Abstract: A method for verifying the integrity of the electrical connection between at least one signal path of a substrate and at least one respective contact of a component mounted on the substrate is disclosed. The method includes generating a step signal on one of the at least one signal path connected to a respective contact, and capturing a capacitively coupled signal due to the step signal at the contact. The method further includes determining the integrity of the electrical connection from a characteristic of the capacitively coupled signal or a response signal obtained from the capacitively coupled signal. A tester in which the method is implemented is also disclosed.

Abstract: A method for verifying the integrity of the electrical connection between at least one signal path of a substrate and at least one respective contact of a component mounted on the substrate is disclosed. The method includes generating a step signal on one of the at least one signal path connected to a respective contact, and capturing a capacitively coupled signal due to the step signal at the contact. The method further includes determining the integrity of the electrical connection from a characteristic of the capacitively coupled signal or a response signal obtained from the capacitively coupled signal. A tester in which the method is implemented is also disclosed.

Abstract: A method and apparatus is presented for gaining socket testability through the use of a capacitive interposer engineered to create capacitive coupling between signal nodes of a circuit assembly that the tester has access to and nodes of the socket that would not otherwise have any coupling to a testable signal node of the socket. Generally, coupling capacitance is engineered into the interposer by trace and via routing between the signal node of the socket and a location in close proximity to the inaccessible socket node such that their proximity to each other couples them together.