Patents by Inventor Taka Irie

Taka Irie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless ceramic package with improved solderabilty
    Patent number: 5314606
    Abstract: A method of fabricating a leadless ceramic package having improved solderability characteristics. The ceramic packages are singulated from the package array before electroplating. This eliminates the damage which may occur to the plating layer during singulation, and permits plating of base metal exposed by singulation. Furthermore, the plating solution is not required to penetrate small-diameter castellation holes, which would often result in incomplete electroplating of the castellation surfaces.
    Type: Grant
    Filed: February 16, 1993
    Date of Patent: May 24, 1994
    Assignee: Kyocera America, Inc.
    Inventors: Taka Irie, Aki Nomura