Patents by Inventor Taisuke Ahiko

Taisuke Ahiko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7735713
    Abstract: A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: June 15, 2010
    Assignee: TDK Corporation
    Inventors: Naruki Kataoka, Taisuke Ahiko, Akitoshi Yoshii, Akira Goshima, Takashi Aoki, Tomohiro Sogabe
  • Patent number: 7584853
    Abstract: The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: September 8, 2009
    Assignee: TDK Corporation
    Inventors: Akitoshi Yoshii, Taisuke Ahiko, Tooru Suda, Tsuyoshi Takashima, Yasushi Izumibe
  • Patent number: 7586174
    Abstract: A multilayer capacitor comprised of dielectric layers stacked to form a device body in which a plurality of first internal electrode layers and a plurality of second internal electrode layers formed in planar shapes are alternately arranged while being separated through the dielectric layers, wherein the first external electrodes and second external electrodes are arranged at only a first end face of the device body, lead use columnar electrodes connect the internal electrode layers stacked close to the first end face of the device body and external electrodes, interlayer connection use columnar electrodes connect the internal electrode layers stacked at the inside of the device body, and the interlayer connection use columnar electrodes have cross-sectional areas larger than the cross-sectional areas of the lead use columnar electrodes.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: September 8, 2009
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Patent number: 7391219
    Abstract: A chip type electronic component for test is provided with an element body, and four or more terminal electrodes placed on the exterior of the element body. The element body has a plurality of laminated insulator layers, and a plurality of internal electrodes arranged to be opposed to each other with the insulator layer in between. Each of the internal electrodes is connected to at least one same terminal electrode out of the four or more terminal electrodes and connected to any one terminal electrode except for the at least one same terminal electrode.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: June 24, 2008
    Assignee: TDK Corporation
    Inventors: Taisuke Ahiko, Sunao Masuda, Masaaki Togashi, Takashi Chiba
  • Patent number: 7388737
    Abstract: A multilayer capacitor has a multilayer body in which multiple dielectric layers and multiple inner electrodes are alternately laminated, and multiple terminal electrodes formed on the multilayer body. The multiple inner electrodes include multiple first inner electrodes and multiple second inner electrodes alternately arranged. The multiple terminal electrodes include first and second terminal electrodes electrically insulated from each other. The multiple first inner electrodes are electrically connected to each other by way of a through-hole conductor. The multiple second inner electrodes are electrically connected to each other by way of a through-hole conductor.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: June 17, 2008
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Patent number: 7339781
    Abstract: An electronic component having an element body, and a terminal electrode disposed on the element body. The terminal electrode has a first electrode layer, a second electrode layer, and a third electrode layer. The first electrode layer is formed on an external surface of the element body and formed by baking of a conductive paste. The second electrode layer is formed by Ni plating on the first electrode layer. The third electrode layer is formed by Sn plating or Sn alloy plating on the second electrode layer. A thickness of the second electrode layer is set in a range of not less than 5 ?m, and less than 8 ?m.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: March 4, 2008
    Assignee: TDK Corporation
    Inventors: Akitoshi Yoshii, Taisuke Ahiko, Masumi Miyairi, Akio Kikuchi
  • Patent number: 7312975
    Abstract: A laminated capacitor includes: a dielectric body; first terminal electrodes arranged at intervals on one surface of the dielectric body; second terminal electrodes arranged at intervals on the surface of the dielectric body; first internal electrodes arranged in layers within the dielectric body; second internal electrodes arranged in layers within the dielectric body to alternate with the first internal electrodes; first outer through-hole conductors each connecting each first terminal electrode to one first internal electrode which is located closest to the surface of the dielectric body among the first internal electrodes; second outer through-hole conductors each connecting each second terminal electrode to one second internal electrode which is located closest to the surface of the dielectric body among the second internal electrodes; a first inner through-hole conductor connecting the first internal electrodes to one another; and a second inner through-hole conductor connecting the second internal elec
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: December 25, 2007
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Patent number: 7304831
    Abstract: A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: December 4, 2007
    Assignee: TDK Corporation
    Inventors: Akitoshi Yoshii, Taisuke Ahiko, Atsushi Takeda, Shirou Ootsuki, Shinya Onodera, Miki Kimura, Hiromi Kikuchi
  • Patent number: 7298604
    Abstract: A multilayer capacitor includes a multilayer body in which dielectric layers and inner electrodes are alternately laminated, and terminal electrodes formed on the multilayer body. The inner electrodes include first inner electrodes and second inner electrodes alternately arranged. The terminal electrodes include at least three terminal electrodes. The first inner electrodes are electrically connected to each other via a through-hole conductor. The second inner electrodes are electrically connected to each other via a through-hole conductor. At least two first inner electrodes in the first inner electrodes are electrically connected via a lead conductor to at least two respective terminal electrodes whose number is smaller than the total number of the terminal electrodes by at least 1 in the at least three terminal electrodes.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: November 20, 2007
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Publication number: 20070242405
    Abstract: A chip type electronic component for test is provided with an element body, and four or more terminal electrodes placed on the exterior of the element body. The element body has a plurality of laminated insulator layers, and a plurality of internal electrodes arranged to be opposed to each other with the insulator layer in between. Each of the internal electrodes is connected to at least one same terminal electrode out of the four or more terminal electrodes and connected to any one terminal electrode except for the at least one same terminal electrode.
    Type: Application
    Filed: April 6, 2007
    Publication date: October 18, 2007
    Applicant: TDK CORPORATION
    Inventors: Taisuke Ahiko, Sunao Masuda, Masaaki Togashi, Takashi Chiba
  • Publication number: 20070145101
    Abstract: A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.
    Type: Application
    Filed: November 22, 2006
    Publication date: June 28, 2007
    Applicant: TDK CORPORATION
    Inventors: Naruki Kataoka, Taisuke Ahiko, Akitoshi Yoshii, Akira Goshima, Takashi Aoki, Tomohiro Sogabe
  • Patent number: 7224572
    Abstract: A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of the dielectric element. A pair of the second inner conductors is respectively led out to two opposing side surfaces different from the two opposing side surfaces to which the first inner conductors are respectively led out. Terminal electrodes are respectively disposed on four side surfaces of the dielectric element for connection with these four inner conductors respectively.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: May 29, 2007
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Patent number: 7224569
    Abstract: A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of the dielectric element. A pair of the second inner conductors is respectively led out to two opposing side surfaces different from the two opposing side surfaces to which the first inner conductors are respectively led out. Terminal electrodes are respectively disposed on four side surfaces of the dielectric element for connection with these four inner conductors respectively.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: May 29, 2007
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Patent number: 7196897
    Abstract: A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of the dielectric element. A pair of the second inner conductors is respectively led out to two opposing side surfaces different from the two opposing side surfaces to which the first inner conductors are respectively led out. Terminal electrodes are respectively disposed on four side surfaces of the dielectric element for connection with these four inner conductors respectively.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: March 27, 2007
    Assignee: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Publication number: 20070064374
    Abstract: A laminated capacitor includes: a dielectric body; first terminal electrodes arranged at intervals on one surface of the dielectric body; second terminal electrodes arranged at intervals on the surface of the dielectric body; first internal electrodes arranged in layers within the dielectric body; second internal electrodes arranged in layers within the dielectric body to alternate with the first internal electrodes; first outer through-hole conductors each connecting each first terminal electrode to one first internal electrode which is located closest to the surface of the dielectric body among the first internal electrodes; second outer through-hole conductors each connecting each second terminal electrode to one second internal electrode which is located closest to the surface of the dielectric body among the second internal electrodes; a first inner through-hole conductor connecting the first internal electrodes to one another; and a second inner through-hole conductor connecting the second internal elec
    Type: Application
    Filed: June 23, 2006
    Publication date: March 22, 2007
    Applicant: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Patent number: 7177138
    Abstract: A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the chip element body. The chip element body has one side face acting as a mounting surface opposing a circuit substrate. The pair of terminal electrodes include an electrode portion formed on the mounting surface. Here, it is assumed that a first direction is a direction orthogonal to the mounting surface, a second direction is a direction along which the pair of terminal electrodes oppose each other on the mounting surface, and a third direction is a direction orthogonal to the first and second directions.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: February 13, 2007
    Assignee: TDK Corporation
    Inventors: Akitoshi Yoshii, Taisuke Ahiko, Shirou Ootsuki, Takashi Aoki, Akira Goshima, Hiroki Houchi
  • Publication number: 20070025057
    Abstract: A multilayer capacitor comprised of dielectric layers stacked to form a device body in which a plurality of first internal electrode layers and a plurality of second internal electrode layers formed in planar shapes are alternately arranged while being separated through the dielectric layers, wherein the first external electrodes and second external electrodes are arranged at only a first end face of the device body, lead use columnar electrodes connect the internal electrode layers stacked close to the first end face of the device body and external electrodes, interlayer connection use columnar electrodes connect the internal electrode layers stacked at the inside of the device body, and the interlayer connection use columnar electrodes have cross-sectional areas larger than the cross-sectional areas of the lead use columnar electrodes.
    Type: Application
    Filed: July 21, 2006
    Publication date: February 1, 2007
    Applicant: TDK Corporation
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Publication number: 20060203425
    Abstract: A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of the dielectric element. A pair of the second inner conductors is respectively led out to two opposing side surfaces different from the two opposing side surfaces to which the first inner conductors are respectively led out. Terminal electrodes are respectively disposed on four side surfaces of the dielectric element for connection with these four inner conductors respectively.
    Type: Application
    Filed: May 15, 2006
    Publication date: September 14, 2006
    Applicant: TDK CORPORATION
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Publication number: 20060203427
    Abstract: A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of the dielectric element. A pair of the second inner conductors is respectively led out to two opposing side surfaces different from the two opposing side surfaces to which the first inner conductors are respectively led out. Terminal electrodes are respectively disposed on four side surfaces of the dielectric element for connection with these four inner conductors respectively.
    Type: Application
    Filed: May 15, 2006
    Publication date: September 14, 2006
    Applicant: TDK CORPORATION
    Inventors: Masaaki Togashi, Taisuke Ahiko
  • Publication number: 20060203426
    Abstract: A first inner conductor, a second inner conductor, a first inner conductor, and a second inner conductor are disposed in the order mentioned from the top in the dielectric element. The first inner conductors are respectively led out to two opposing side surfaces of the dielectric element. A pair of the second inner conductors is respectively led out to two opposing side surfaces different from the two opposing side surfaces to which the first inner conductors are respectively led out. Terminal electrodes are respectively disposed on four side surfaces of the dielectric element for connection with these four inner conductors respectively.
    Type: Application
    Filed: May 15, 2006
    Publication date: September 14, 2006
    Applicant: TDK CORPORATION
    Inventors: Masaaki Togashi, Taisuke Ahiko