Patents by Inventor Taison Ku

Taison Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260146330
    Abstract: A process module configured for performing concurrent epitaxial deposition of material layers is disclosed. The process module includes a common chamber housing having a support framework. Within the housing, two chamber bodies are laterally spaced and positioned above each chamber body are upper lamp housings. The process module features lift assemblies configured to independently lift the lamp housings to provide access to the lamps within. Semiconductor processing system including process modules having independent lift assemblies are also disclosed.
    Type: Application
    Filed: November 24, 2025
    Publication date: May 28, 2026
    Inventors: Partha Sarathy Reddy Kudala, Fan Gao, Kishor Patil, Taison Ku, Junwei Su, Yue Zhao
  • Publication number: 20260146364
    Abstract: A process module configured for performing concurrent epitaxial deposition of material layers is disclosed. The module comprises a common chamber housing with two chamber bodies disposed within it. Each chamber body includes a ceramic weldment with upper and lower walls, injection and exhaust chamber flanges, and exhaust flanges with inner and outer sealing surfaces. Cover plates form seals with the outer sealing surfaces of the exhaust flanges. The module also features pressure cylinders with pistons that apply compressive forces between the exhaust and injection chamber flanges. A semiconductor processing system including such process modules are also disclosed.
    Type: Application
    Filed: November 24, 2025
    Publication date: May 28, 2026
    Inventors: Fan Gao, Junwei Su, Yanfu Lu, Aniket Chitale, Omar Elleuch, Alexandros Demos, Amin Azimi, Partha Sarathy Reddy Kudala, Kishor Patil, Taison Ku, Rohan Kota
  • Publication number: 20250369107
    Abstract: A container assembly is provided. The container assembly includes a vessel, a conduit and a jacket. The vessel is formed from a first material having a first thermal conductivity, the conduit is seated in the vessel and is in communication with an interior of the vessel, and the jacket extends about the vessel and is formed from a second material having a second thermal conductivity. The second thermal conductivity is greater than the first thermal conductivity and the jacket is affixed to the vessel with an interference fit to limit resistance to heat flow between the vessel and the jacket. Chamber arrangements and semiconductor processing systems, material layer deposition methods and methods of making container assemblies are provided.
    Type: Application
    Filed: May 29, 2025
    Publication date: December 4, 2025
    Inventors: Aniket Chitale, Fan Gao, Wentao Wang, Junwei Su, Mingyang Ma, Jingcheng Zhou, Taison Ku, Steven Harris
  • Publication number: 20250300000
    Abstract: Susceptors, related systems, and related methods are described. Susceptors according to an embodiment of the present disclosure comprise a plurality of contact knobs. The ones from the plurality of contact knobs may be honed.
    Type: Application
    Filed: March 20, 2025
    Publication date: September 25, 2025
    Inventors: Ion Hong Chao, Fan Gao, Wentao Wang, Junwei Su, Taison Ku, Kishor Patil, Ivan Hernandez del Castillo, Gregory Deye, Steven Bopp, Caleb Miskin, Alexandros Demos, Shantanu Sinha
  • Patent number: 6409473
    Abstract: An assembly comprising a ceramic vane with a metal housing cast around the ends of the vane. The ceramic vane has dovetailed shaped grooves along its edges that extend from the vane's leading edge to its trailing edge. The housing is comprised of two spaced apart walls each having dovetailed protrusions for mating with the dovetail grooves in the vanes's edges. Upon the casting of the walls to the vane at least one surface of each dovetail groove comes in contact with at least one surface of the dovetail protrusion. A crushable coating is disposed between the vane's edges and the dovetail protrusions.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: June 25, 2002
    Assignee: Honeywell International, Inc.
    Inventors: E-June Chen, Bjoern Schenk, Ramesh Bapat, I. Gene Fowkes, Brian Gracias, Shen-Yeh Chen, Taison Ku, Josef Paluch, II