Patents by Inventor Takaaki Hayashi

Takaaki Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11147796
    Abstract: It is to provide an agent for preventing or improving hearing loss, which comprises a low molecular compound which can be produced relatively easily and inexpensively as an active ingredient. One or more compounds selected from the group consisting of compounds represented by the following formulas (I0), (II), and (III) and a pharmaceutically acceptable salt of the compounds when R3 is OH are used as an agent for preventing or improving hearing loss.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 19, 2021
    Assignees: TOHOKU UNIVERSITY, KAKE EDUCATIONAL INSTITUTION
    Inventors: Takaaki Abe, Yukio Katori, Yohei Honkura, Fumika Nanto, Kenichiro Hayashi
  • Publication number: 20210178698
    Abstract: A measuring section of a stereolithography device measures a temperature of a photocurable resin liquid by a temperature sensor. A setting section sets an integrated light amount on the basis of temperature information obtained from a measured temperature and curing information stored in a storage section. An illuminating section controls a projector such that light, by which the set integrated light amount is obtained, is illuminated onto the photocurable resin liquid. Due thereto, light, which is such that there becomes an integrated light amount corresponding to the temperature of the photocurable resin liquid, is illuminated onto the photocurable resin liquid, and therefore, a molded object can be molded with high accuracy.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 17, 2021
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Toshikazu SAKAMAKI, Hirohisa SHIODE, Takaaki HAYASHI
  • Publication number: 20210096516
    Abstract: The purpose of the present invention is to provide, in a power conversion device which is ready for functional safety, a function of improving safety of a system by making a dynamical setting for a safety function operation at a time of detecting an abnormality in a system operation or a diagnosis error in accordance with a condition of the system at a time of the abnormality. To achieve the purpose described above, a power conversion system includes a power conversion device main body configured to drive a motor and a safety function unit configured to execute a safety function. The safety function unit outputs a safety function operation instruction signal when receiving a safety request signal, and the power conversion device main body controls the motor by the safety function operation instruction signal.
    Type: Application
    Filed: December 14, 2018
    Publication date: April 1, 2021
    Inventors: Takaaki HAYASHI, Yusuke ARAO
  • Publication number: 20200377637
    Abstract: A curable composition for stereolithography, comprising a photopolymerizable component and a photopolymerization initiator, wherein a cured product of the curable composition has a minimum value of a storage elastic modulus, in a range of from 25° C. to 300° C., of not greater than 1.20×107 Pa.
    Type: Application
    Filed: March 28, 2019
    Publication date: December 3, 2020
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Takaaki HAYASHI, Toshikazu SAKAMAKI
  • Publication number: 20170209345
    Abstract: An object of the present invention is to provide a dental material, particularly, a dental prosthesis, having excellent properties such as hydrophilicity and antifouling properties. The dental prosthesis according to the present invention includes a monolayer film obtained by curing a composition including: a compound (I) having at least one hydrophilic group selected from anionic hydrophilic groups and cationic hydrophilic groups, and at least one functional group with a polymerizable carbon-carbon double bond; a compound (II) having two or more functional groups with a polymerizable carbon-carbon double bond (wherein the compound (II) has no anionic hydrophilic group nor cationic hydrophilic group); and a surfactant (III) having a hydrophilic moiety including an anionic hydrophilic group, a cationic hydrophilic group or two or more hydroxyl groups, and a hydrophobic moiety composed of an organic residue (wherein the surfactant has no polymerizable carbon-carbon double bond).
    Type: Application
    Filed: July 8, 2015
    Publication date: July 27, 2017
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Akira HASEGAWA, Yasufumi TSUCHIYA, Koya KOJIMA, Koju OKAZAKI, Yohsuke ASANO, Kenichi FUJII, Takaaki HAYASHI
  • Patent number: 8432382
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: April 30, 2013
    Assignee: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Patent number: 8324916
    Abstract: An electro-optical device includes a substrate, a plurality of unit circuits that includes a plurality of scanning lines, a plurality of data lines and electro-optical elements provided corresponding to intersecting regions of the scanning lines and the data lines and is formed in a display region of the substrate, a plurality of pixel circuits that includes electro-optical elements and is formed in the display region and a sealing member that seals the electro-optical elements of the plurality of pixel circuits formed in the display region and is attached to the substrate, wherein a test circuit is formed between an attaching region at which the sealing member is attach to the substrate and the display region.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: December 4, 2012
    Assignee: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Publication number: 20110254555
    Abstract: An electro-optical device includes a substrate, a plurality of unit circuits that includes a plurality of scanning lines, a plurality of data lines and electro-optical elements provided corresponding to intersecting regions of the scanning lines and the data lines and is formed in a display region of the substrate, a plurality of pixel circuits that includes electro-optical elements and is formed in the display region and a sealing member that seals the electro-optical elements of the plurality of pixel circuits formed in the display region and is attached to the substrate, wherein a test circuit is formed between an attaching region at which the sealing member is attach to the substrate and the display region.
    Type: Application
    Filed: June 29, 2011
    Publication date: October 20, 2011
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Takaaki HAYASHI
  • Patent number: 8013534
    Abstract: An electro-optic device includes a substrate on which a plurality of electro-optic elements are configured, a plurality of IC chips that drive the electro-optic elements, and a plurality of wiring patterns. Each of the IC chips includes a first power terminal and a second power terminal connected to each other in the IC chip, a third power terminal sandwiching the first power terminal with the second power terminal and placed on a first side opposite to the second power terminal, and a fourth power terminal sandwiching the second power terminal with the first power terminal and placed on a second side opposite to the first power terminal.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: September 6, 2011
    Assignee: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Patent number: 7994810
    Abstract: An electro-optical device includes a substrate, a plurality of unit circuits that includes a plurality of scanning lines, a plurality of data lines and electro-optical elements provided corresponding to intersecting regions of the scanning lines and the data lines and is formed in a display region of the substrate, a plurality of pixel circuits that includes electro-optical elements and is formed in the display region and a sealing member that seals the electro-optical elements of the plurality of pixel circuits formed in the display region and is attached to the substrate, wherein a test circuit is formed between an attaching region at which the sealing member is attach to the substrate and the display region.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: August 9, 2011
    Assignee: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Publication number: 20110156599
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Application
    Filed: March 8, 2011
    Publication date: June 30, 2011
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Takaaki HAYASHI
  • Patent number: 7924275
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: April 12, 2011
    Assignee: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Publication number: 20080122389
    Abstract: An electro-optic device includes a substrate on which a plurality of electro-optic elements are configured, a plurality of IC chips that drive the electro-optic elements, and a plurality of wiring patterns. Each of the IC chips includes a first power terminal and a second power terminal connected to each other in the IC chip, a third power terminal sandwiching the first power terminal with the second power terminal and placed on a first side opposite to the second power terminal, and a fourth power terminal sandwiching the second power terminal with the first power terminal and placed on a second side opposite to the first power terminal.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 29, 2008
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Takaaki HAYASHI
  • Publication number: 20080106209
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Application
    Filed: December 10, 2007
    Publication date: May 8, 2008
    Applicant: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Patent number: 7327090
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: February 5, 2008
    Assignee: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Publication number: 20070077001
    Abstract: An electro-optical module is provided. The electro-optical module includes an electro-optical panel provided with a light-emitting unit where a plurality of light-emitting devices are arrayed in a line shape, two wiring boards which interpose the electro-optical panel and are disposed in a direct parallel to a longitudinal direction of the electro-optical panel, a plurality of flexible boards which connect the electro-optical panel to the wiring boards, and a driving circuit which is disposed in the electro-optical panel or on the flexible boards and drives the light-emitting devices.
    Type: Application
    Filed: August 15, 2006
    Publication date: April 5, 2007
    Applicant: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Publication number: 20060195736
    Abstract: An electro-optical device includes a substrate, a plurality of unit circuits that includes a plurality of scanning lines, a plurality of data lines and electro-optical elements provided corresponding to intersecting regions of the scanning lines and the data lines and is formed in a display region of the substrate, a plurality of pixel circuits that includes electro-optical elements and is formed in the display region and a sealing member that seals the electro-optical elements of the plurality of pixel circuits formed in the display region and is attached to the substrate, wherein a test circuit is formed between an attaching region at which the sealing member is attach to the substrate and the display region.
    Type: Application
    Filed: February 13, 2006
    Publication date: August 31, 2006
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Takaaki Hayashi
  • Publication number: 20060180937
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Application
    Filed: August 16, 2005
    Publication date: August 17, 2006
    Applicant: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Patent number: 6946802
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: September 20, 2005
    Assignee: Seiko Epson Corporation
    Inventor: Takaaki Hayashi
  • Publication number: 20040084740
    Abstract: An electronic module includes an EL section; a first substrate on which the EL section is formed; a second substrate attached to the first substrate; an integrated circuit chip mounted on the second substrate; a plurality of first power supply interconnects formed on the first substrate, extending through a pair of regions located on both sides of the EL section; and a plurality of second power supply interconnects formed on the second substrate, extending through a pair of regions located on both sides of the integrated circuit chip.
    Type: Application
    Filed: August 28, 2003
    Publication date: May 6, 2004
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Takaaki Hayashi