawa, Kenji Miyata, Taiki Nishi, Yoshihiko Okajima
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Patent number: 8426740Abstract: A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C.Type: GrantFiled: May 21, 2009Date of Patent: April 23, 2013Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Taiki Nishi, Takeshi Miyakawa, Kiyokazu Yamazaki, Takashi Saiki
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Publication number: 20130056439Abstract: A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.Type: ApplicationFiled: April 6, 2011Publication date: March 7, 2013Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Taiki Nishi, Takeshi Miyakawa, Katsunori Yashima, Kensuke Okoshi, Hidenori Ishikura
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Publication number: 20110132644Abstract: Lifespan of LEDs can be lengthened, and the workability of the printed circuit board during circuit formation and during LED mounting can be improved. A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C.Type: ApplicationFiled: May 21, 2009Publication date: June 9, 2011Inventors: Taiki Nishi, Takeshi Miyakawa, Kiyokazu Yamazaki, Takashi Saiki
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Publication number: 20100164362Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.Type: ApplicationFiled: May 14, 2008Publication date: July 1, 2010Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Takeshi Miyakawa, Kenji Miyata, Taiki Nishi, Yoshihiko Okajima
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Publication number: 20100027261Abstract: To provide an LED light source unit which is excellent in heat dissipation performance, able to prevent damage to LED and bright, and which has a long life. An LED light source unit comprising a printed board, at least one light emitting diode provided on the printed board, and an adhesive tape for fixing the printed board on the surface of a heat dissipating member, wherein the thermal conductivity of the adhesive tape is from 1 to 4 W/mK, and the withstand voltage between a rear side conductor circuit and a metal housing is at least 1.0 kV.Type: ApplicationFiled: July 20, 2007Publication date: February 4, 2010Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Katsunori Yashima, Takeshi Miyakawa, Kenji Miyata, Taiki Nishi, Yoshihiko Okajima, Takuya Okada, Keiji Takano, Toshikatsu Mitsunaga
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Patent number: D1024861Type: GrantFiled: November 23, 2021Date of Patent: April 30, 2024Assignee: KUBOTA CORPORATIONInventors: Taiki Furuki, Ryoichi Nishi, Keiichi Higashino