Patents by Inventor Taiki Satou

Taiki Satou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing a semiconductor device
    Patent number: 10468328
    Abstract: A semiconductor device includes a conductive plate having a front surface on which a semiconductor element is mounted and a sealing resin sealing therein at least the front surface of the conductive plate. The conductive plate includes a structure that traps bubbles in a region where flows of the injected sealing resin merge. The conductive plate has a rectangular shape. The sealing resin is injected from a single inlet on a first longitudinal side of the conductive plate. The region where the flows of the sealing resin merge is a region of a corner of a second longitudinal side that across the semiconductor element, opposes the first longitudinal side from which the sealing resin is injected.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: November 5, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yuki Inaba, Taiki Satou
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20190122953
    Abstract: A semiconductor device includes a conductive plate having a front surface on which a semiconductor element is mounted and a sealing resin sealing therein at least the front surface of the conductive plate. The conductive plate includes a structure that traps bubbles in a region where flows of the injected sealing resin merge. The conductive plate has a rectangular shape. The sealing resin is injected from a single inlet on a first longitudinal side of the conductive plate. The region where the flows of the sealing resin merge is a region of a corner of a second longitudinal side that across the semiconductor element, opposes the first longitudinal side from which the sealing resin is injected.
    Type: Application
    Filed: August 28, 2018
    Publication date: April 25, 2019
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yuki INABA, Taiki Satou