Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: A current sensing circuit includes a sensing resistor, a current monitor, a variable resistor, and a processor. The sensing resistor is disposed on a to-be-sensed circuit and coupled between first and second first voltage terminals of the to-be-sensed circuit. The current monitor includes first and second terminals. A first winding is coupled between the first terminal and the first voltage terminal, and a second winding is coupled between the second terminal and the second voltage terminal. The variable resistor is connected in series with the first winding between the first voltage terminal and the first terminal. The current monitor obtains a sensed current according to a first voltage on the first terminal, a second voltage on the second terminal, and an impedance of the sensing resistor and generates a sensing signal. The processor determines whether to adjust an impedance of the variable resistor according to the sensing signal.

Abstract: A current sensing circuit includes a sensing resistor, a current monitor, a variable resistor, and a processor. The sensing resistor is disposed on a to-be-sensed circuit and coupled between first and second first voltage terminals of the to-be-sensed circuit. The current monitor includes first and second terminals. A first winding is coupled between the first terminal and the first voltage terminal, and a second winding is coupled between the second terminal and the second voltage terminal. The variable resistor is connected in series with the first winding between the first voltage terminal and the first terminal. The current monitor obtains a sensed current according to a first voltage on the first terminal, a second voltage on the second terminal, and an impedance of the sensing resistor and generates a sensing signal. The processor determines whether to adjust an impedance of the variable resistor according to the sensing signal.

Abstract: An electronic device including a switch unit and a socket is provided. The switch unit has an output end, a first input end, a second input end and a control end. The control end is coupled to the first input end. The socket has an intake cavity on which a first terminal and a second terminal are disposed. The first terminal is electrically connected to the first input end, and the second terminal is electrically connected to the second input end. When the intake cavity holds a plug and the control end receives a high level voltage, the control end switches the first input end to the output end. When the control end receives a ground voltage, the control end switches the second input end to the output end.

Abstract: A communication system having echo-cancelling mechanism is provided. The communication system communicates with a remote communication device. The communication system comprises a computer system end, a digital playback device, a sound-receiving module, a digital-to-analog (D/A) converter and a digital processing module. The computer system end receives a digital signal from the remote communication device. The digital playback device plays the digital signal to generate a sound signal. The sound-receiving module generates an analog audio signal comprising the sound signal. The D/A converter receives a digital sound signal of the digital signal and converts the digital sound signal to an analog sound signal. The digital processing module performs an echo-cancelling process on the analog audio signal according to the analog sound signal.

Abstract: An electronic device including a switch unit and a socket is provided. The switch unit has an output end, a first input end, a second input end and a control end. The control end is coupled to the first input end. The socket has an intake cavity on which a first terminal and a second terminal are disposed. The first terminal is electrically connected to the first input end, and the second terminal is electrically connected to the second input end. When the intake cavity holds a plug and the control end receives a high level voltage, the control end switches the first input end to the output end. When the control end receives a ground voltage, the control end switches the second input end to the output end.

Abstract: A communication system having a common ground mechanism is provided. The communication system comprises a local host, a local telephone device, a sound input path and a sound output path. The local telephone device is connected to a remote telephone device through a telecom facility. The sound input path comprises a first transformer module and is connected between the local telephone device and the local host such that the local telephone device may transfer a sound input to the local host. The sound output path comprises a second transformer module and is connected between the local telephone device and the local host such that the local telephone device may receive a sound output from the local host. The first and the second transformer modules couple a first ground of the telecom facility and a second ground of the local host together such that the first and second grounds are common-grounded.