Patents by Inventor Taimeng CHEN

Taimeng CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240083137
    Abstract: Embodiments of this application provide a composite structure including a substrate layer and a functional layer disposed on a surface of at least one side of the substrate layer. The substrate layer includes a first support member and a second support member that are disposed side by side and a bendable connecting member connected to and disposed between the first support member and the second support member. A material of the first support member and the second support member includes a hard rubber fiber composite material, and the functional layer includes one or more of an electrically conductive layer, a thermally conductive layer, or an impact-resistant layer.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Yuan QIN, Yangyang LI, Chun ZOU, Weiwei YAO, Nanjian SUN, Taimeng CHEN, Zhaoliang SU