Patents by Inventor Tak Wai Rick LAW

Tak Wai Rick LAW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS FOR MAINTAINING A CLEAN BONDING ENVIROMENT
    Publication number: 20090056761
    Abstract: A bonding apparatus for bonding materials onto a substrate supported on a substrate support is provided with an air generator that is arranged and configured to direct an air flow onto the substrate during bonding. The air generator is located on one side of the substrate support, whereas a suction device is located on an opposite side of the substrate support which is operative to draw the air flow away from the bonding apparatus. The air generator further comprises an air knife that is operative to generate a unidirectional air flow over an entire length of the substrate during bonding.
    Type: Application
    Filed: August 28, 2007
    Publication date: March 5, 2009
    Inventors: Po Lam Benny AU, Jonathan Charles MASTERS, Wing Chiu Derek LAI, Tak Wai Rick LAW, Ming Lok Benjamin YEUNG, Kei Him Davy LAU