Abstract: According to one embodiment of the present disclosure, there is provided a technique that includes: a load lock chamber into which a substrate is loaded and from which the substrate is unloaded; a substrate support provided in the load lock chamber and configured to support a plurality of substrates comprising the substrate in a multistage manner with a predetermined interval therebetween; and a temperature sensor capable of measuring a temperature of the substrate support in a non-contact manner while the plurality of substrates are supported by the substrate support.

Abstract: There is provided a technique for easily adjusting the inner atmosphere of the transfer chamber as desired when forming the air flow in the transfer chamber by using different gases. According to one aspect thereof, there is provided a technique including: a transfer chamber including a transfer space; a first purge gas supplier; a second purge gas supplier; an exhauster; a circulation path connecting two ends of the transfer space; a fan provided on the circulation path or at an end portion of the circulation path to circulate the inner atmosphere of the transfer chamber; and a controller for controlling the fan such that a rotational speed of the fan varies between a first purge mode where the first purge gas is supplied through the first purge gas supplier and a second purge mode where the second purge gas is supplied through the second purge gas supplier.