Abstract: Systems and methods of manufacturing compact camera assemblies for use in electronic device are provided. The camera assemblies include an image sensor and a camera component. The camera assemblies further include a molding compound transfer molded onto the image sensor and the camera component to form a camera component subassembly. A redistribution layer is formed on a surface of the camera component subassembly. The redistribution layer includes at least one dielectric layer and a first interconnect layer. The camera assemblies further include a lens module coupled to the redistribution layer and aligned with the image sensor along an optical axis.

Abstract: A stretchable battery and the method of manufacturing the same. The stretchable battery can be manufactured by using a printing process. The construction of the stretchable battery can comprise a first layer of an elastomer film, a first current collector layer, a layer of cathode, a separating layer, a layer of anode, and a second current collector layer. Metal traces can be used to couple with the first and/or the second current collector layers.

Abstract: An imager assembly having a molded package formed using a molded interconnect device (MID) technique having a rim portion protruding from a surface of the molded package is disclosed. A lens may be held by the rim portion protruding from the surface and an image sensor may be disposed on the surface. The molded package may further be mechanically and electrically coupled to an electromechanical device, such as a voice coil motor (VCM). The VCM may be configured to move the lens held by the molded package for the purposes of focusing an image on the image sensor. Additionally, an imager assembly with a sandwich molded package having a first high density interconnect (HDI) layer and a second HDI layer with surface mount devices (SMDs) and molding compound therebetween is disclosed. The imager assembly may further include an image sensor, lens assembly, and VCM disposed on the sandwich molded package.

Abstract: Described herein are manufacturing methods and camera system designs that provide precise alignment between multiple camera modules mounted on a common chassis. The chassis includes a plurality of mounting regions, with each mounting region including one or more mounting posts. Each camera module includes one or more guiding holes into which the mounting posts are inserted. By precisely positioning the guiding holes and the mounting posts, the alignment of the camera modules with the chassis and the other camera modules may be controlled with high precision.

Abstract: Described herein are manufacturing methods and camera system designs that provide precise alignment between multiple camera modules mounted on a common chassis. The chassis includes a plurality of mounting regions, with each mounting region including one or more mounting posts. Each camera module includes one or more guiding holes into which the mounting posts are inserted. By precisely positioning the guiding holes and the mounting posts, the alignment of the camera modules with the chassis and the other camera modules may be controlled with high precision.

Abstract: An imager module having an interposer chip with castellated contacts electrically connected to and routing signals between an image sensor, a printed circuit board (PCB), and a voice coil motor (VCM) is disclosed. The VCM may be electrically coupled to the interposer chip via the castellated contacts. The castellated contacts may be formed by fabricating annular through silicon vias (TSVs) and then sawing through those annular TSVs. In some example embodiments, one or more surface mount devices (SMDs) may further be attached to the interposer chip with castellated contacts. The interposer chip may further have a cavity therein within which the image sensor may be attached.

Abstract: An imager assembly having a molded package formed using a molded interconnect device (MID) technique having a rim portion protruding from a surface of the molded package is disclosed. A lens may be held by the rim portion protruding from the surface and an image sensor may be disposed on the surface. The molded package may further be mechanically and electrically coupled to an electromechanical device, such as a voice coil motor (VCM). The VCM may be configured to move the lens held by the molded package for the purposes of focusing an image on the image sensor. Additionally, an imager assembly with a sandwich molded package having a first high density interconnect (HDI) layer and a second HDI layer with surface mount devices (SMDs) and molding compound therebetween is disclosed. The imager assembly may further include an image sensor, lens assembly, and VCM disposed on the sandwich molded package.

Abstract: Various approaches discussed herein enable techniques for protecting die units made of silicon substrate. A substrate, or wafer, is provided that has multiple die units built onto it, as well as saw streets between the die units. The substrate is cut into along the saw streets at a first width, after which a coating is applied to a side of the wafer so that the side of the wafer is covered with the coating as well as the channels created by the cutting being substantially filled with the coating. After curing the coating, a second cut is made along the saw streets and through the cured coating, so that the individual die units, once separated, have a protective layer of the coating attached to one side and the periphery of the die unit.

Abstract: A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.

Abstract: A manufacturing technique includes creating stud bumps on the electrical contacts on a die, either in wafer or die form. A separate stencil or carrier is provided with cavities that correspond to the electrical contacts on the die. The cavities are filled with solder paste and the die is brought into close proximity with the stencil so that the stud bumps extend into the cavities and come into contact with the solder paste. When the die is removed, the solder paste stays affixed to the stud bumps and thereby the solder paste is transferred and delivered to the stud bumps. The die can then be affixed to a substrate such as a PCB.