Patents by Inventor Takaaki Funakoshi

Takaaki Funakoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CAMERA MODULE AND METHOD OF MANUFACTURING CAMERA MODULE
    Publication number: 20250024129
    Abstract: A camera module includes a substrate; an image sensor including a light-receiving unit and mounted to a top face of the substrate; a lens holder mounted to the top face of the substrate so as to cover the image sensor; and a lens held by the lens holder, wherein an inner circumferential surface of the lens holder and an outer circumferential surface of the image sensor have such a positional relationship that an offset in an in-plane direction of the substrate between a center line of the image sensor and an optical axis of the lens is smaller than or equal to a tolerable error.
    Type: Application
    Filed: July 10, 2024
    Publication date: January 16, 2025
    Inventors: TAKAMIZU SASAKI, KAZUHIRO MORIMOTO, KEIICHIRO ICHIBA, KEIICHI SAWAI, TAKAAKI FUNAKOSHI
  • Semiconductor device
    Patent number: 8664765
    Abstract: A semiconductor device includes a substrate, an insulating substrate mounted on the substrate, a metal pattern formed on the insulating substrate, an electronic part mounted on the metal pattern across a bond, and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern and around the electronic part.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: March 4, 2014
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Kazunaga Onishi, Yoshikazu Takamiya, Takaaki Funakoshi, Yoshihiro Kodaira
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20130020725
    Abstract: A semiconductor device includes a substrate, an insulating substrate mounted on the substrate, a metal pattern formed on the insulating substrate, an electronic part mounted on the metal pattern across a bond, and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern and around the electronic part.
    Type: Application
    Filed: September 8, 2011
    Publication date: January 24, 2013
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Kazunaga Onishi, Yoshikazu Takamiya, Takaaki Funakoshi, Yoshihiro Kodaira