Patents by Inventor Taizo Nishimura
Taizo Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11867580Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.Type: GrantFiled: June 10, 2022Date of Patent: January 9, 2024Assignee: SONY GROUP CORPORATIONInventors: Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Ken Kobayashi, Tetsuro Goto, Yoshiaki Sakakura, Kei Tsukamoto, Hayato Hasegawa, Manami Miyawaki
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Publication number: 20220390303Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.Type: ApplicationFiled: June 10, 2022Publication date: December 8, 2022Applicant: SONY GROUP CORPORATIONInventors: Tomoko KATSUHARA, Akira EBISUI, Taizo NISHIMURA, Ken KOBAYASHI, Tetsuro GOTO, Yoshiaki SAKAKURA, Kei TSUKAMOTO, Hayato HASEGAWA, Manami MIYAWAKI
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Publication number: 20220394846Abstract: A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion.Type: ApplicationFiled: October 13, 2020Publication date: December 8, 2022Inventors: HIROSHI KAWAI, TAIZO NISHIMURA, MASAHIKO SHIMIZU, TAKAYUKI TANAKA, NAOHIRO TAKAHASHI
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Patent number: 11402283Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.Type: GrantFiled: September 14, 2017Date of Patent: August 2, 2022Assignee: SONY CORPORATIONInventors: Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Ken Kobayashi, Tetsuro Goto, Yoshiaki Sakakura, Kei Tsukamoto, Hayato Hasegawa, Manami Miyawaki
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Publication number: 20220049997Abstract: A pressure sensor is a pressure sensor that includes: a capacitive sensor electrode layer that includes a plurality of sensing units; a first reference electrode layer that faces a first surface of the sensor electrode layer; a second reference electrode layer that faces a second surface of the sensor electrode layer; an elastic layer disposed between the first reference electrode layer and the sensor electrode layer; and a gap layer disposed between the second reference electrode layer and the sensor electrode layer. In the pressure sensor, the sensor electrode layer, the first reference electrode layer, and the second reference electrode layer have a slit.Type: ApplicationFiled: December 3, 2019Publication date: February 17, 2022Inventors: Tomoko KATSUHARA, Kei TSUKAMOTO, Hiroshi MIZUNO, Taizo NISHIMURA
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Publication number: 20210181897Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.Type: ApplicationFiled: September 14, 2017Publication date: June 17, 2021Applicant: SONY CORPORATIONInventors: Tomoko KATSUHARA, Akira EBISUI, Taizo NISHIMURA, Ken KOBAYASHI, Tetsuro GOTO, Yoshiaki SAKAKURA, Kei TSUKAMOTO, Hayato HASEGAWA, Manami MIYAWAKI
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Patent number: 11029221Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body. The pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit. The first deformation layer and the second deformation layer satisfy a predetermined relationship.Type: GrantFiled: February 16, 2018Date of Patent: June 8, 2021Assignee: Sony CorporationInventors: Ken Kobayashi, Akira Ebisui, Kei Tsukamoto, Taizo Nishimura, Tetsuro Goto, Tomoki Kawabata, Makoto Yamaguchi
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Publication number: 20210132704Abstract: A sensor includes: a sensor layer including a capacitive sensing section; and a metal layer facing a surface on one side of the sensor layer, in which the metal layer has projected portions provided at peripheral edges of regions facing the sensing sections.Type: ApplicationFiled: March 1, 2018Publication date: May 6, 2021Applicant: Sony CorporationInventors: Tomoki Kawabata, Hiroshi Mizuno, Ken Kobayashi, Akira Ebisui, Taizo Nishimura
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Patent number: 10936128Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: GrantFiled: August 26, 2019Date of Patent: March 2, 2021Assignee: Sony CorporationInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 10871846Abstract: A sensor panel includes a sensor section that detects magnetic force of a contacting surface or a region in the vicinity of the contacting surface on a basis of a change in capacitance and is allowed to output a signal depending on the change in capacitance along with information on a position where the change in capacitance has occurred.Type: GrantFiled: April 15, 2015Date of Patent: December 22, 2020Assignee: SONY CORPORATIONInventors: Taizo Nishimura, Hiroto Kawaguchi, Hiroshi Mizuno, Shogo Shinkai, Fumihiko Iida, Akira Ebisui, Kei Tsukamoto, Tomoko Katsuhara
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Patent number: 10671180Abstract: Provided are an input device and an electronic apparatus each including capacitive elements and being capable of allowing a plurality of information items to be separately input by simple operations. The input device includes: a capacitive element; a conductor that can be electrostatically coupled to the capacitive element; an operation portion that allows a load to be applied to the conductor; and a retaining portion that retains the conductor apart from the capacitive element. The retaining portion is capable of displacing the conductor with respect to the capacitive element in a stepwise manner in accordance with the load that is applied to the conductor through intermediation of the operation portion, and is capable of retaining the conductor at a plurality of positions with respect to the capacitive element.Type: GrantFiled: February 16, 2016Date of Patent: June 2, 2020Assignee: SONY CORPORATIONInventors: Taizo Nishimura, Hiroto Kawaguchi, Hiroshi Mizuno, Takashi Itaya, Akira Ebisui, Tomoko Katsuhara, Yoshiteru Taka
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Patent number: 10627297Abstract: A sensor includes a base layer and a pressing unit protruding with respect to the base layer. The pressing unit includes a first structure unit and a hollow second structure unit disposed on the first structure unit and having a bottom side opened. The second structure unit has a shape portion on a surface facing the base layer.Type: GrantFiled: March 21, 2017Date of Patent: April 21, 2020Assignee: SONY CORPORATIONInventors: Akira Ebisui, Hiroshi Mizuno, Tomoko Katsuhara, Taizo Nishimura, Yoshiaki Sakakura, Toshio Kano, Toshiyuki Onodera, Takeshi Takahashi, Toru Takahashi, Tatsuo Suzuki
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Publication number: 20200097106Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: ApplicationFiled: August 26, 2019Publication date: March 26, 2020Applicant: Sony CorporationInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Publication number: 20190376852Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a first surface and a second surface; a support body supporting the pressure-sensitive sensor such that the exterior body faces the first surface; and a first deformation layer disposed at least either between the first surface and the exterior body or between the second surface and the support body. The pressure-sensitive sensor includes a capacitive sensor electrode unit including a sensing unit, a reference electrode layer, and a second deformation layer disposed between the reference electrode layer and the sensor electrode unit. The first deformation layer and the second deformation layer satisfy a predetermined relationship.Type: ApplicationFiled: February 16, 2018Publication date: December 12, 2019Inventors: Ken KOBAYASHI, Akira EBISUI, Kei TSUKAMOTO, Taizo NISHIMURA, Tetsuro GOTO, Tomoki KAWABATA, Makoto YAMAGUCHI
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Patent number: 10394339Abstract: A sensor is provided with a conductor layer, a sensor layer including a plurality of sensor units, and a separating layer which separates the conductor layer from the sensor layer, the sensor unit is formed of alternately arranged first and second electrode elements, and sensitivity on an outer periphery of the sensor unit is higher than the sensitivity in a central portion of the sensor unit.Type: GrantFiled: December 21, 2015Date of Patent: August 27, 2019Assignee: SONY CORPORATIONInventors: Akira Ebisui, Hiroto Kawaguchi, Tomoko Katsuhara, Hiroshi Mizuno, Taizo Nishimura
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Patent number: 10386971Abstract: A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.Type: GrantFiled: July 23, 2014Date of Patent: August 20, 2019Assignee: SONY CORPORATIONInventors: Taizo Nishimura, Fumihiko Iida, Hiroshi Mizuno, Yasuyuki Abe, Takayuki Tanaka, Hayato Hasegawa, Shogo Shinkai
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Patent number: 10282041Abstract: Provided is a sensor device, including: a deformable first surface; a second surface facing the first surface; an electrode board between the first surface and the second surface, the electrode board including a plurality of capacitive elements arranged in a matrix; a support including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support being deformable following deformation of the first surface, the support connecting at least one of the first surface and the second surface to the electrode board; and a conductor layer supported by the support.Type: GrantFiled: March 18, 2015Date of Patent: May 7, 2019Assignee: Sony CorporationInventors: Shogo Shinkai, Hiroto Kawaguchi, Hiroshi Mizuno, Taizo Nishimura, Fumihiko Iida, Kei Tsukamoto, Hayato Hasegawa, Tomoko Katsuhara
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Publication number: 20190107447Abstract: A sensor includes a base layer and a pressing unit protruding with respect to the base layer. The pressing unit includes a first structure unit and a hollow second structure unit disposed on the first structure unit and having a bottom side opened. The second structure unit has a shape portion on a surface facing the base layer.Type: ApplicationFiled: March 21, 2017Publication date: April 11, 2019Inventors: AKIRA EBISUI, HIROSHI MIZUNO, TOMOKO KATSUHARA, TAIZO NISHIMURA, YOSHIAKI SAKAKURA, TOSHIO KANO, TOSHIYUKI ONODERA, TAKESHI TAKAHASHI, TORU TAKAHASHI, TATSUO SUZUKI
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Patent number: 10234959Abstract: An input apparatus includes a conductive layer having flexibility, a capacitance-type sensor layer having a plurality of detection units, and a structure layer having a plurality of structures, a reaction force of which is non-linearly changed with respect to a pressing amount. The structure layer is disposed between the conductive layer and the sensor layer. The two or more structures are disposed in an operation area corresponding to the detection units.Type: GrantFiled: November 4, 2015Date of Patent: March 19, 2019Assignee: SONY CORPORATIONInventors: Hiroto Kawaguchi, Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Hiroshi Mizuno, Yoshiaki Sakakura
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Patent number: 10175782Abstract: An input apparatus includes a conductive layer having flexibility, a plurality of structures, a reaction force of which is non-linearly changed with respect to a pressing amount, a capacitance-type sensor layer, and an intermediate layer disposed between the plurality of structures and the sensor layer. The intermediate layer has a plurality of hole portions into which the plurality of structures is pressed, respectively.Type: GrantFiled: November 4, 2015Date of Patent: January 8, 2019Assignee: SONY CORPORATIONInventors: Tomoko Katsuhara, Hiroto Kawaguchi, Akira Ebisui, Taizo Nishimura, Hiroshi Mizuno, Yoshiaki Sakakura