Patents by Inventor Tak-kyoum Kim

Tak-kyoum Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8835774
    Abstract: According to an aspect of the invention, there is provided a circuit board assembly including a first circuit board including a first circuit pattern formed on a surface of the first circuit board, and an opening that is adjacent to the first circuit pattern; and a second circuit board including a second circuit pattern corresponding to the first circuit pattern and a protection film that is applied to a surface of the second circuit board so as to form a hollow place located corresponding to the opening, wherein the first circuit board and the second circuit board are combined with each other.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: September 16, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-seok Kim, Inh-seok Suh, Tak-kyoum Kim
  • Publication number: 20120305293
    Abstract: According to an aspect of the invention, there is provided a circuit board assembly including a first circuit board including a first circuit pattern formed on a surface of the first circuit board, and an opening that is adjacent to the first circuit pattern; and a second circuit board including a second circuit pattern corresponding to the first circuit pattern and a protection film that is applied to a surface of the second circuit board so as to form a hollow place located corresponding to the opening, wherein the first circuit board and the second circuit board are combined with each other.
    Type: Application
    Filed: October 28, 2011
    Publication date: December 6, 2012
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyun-seok Kim, Inh-seok Suh, Tak-kyoum Kim
  • Publication number: 20110085054
    Abstract: An apparatus and method for reducing power consumption in a digital image processor are disclosed. The apparatus includes a global positioning system (GPS) module using power and configured to generate initial GPS location information of the digital image processor; and a digital signal processor (DSP) configured to receive the initial GPS location information, to set user selected location information for recording in a captured image, and to cut the power to the GPS module. The method includes supplying power to a global positioning system (GPS) module; receiving initial GPS location information of the digital image processor, wherein the initial GPS location is generated by the GPS module; setting a user selected location information to capture an image; and cutting the power to the GPS module.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 14, 2011
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong-kwan Choi, Tak-kyoum Kim