Abstract: An electric component includes: a semiconductor component including a heat radiating portion, a semiconductor element, a lead terminal, and a coating resin coating a part of each of the above; a wiring board including a first mounting portion, a second mounting portion, and an insulating substrate; a first solder connecting the first mounting portion and the heat radiating portion; and a second solder connecting the second mounting portion and the lead terminal. The first solder includes (a) a solder connecting portion connecting the heat radiating portion and the first mounting portion and (b) a flux provided around the solder connecting portion, and a third space which is provided as a space after excluding a second space that is an overlap of the heat radiating portion and the first mounting portion from a first space.