Abstract: A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet, and an outflow pipe connected to the cooling-liquid outlet. The casing includes a cooling-liquid outflow portion, and the cooling-liquid outlet is formed in a top wall of the cooling-liquid outflow portion. The outflow pipe has a bottom wall parallel to a portion of the top wall of the cooling-liquid outflow portion where the cooling-liquid outlet is formed. The bottom wall has a through hole for communication with the cooling-liquid outlet. A guide portion is provided on a portion of an upper surface of a bottom wall of the cooling-liquid outflow portion, the portion corresponding to the cooling-liquid outlet, so as to change, toward an upward direction, the flow direction of cooling liquid flowing into the cooling-liquid outflow portion. Thus, a flow resistance which cooling liquid undergoes when flowing out of the casing can be reduced.

Abstract: A liquid-cooled-type cooling device includes a casing which has a cooling-liquid inlet formed at a rear end portion of the casing and a cooling-liquid outlet formed at a front end portion of the casing. A corrugated fin for forming a plurality of flow channels through which a cooling liquid flows from the rear side toward the front side is disposed within the casing to be located between the cooling-liquid inlet and the cooling-liquid outlet. A heat-generating-body mounting region is provided on an outer surface of a top wall of the casing. Projections which come into contact with front and rear end portions of the corrugated fin to thereby position the corrugated fin in the front-rear direction are provided on an inner surface of the bottom wall of the casing at positions shifted, in the left-right direction, from an inner surface region corresponding to the heat-generating-body mounting region.

Abstract: A casing of a liquid-cooled-type cooling device has a peripheral wall including mutually facing right and left side walls. A cooling-liquid inlet is formed at one end of the right side wall, and a cooling-liquid outlet is formed at an end of the left side wall corresponding to the other end of the right side wall. A parallel-flow-channel section is provided within the casing to be located between the left and right side walls and between the cooling-liquid inlet and outlet and includes flow channels through which cooling liquid flows. Internal regions of the casing located upstream and downstream of the parallel-flow-channel section serve as inlet and outlet header sections, respectively. The cross-sectional area of the inlet header section reduces from the cooling-liquid inlet toward the left side wall. The outlet and inlet header sections are asymmetric in shape with respect to the width direction of the parallel-flow-channel section.

Abstract: A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet. A fin for forming flow channels is disposed within the casing between the inlet and the outlet. A portion of the interior of the casing located rearward of the fin is an inlet header section, and a portion of the interior of the casing located frontward of the fin is an outlet header section. A rear side surface within the inlet header section is skewed toward the fin in a direction from the right side toward the left side. A positioning vertical surface extending straight along the left-right direction and positioning a rear end portion of the fin is provided on a lower portion of a left end portion of the rear side surface within the inlet header section. The rear end portion of the fin is in contact with the positioning vertical surface.

Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Abstract: A liquid-cooled-type cooling device includes a casing having a cooling-liquid flow channel. Fins are provided on an inner surface of a top wall of the casing. Each fin has a wavy shape on a horizontal plane perpendicular to a fin height direction. In a left fin of two adjacent fins, lines of intersection between the horizontal plane and right side surfaces of two slant portions connecting two adjacent wave crest portions and a wave trough portion therebetween intersect each other at a first point located on a first straight line. In a right fin, lines of intersection between the horizontal plane and left side surfaces of two slant portions connecting two adjacent wave trough portions and a wave crest portion therebetween intersect each other at a second point located on a second straight line. The first straight line is located on the right fin side of the second straight line.

Abstract: A casing of a liquid-cooled-type cooling device has a peripheral wall including mutually facing right and left side walls. A cooling-liquid inlet is formed at one end of the right side wall, and a cooling-liquid outlet is formed at an end of the left side wall corresponding to the other end of the right side wall. A parallel-flow-channel section is provided within the casing to be located between the left and right side walls and between the cooling-liquid inlet and outlet and includes flow channels through which cooling liquid flows. Internal regions of the casing located upstream and downstream of the parallel-flow-channel section serve as inlet and outlet header sections, respectively. The cross-sectional area of the inlet header section reduces from the cooling-liquid inlet toward the left side wall. The outlet and inlet header sections are asymmetric in shape with respect to the width direction of the parallel-flow-channel section.

Abstract: A liquid-cooled-type cooling device includes a casing which has a cooling-liquid inlet formed at a rear end portion of the casing and a cooling-liquid outlet formed at a front end portion of the casing. A corrugated fin for forming a plurality of flow channels through which a cooling liquid flows from the rear side toward the front side is disposed within the casing to be located between the cooling-liquid inlet and the cooling-liquid outlet. A heat-generating-body mounting region is provided on an outer surface of a top wall of the casing. Projections which come into contact with front and rear end portions of the corrugated fin to thereby position the corrugated fin in the front-rear direction are provided on an inner surface of the bottom wall of the casing at positions shifted, in the left-right direction, from an inner surface region corresponding to the heat-generating-body mounting region.

Abstract: A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet. A fin for forming flow channels is disposed within the casing between the inlet and the outlet. A portion of the interior of the casing located rearward of the fin is an inlet header section, and a portion of the interior of the casing located frontward of the fin is an outlet header section. A rear side surface within the inlet header section is skewed toward the fin in a direction from the right side toward the left side. A positioning vertical surface extending straight along the left-right direction and positioning a rear end portion of the fin is provided on a lower portion of a left end portion of the rear side surface within the inlet header section. The rear end portion of the fin is in contact with the positioning vertical surface.

Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Abstract: A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet, and an outflow pipe connected to the cooling-liquid outlet. The casing includes a cooling-liquid outflow portion, and the cooling-liquid outlet is formed in a top wall of the cooling-liquid outflow portion. The outflow pipe has a bottom wall parallel to a portion of the top wall of the cooling-liquid outflow portion where the cooling-liquid outlet is formed. The bottom wall has a through hole for communication with the cooling-liquid outlet. A guide portion is provided on a portion of an upper surface of a bottom wall of the cooling-liquid outflow portion, the portion corresponding to the cooling-liquid outlet, so as to change, toward an upward direction, the flow direction of cooling liquid flowing into the cooling-liquid outflow portion. Thus, a flow resistance which cooling liquid undergoes when flowing out of the casing can be reduced.