Patents by Inventor Takaaki Domon

Takaaki Domon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9627737
    Abstract: A high-frequency transmission line in which the alternating-current resistance is low is provided. A high-frequency transmission line 2 is a high-frequency transmission line 2 to transmit an alternating-current electric signal, and contains metal and carbon nanotube, and the carbon nanotube is unevenly distributed at a peripheral part 8 of a cross-section that is of the high-frequency transmission line 2 and that is perpendicular to a transmission direction of the alternating-current electric signal.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: April 18, 2017
    Assignee: TDK CORPORATION
    Inventors: Makoto Yoshida, Kenichi Yoshida, Tohru Inoue, Takaaki Domon, Takashi Ota, Katsunori Osanai
  • Patent number: 9620840
    Abstract: A high-frequency transmission line in which the alternating-current resistance is low and that is hard to disconnect is provided. A high-frequency transmission line 2 is a high-frequency transmission line 2 to transmit an alternating-current electric signal, and contains metal and carbon nanotube, and the carbon nanotube is unevenly distributed at a central part 6 of a cross-section that is of the high-frequency transmission line 2 and that is perpendicular to a transmission direction of the alternating-current electric signal.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: April 11, 2017
    Assignee: TDK CORPORATION
    Inventors: Makoto Yoshida, Kenichi Yoshida, Tohru Inoue, Takaaki Domon, Takashi Ota, Katsunori Osanai
  • Publication number: 20150380796
    Abstract: A high-frequency transmission line in which the alternating-current resistance is low is provided. A high-frequency transmission line 2 is a high-frequency transmission line 2 to transmit an alternating-current electric signal, and contains metal and carbon nanotube, and the carbon nanotube is unevenly distributed at a peripheral part 8 of a cross-section that is of the high-frequency transmission line 2 and that is perpendicular to a transmission direction of the alternating-current electric signal.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Makoto YOSHIDA, Kenichi YOSHIDA, Tohru INOUE, Takaaki DOMON, Takashi OTA, Katsunori OSANAI
  • Publication number: 20150380797
    Abstract: A high-frequency transmission line in which the alternating-current resistance is low and that is hard to disconnect is provided. A high-frequency transmission line 2 is a high-frequency transmission line 2 to transmit an alternating-current electric signal, and contains metal and carbon nanotube, and the carbon nanotube is unevenly distributed at a central part 6 of a cross-section that is of the high-frequency transmission line 2 and that is perpendicular to a transmission direction of the alternating-current electric signal.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Makoto YOSHIDA, Kenichi YOSHIDA, Tohru INOUE, Takaaki DOMON, Takashi OTA, Katsunori OSANAI
  • Patent number: 8064211
    Abstract: An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed borders in the mounting surface, and a terminal electrode is provided at the bottom part of the concavities. Since the passive component has a concavity within the mounting surface and the terminal electrode is incorporated within this concavity, the passive component can be mounted low on the substrate surface. Since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like at the periphery of the inductor, thus increasing the mounting density of the passive component. There is increased freedom for mounting the passive component because the passive component is mounted on the built-in IC substrate in which the IC is embedded in the substrate.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: November 22, 2011
    Assignee: TDK Corporation
    Inventors: Hirotada Furukawa, Toshiaki Kikuchi, Yutaka Sato, Takaaki Domon, Yoshio Kaita
  • Patent number: 7974043
    Abstract: A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate; the slider has a slider substrate and a magnetic head portion disposed on a side surface of the slider substrate; the magnetic head portion has a magnetic recording element for generating a magnetic field, first and second waveguides, for receiving light through an end face and guiding the light to the medium-facing surface, and a near-field light generator disposed on an end face; the light source support substrate is fixed to a surface of the slider substrate so that light emitted from the light source can enter the end face of the first waveguide.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: July 5, 2011
    Assignee: TDK Corporation
    Inventors: Koji Shimazawa, Kosuke Tanaka, Takaaki Domon
  • Patent number: 7957085
    Abstract: A thermally assisted magnetic head has a slider substrate having a first surface located on the opposite side to a medium-facing surface, and side surfaces located between the medium-facing surface and the first surface; a magnetic head portion having a waveguide having a light exit face on the medium-facing surface side, and a magnetic recording element disposed in proximity to the light exit face, the magnetic head portion being fixed to one of the side surfaces of the slider substrate; a light source support substrate having a second surface facing the first surface; a light emitting element facing a light entrance face of the waveguide and fixed to the light source support substrate; and an adhesive interposed between the first surface and the second surface; at least one of the first surface and the second surface has a recess and the adhesive is disposed in the recess.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: June 7, 2011
    Assignee: TDK Corporation
    Inventors: Kosuke Tanaka, Koji Shimazawa, Takaaki Domon
  • Patent number: 7940486
    Abstract: A laser diode is fixed to a light source support substrate and a first surface of a slider substrate is fixed to a second surface of the light source support substrate; therefore, the slider substrate and the laser diode are kept in a fixed positional relation. Since the laser diode faces a light entrance face of a core, long-distance propagation of light as in the conventional technology does not occur, and light emitted from a light emitting element is guided well to a medium-facing surface while permitting some mounting error and coupling loss of light. A spot size w of a light intensity distribution along the X-axis in the XY plane including an incident-light centroid position on the light entrance face is set larger than a thickness of the core, whereby variation in incidence efficiency is well suppressed against positional deviation.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: May 10, 2011
    Assignee: TDK Corporation
    Inventors: Koji Shimazawa, Kosuke Tanaka, Takaaki Domon
  • Patent number: 7804655
    Abstract: A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate. The slider has a slider substrate and a magnetic head portion disposed on a side of the medium-facing surface in the slider substrate; the magnetic head portion includes a magnetic recording element for generating a magnetic field, and a waveguide for receiving light through an end face opposite to the medium-facing surface, and guiding the light to the medium-facing surface; the light source support substrate is fixed to a surface opposite to the medium-facing surface in the slider substrate so that light emitted from the light source can enter the end face of the waveguide.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: September 28, 2010
    Assignee: TDK Corporation
    Inventors: Koji Shimazawa, Kosuke Tanaka, Takaaki Domon
  • Publication number: 20090254213
    Abstract: The present invention provides a mounting device for a chip component, allowing short operating time for mounting a chip component after cutting, and capable of reliably mounting only an undamaged, non-defective chip component. The mounting device comprises carriers 10, 16 and 24, which transport a chip component 6a, peeled from a holding sheet 4 for holding cut individual chip components 6a, to a mounting substrate 20, and mount the chip component 6a thereon. The carriers 16 and 24 are provided with measuring terminals 18 and 26 for measuring electric properties of the chip component 6a during transporting. A control circuit is provided with the mounting device for controlling the carriers 16 and 24 so as to mount the chip component 6a on the mounting substrate 20 only when a measurement of the chip component 6a determined through measuring terminals 18 and 26 satisfies mountable conditions.
    Type: Application
    Filed: February 13, 2009
    Publication date: October 8, 2009
    Applicant: TDK CORPORATION
    Inventors: Takaaki Domon, Toshiyuki Nagatsuka, Toyotaka Kobayashi, Yushi Ogasawara
  • Publication number: 20080192376
    Abstract: A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate; the slider has a slider substrate and a magnetic head portion disposed on a side of the medium-facing surface in the slider substrate; the magnetic head portion includes a magnetic recording element and a waveguide for receiving light through an end face opposite to the medium-facing surface, and guiding the light to the medium-facing surface; the light source support substrate is laid on a back surface opposite to the medium-facing surface in the slider substrate so that light emitted from the light source can enter the end face of the waveguide; a non-overlap portion not overlapping with the light source support substrate is formed in the back surface of the slider substrate.
    Type: Application
    Filed: August 29, 2007
    Publication date: August 14, 2008
    Applicant: TDK CORPORATION
    Inventors: Kosuke Tanaka, Koji Shimazawa, Takaaki Domon
  • Publication number: 20080055784
    Abstract: A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate; the slider has a slider substrate and a magnetic head portion disposed on a side surface of the slider substrate; the magnetic head portion has a magnetic recording element for generating a magnetic field, first and second waveguides, for receiving light through an end face and guiding the light to the medium-facing surface, and a near-field light generator disposed on an end face; the light source support substrate is fixed to a surface of the slider substrate so that light emitted from the light source can enter the end face of the first waveguide.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 6, 2008
    Applicant: TDK CORPORATION
    Inventors: Koji Shimazawa, Kosuke Tanaka, Takaaki Domon
  • Publication number: 20080055762
    Abstract: A laser diode is fixed to a light source support substrate and a first surface of a slider substrate is fixed to a second surface of the light source support substrate; therefore, the slider substrate and the laser diode are kept in a fixed positional relation Since the laser diode faces a light entrance face of a core, long-distance propagation of light as in the conventional technology does not occur, and light emitted from, a light emitting element is guided well to a medium-facing surface, while permitting some mounting error and coupling loss of light A spot size w of a light intensity distribution along the X-axis in the XY plane including an incident-light centroid position on the light entrance face is set larger than a thickness of the core, whereby variation in incidence efficiency is well suppressed against positional deviation.
    Type: Application
    Filed: August 28, 2007
    Publication date: March 6, 2008
    Applicant: TDK CORPORATION
    Inventors: Koji Shimazawa, Kosuke Tanaka, Takaaki Domon
  • Publication number: 20080055859
    Abstract: An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed borders in the mounting surface, and a terminal electrode is provided at the bottom part of the concavities. Since the passive component has a concavity within the mounting surface and the terminal electrode is incorporated within this concavity, the passive component can be mounted low on the substrate surface. Since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like at the periphery of the inductor, thus increasing the mounting density of the passive component. There is increased freedom for mounting the passive component because the passive component is mounted on the built-in IC substrate in which the IC is embedded in the substrate.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 6, 2008
    Applicant: TDK CORPORATION
    Inventors: Hirotada Furukawa, Toshiaki Kikuchi, Yutaka Sato, Takaaki Domon, Yoshio Kaita
  • Publication number: 20080055763
    Abstract: A thermally assisted magnetic head has a slider substrate having a first surface located on the opposite side to a medium-facing surface, and side surfaces located between the medium-facing surface and the first surface; a magnetic head portion having a waveguide having a light exit face on the medium-facing surface side, and a magnetic recording element disposed in proximity to the light exit face, the magnetic head portion being fixed to one of the side surfaces of the slider substrate; a light source support substrate having a second surface facing the first surface; a light emitting element facing a light entrance face of the waveguide and fixed to the light source support substrate; and an adhesive interposed between the first surface and the second surface; at least one of the first surface and the second surface has a recess and the adhesive is disposed in the recess.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 6, 2008
    Applicant: TDK CORPORATION
    Inventors: Kosuke Tanaka, Koji Shimazawa, Takaaki Domon
  • Publication number: 20080043360
    Abstract: A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate. The slider has a slider substrate and a magnetic head portion disposed on a side of the medium-facing surface in the slider substrate; the magnetic head portion includes a magnetic recording element for generating a magnetic field, and a waveguide for receiving light through an end face opposite to the medium-facing surface, and guiding the light to the medium-facing surface; the light source support substrate is fixed to a surface opposite to the medium-facing surface in the slider substrate so that light emitted from the light source can enter the end face of the waveguide.
    Type: Application
    Filed: August 16, 2007
    Publication date: February 21, 2008
    Applicant: TDK CORPORATION
    Inventors: Koji Shimazawa, Kosuke Tanaka, Takaaki Domon
  • Patent number: 7125788
    Abstract: A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: October 24, 2006
    Assignee: TDK Corporation
    Inventors: Takaaki Domon, Toshiyuki Nagatsuka, Tsutomu Yasui, Ryoichi Kondo
  • Publication number: 20050224972
    Abstract: A circuit device comprises at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed is consisted of the same material and also the same thickness as the under bump metal.
    Type: Application
    Filed: March 4, 2005
    Publication date: October 13, 2005
    Applicant: TDK Corporation
    Inventors: Takaaki Domon, Toshiyuki Nagatsuka, Tsutomu Yasui, Ryoichi Kondo