Abstract: A lens unit according to an embodiment includes: a lens array that includes lens elements each provided with an optical axis and extends in a first direction; a support member that supports the lens array; and an adhesive that bonds the lens array and the support member. The support member includes a first adhesive holding portion with a specified depth in a direction of the optical axis and a second adhesive holding portion shallower than the first adhesive holding portion. The first adhesive holding portion and the second adhesive holding portion are aligned in the first direction. The adhesive is arranged at the first adhesive holding portion and the second adhesive holding portion.

Abstract: A lens unit according to an embodiment includes: a lens array that includes lens elements each provided with an optical axis and extends in a first direction; a support member that supports the lens array; and an adhesive that bonds the lens array and the support member. The support member includes a first adhesive holding portion with a specified depth in a direction of the optical axis and a second adhesive holding portion shallower than the first adhesive holding portion. The first adhesive holding portion and the second adhesive holding portion are aligned in the first direction. The adhesive is arranged at the first adhesive holding portion and the second adhesive holding portion.

Abstract: Provided is an exposure unit that performs exposure of an image supporting member and includes a light-emitting element array, and a lens array. The light-emitting element array includes light-emitting elements that are disposed in a first direction and each emit a light beam. The lens array faces the light-emitting element array in a second direction that is orthogonal to the first direction, and focuses the light beams. The following expressions (1) and (2) are satisfied. 175 ?m?L0?L1?250 ?m??(1) 175 ?m?L0?L2?250 ?m??(2) where L0 is a focal distance of the lens array in which a contrast, determined from a light amount distribution in the first direction of any of the light beams focused by the lens array, becomes maximum, and L2 is a distance from the lens array to the image supporting member.

Abstract: An optical head includes a lens array including resin lenses, a holder that holds the lens array, and a positioning mechanism that positions the holder such that the holder is opposed to a target. The positioning mechanism is configured to change a distance between the lens array and the target depending on a change in at least any one of temperature and humidity.

Abstract: A composite element chip includes a substrate; and a plurality of semiconductor thin-films disposed on the substrate and arranged in a predetermined direction which is a first direction. Each semiconductor thin-film includes an array of a plurality of light emitting portions which are arranged so that adjacent light emitting portions are displaced from each other by a predetermined distance in a second direction which is perpendicular to the first direction, the plurality of light emitting portions being arranged along an imaginary line. Each semiconductor thin-film has a first end that is parallel to the second direction; and a second end that extends along a pattern in which the plurality of light emitting portions are arranged and is parallel to the imaginary line. A semiconductor device and manufacturing method thereof, a printing head, and an image forming apparatus are also disclosed.

Abstract: An optical head includes a lens array including resin lenses, a holder that holds the lens array, and a positioning mechanism that positions the holder such that the holder is opposed to a target. The positioning mechanism is configured to change a distance between the lens array and the target depending on a change in at least any one of temperature and humidity.

Abstract: A semiconductor device includes a first semiconductor chip including a first upper surface and a first electrode pad provided on the first upper surface; a circuit component including a second upper surface disposed at a position lower than the first upper surface and a second electrode pad provided on the second upper surface, the circuit component being juxtaposed to the first semiconductor chip; an insulation member provided on the first upper surface and located closer to the second electrode pad than the first electrode pad is; and a wire extending from the first electrode pad to the second electrode pad and passing above the insulation member.

Abstract: A semiconductor apparatus includes a rectangular plate-like body including a major surface. A plurality of light emitting portions formed in the major surface, and aligned in a straight line. A first terraced portion and a second terraced portion are formed in the major surface except areas in which the plurality of light emitting portions are formed.

Abstract: A semiconductor light emitting apparatus includes a substrate. A plurality of first electrode wirings are formed on the surface of the substrate. At least one second electrode wiring is formed on the surface of the substrate. A light emitting section is connected between a corresponding one of the plurality of first electrode wirings and the at least one second electrode wiring. The light emitting section includes a plurality of light emitting elements.

Abstract: A semiconductor apparatus includes a rectangular plate-like body including a major surface. A plurality of light emitting portions formed in the major surface, and aligned in a straight line. A first terraced portion and a second terraced portion are formed in the major surface except areas in which the plurality of light emitting portions are formed.

Abstract: A light emitting element array includes a semiconductor thin-film layer in which a plurality of light emitting portions are arranged. The plurality of light emitting portions are driven to emit light in such a manner that an arrangement direction of the plurality of light emitting portions defines a main scanning direction. The plurality of light emitting portions are arranged in such a manner that adjacent light emitting portions are displaced from each other in a sub scanning direction perpendicular to the main scanning direction by a certain amount. An end portion of the semiconductor thin-film layer in the sub scanning direction has a shape along a pattern in which the plurality of light emitting portions are arranged.

Abstract: A semiconductor apparatus includes a substrate; and a plurality of semiconductor thin films formed on said substrate, each of said semiconductor thin films having a pn-junction, and electrodes of p-type and n-type for injecting carriers to the pn-junction, wherein said semiconductor thin films are formed so that all or a part of said pn-junctions are connected serially. As different from a semiconductor thin film constituted of a single pn-junction, the light emission with the invented semiconductor apparatus is the summation of the light emission intensities of the entire pn-junctions, so that the light emitting intensity can be increased largely.

Abstract: A semiconductor apparatus includes a substrate; and a plurality of semiconductor thin films formed on said substrate, each of said semiconductor thin films having a pn-junction, and electrodes of p-type and n-type for injecting carriers to the pn-junction, wherein said semiconductor thin films are formed so that all or a part of said pn-junctions are connected serially. As different from a semiconductor thin film constituted of a single pn-junction, the light emission with the invented semiconductor apparatus is the summation of the light emission intensities of the entire pn-junctions, so that the light emitting intensity can be increased largely.