Abstract: A system and method for jitter injection is provided. The system may include a serializer-deserializer (SerDes) circuit. In some examples, the serializer-deserializer (SerDes) circuit have a pre-emphasis circuit and a post emphasis circuit. The system may also include a controller, which may be used to apply specific and varying amounts of pre-emphasis and post-emphasis. The system may also include a jitter injector. In some examples, the jitter injector may be used to inject jitter into the serializer-deserializer (SerDes) circuit based on the applied pre-emphasis and post-emphasis.

Abstract: Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.

Abstract: A dynamically reconfigurable interface for an automatic test equipment is disclosed where one or more synthetic instruments transmit the high speed signals as well as receive the high speed signals from a device under test so that testing can be performed at speeds higher than the ATE was originally designed to accommodate. Synthetic instruments are implemented on a field programmable gate array (FPGA) that operate at higher speeds than COTS instruments and can reach the frequencies that high speed I/O buses use. SIs can be created by configuring the FPGA, with different configurations creating different SIs. A single FPGA can house a number of SIs.

Abstract: A dynamically reconfigurable interface for an automatic test equipment is disclosed where one or more synthetic instruments transmit the high speed signals as well as receive the high speed signals from a device under test so that testing can be performed at speeds higher than the ATE was originally designed to accommodate. Synthetic instruments are implemented on a field programmable gate array (FPGA) that operate at higher speeds than COTS instruments and can reach the frequencies that high speed I/O buses use. SIs can be created by configuring the FPGA, with different configurations creating different SIs. A single FPGA can house a number of SIs.

Abstract: A dynamically reconfigurable interface for an automatic test equipment is disclosed where one or more synthetic instruments transmit the high speed signals as well as receive the high speed signals from a device under test so that testing can be performed at speeds higher than the ATE was originally designed to accommodate. Synthetic instruments are implemented on a field programmable gate array (FPGA) that operate at higher speeds than COTS instruments and can reach the frequencies that high speed I/O buses use. SIs can be created by configuring the FPGA, with different configurations creating different SIs. A single FPGA can house a number of SIs.

Abstract: Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.

Abstract: Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.

Abstract: Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.

Abstract: At least one method, apparatus and system disclosed involves a multi-die integrated circuit device. A first substrate portion having a first height is formed. A first device over the first substrate portion is formed. A second substrate portion having a second height is formed. A second device is formed over the second substrate portion. An interconnect substrate feature is formed above the first and second devices. The interconnect substrate is configured to accommodate a plurality of interconnect lines electrically coupling the first and second devices.