Patents by Inventor Taisuke Wakasa

Taisuke Wakasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encoder scale and manufacturing and attaching method thereof
    Patent number: 9739642
    Abstract: An encoder scale, displaced relative to a detector head, includes: an insulating substrate; a conductive adhesive layer that is formed on the insulating substrate; and conductive pattern layers that are formed on the adhesive layer in a shape enabling the detector head to detect a position, wherein: the adhesive layer electrically connects all the pattern layers and includes an out-of-detection-range pattern that extends outward from a position detection range of the detector head; and the out-of-detection-range pattern is grounded via a conductive member.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: August 22, 2017
    Assignee: MITUTOYO CORPORATION
    Inventors: Takanori Otsuka, Taisuke Wakasa, Kouichi Yoshihara, Ryo Morita, Kazuhiko Kodama
  • ENCODER SCALE AND MANUFACTURING AND ATTACHING METHOD THEREOF
    Publication number: 20160313144
    Abstract: An encoder scale, displaced relative to a detector head, includes: an insulating substrate; a conductive adhesive layer that is formed on the insulating substrate; and conductive pattern layers that are formed on the adhesive layer in a shape enabling the detector head to detect a position, wherein: the adhesive layer electrically connects all the pattern layers and includes an out-of-detection-range pattern that extends outward from a position detection range of the detector head; and the out-of-detection-range pattern is grounded via a conductive member.
    Type: Application
    Filed: April 21, 2016
    Publication date: October 27, 2016
    Inventors: Takanori Otsuka, Taisuke Wakasa, Kouichi Yoshihara, Ryo Morita, Kazuhiko Kodama